Method of fabricating non-volatile semiconductor memory device by using plasma film-forming method and plasma nitridation
View Patent ↗A technique capable of improving the memory retention characteristics of a non-volatile memory is provided. In particular, a technique of fabricating a non-volatile semiconductor memory device is provided capable of enhancing the film quality of a silicon oxide film even when a silicon oxide film as a first potential barrier film is formed with a plasma oxidation method to improve the memory retention characteristics of the non-volatile memory. After a silicon oxide film, which is a main component of a first potential barrier film, is formed with a plasma oxidation method, plasma nitridation at a high temperature and a heat treatment in an atmosphere containing nitric oxide are performed in combination, thereby forming a silicon oxynitride film on the surface of the silicon oxide film, and segregating nitrogen to an interface between the silicon oxide film and a semiconductor substrate.
1. A method of fabricating a non-volatile semiconductor memory device, the method comprising the steps of:
(a) forming a first silicon oxide film on a semiconductor substrate through a plasma film-forming method using a first source gas containing nitrogen and oxygen, and a second source gas containing silicon;
(b) after the step (a), introducing nitrogen atoms onto a surface of the first silicon oxide film through plasma nitridation;
(c) after the step (b), reacting the nitrogen atoms introduced onto the surface of the first silicon oxide film with the first silicon oxide film through a heat treatment of heating the semiconductor substrate in an atmosphere containing nitric oxide gas to form a silicon oxynitride film on the surface of the first silicon oxide film, and to segregate the nitrogen atoms to an interface between the first silicon oxide film and the semiconductor substrate;
(d) after the step (c), forming a first conductive film on the silicon oxynitride film;
(e) after the step (d), forming a second silicon oxide film on the first conductive film;
(f) after the step (e), forming a second conductive film on the second silicon oxide film;
(g) after the step (f), sequentially patterning the second conductive film, the second silicon oxide film, the first conductive film, the silicon oxynitride film, and the first silicon oxide film to form a gate electrode formed of the second conductive film, a second potential barrier film formed of the second silicon oxide film, a charge storage film formed of the first conductive film, and a first potential barrier film formed of the silicon oxynitride film and the first silicon oxide film; and
(h) after the step (g), forming a source region and a drain region aligned with the gate electrode in the semiconductor substrate.
2. The method of fabricating the non-volatile semiconductor memory device according to claim 1 , wherein
the plasma nitridation is performed with setting the semiconductor substrate at a temperature higher than or equal to 750° C.
3. The method of fabricating the non-volatile semiconductor memory device according to claim 1 , wherein,
in the heat treatment of heating the semiconductor substrate in the atmosphere containing nitric oxide gas, the semiconductor substrate is heated at a temperature higher than or equal to 950° C. and lower than or equal to 1050° C.
4. The method of fabricating the non-volatile semiconductor memory device according to claim 1 , wherein the first source gas comprises nitric oxide.
5. A method of fabricating a non-volatile semiconductor memory device, the method comprising the steps of:
(a) forming a first silicon oxide film on a semiconductor substrate through a plasma film-forming method using a first source gas containing nitrogen and oxygen, and a second source gas containing silicon;
(b) after the step (a), introducing nitrogen atoms onto a surface of the first silicon oxide film through plasma nitridation;
(c) after the step (b), reacting the nitrogen atoms introduced onto the surface of the first silicon oxide film with the first silicon oxide film through a heat treatment of heating the semiconductor substrate in an atmosphere containing nitric oxide gas to form a silicon oxynitride film on the surface of the first silicon oxide film, and to segregate the nitrogen atoms to an interface between the first silicon oxide film and the semiconductor substrate;
(d) after the step (c), forming a silicon nitride film on the silicon oxynitride film;
(e) after the step (d), forming a second silicon oxide film on the silicon nitride film;
(f) after the step (e), forming a conductive film on the second silicon oxide film;
(g) after the step (f), sequentially patterning the conductive film, the second silicon oxide film, the silicon nitride film, the silicon oxynitride film, and the first silicon oxide film to form a gate electrode formed of the conductive film, a second potential barrier film formed of the second silicon oxide film, a charge storage film formed of the silicon nitride film, and a first potential barrier film formed of the silicon oxynitride film and the first silicon oxide film; and
(h) after the step (g), forming a source region and a drain region aligned with the gate electrode in the semiconductor substrate.
6. The method of fabricating the non-volatile semiconductor memory device according to claim 5 , wherein
the plasma nitridation is performed with setting the semiconductor substrate at a temperature higher than or equal to 750° C.
7. The method of fabricating the non-volatile semiconductor memory device according to claim 5 , wherein,
in the heat treatment of heating the semiconductor substrate in the atmosphere containing nitric oxide gas, the semiconductor substrate is heated at a temperature higher than or equal to 950° C. and lower than or equal to 1050° C.
8. The method of fabricating the non-volatile semiconductor memory device according to claim 5 , wherein the first source gas comprises nitric oxide.
9. A method of fabricating a non-volatile semiconductor memory device, the method comprising the steps of:
(a) forming a first silicon oxide film on a semiconductor substrate through a plasma chemical vapor deposition (CVD) method using a first source gas containing nitrogen and oxygen, and a second source gas containing silicon;
(b) after the step (a), introducing nitrogen atoms onto a surface of the first silicon oxide film through plasma nitridation;
(c) after the step (b), reacting the nitrogen atoms introduced onto the surface of the first silicon oxide film with the first silicon oxide film through a heat treatment of heating the semiconductor substrate in an atmosphere containing nitric oxide gas to form a silicon oxynitride film on the surface of the first silicon oxide film, and to segregate the nitrogen atoms to an interface between the first silicon oxide film and the semiconductor substrate;
(d) after the step (c), forming a first conductive film on the silicon oxynitride film;
(e) after the step (d), forming a second silicon oxide film on the first conductive film;
(f) after the step (e), forming a second conductive film on the second silicon oxide film;
(g) after the step (f), sequentially patterning the second conductive film, the second silicon oxide film, the first conductive film, the silicon oxynitride film, and the first silicon oxide film to form a gate electrode formed of the second conductive film, a second potential barrier film formed of the second silicon oxide film, a charge storage film formed of the first conductive film, and a first potential barrier film formed of the silicon oxynitride film and the first silicon oxide film; and
(h) after the step (g), forming a source region and a drain region aligned with the gate electrode in the semiconductor substrate.
10. The method of fabricating the non-volatile semiconductor memory device according to claim 9 , wherein the first source gas comprises nitric oxide.