Method for releasing a microelectronic assembly from a carrier substrate
View Patent ↗Methods for forming a microelectronic assembly ( 82 ) are provided. In one embodiment, the method includes providing a device substrate ( 50 ) having a plurality of electronic components ( 42 ) coupled thereto, and providing a carrier substrate ( 54 ) having first and second opposing surfaces ( 60, 62 ) and including a plurality of openings ( 58 ) extending between the first and second opposing surfaces ( 60, 62 ) and a plurality of depressions ( 64 ) formed on the first opposing surface ( 60 ). The method further includes attaching the device substrate ( 50 ) to the first opposing surface ( 60 ) of the carrier substrate ( 54 ) using an adhesive material ( 56 ) such that at least some of the adhesive material ( 56 ) is adjacent to at least some of the plurality of depressions ( 64 ), and removing the device substrate ( 50 ) from the carrier substrate ( 54 ).
1. A method for forming a microelectronic assembly comprising:
providing a device substrate having a plurality of electronic components coupled thereto;
providing a carrier substrate having first and second opposing surfaces and comprising a plurality of openings extending between the first and second opposing surfaces and a plurality of depressions formed on the first opposing surface;
attaching the device substrate to the first opposing surface of the carrier substrate using an adhesive material such that at least some of the adhesive material is adjacent to at least some of the plurality of depressions; and
removing the device substrate from the carrier substrate.
2. The method of claim 1 , wherein the adhesive material is a solvent soluble adhesive and the removing of the device substrate from the carrier substrate comprises exposing the adhesive material to a solvent.
3. The method of claim 2 , wherein each of the plurality of depressions is positioned between at least two of the plurality of openings.
4. The method of claim 3 , wherein a depth of the plurality of depressions is less than a thickness of the adhesive material and less than a thickness of the carrier substrate.
5. The method of claim 4 , further comprising forming a plurality of insulating layers and conductors over the device substrate while the device substrate is attached to the carrier substrate with the adhesive material.
6. The method of claim 5 , wherein each of the plurality of electronic components comprises a microelectronic die having an integrated circuit formed thereon.
7. The method of claim 6 , wherein the device substrate further comprises an encapsulation material and the microelectronic die of the plurality of electronic components are embedded within the encapsulation material.
8. The method of claim 7 , wherein each of the plurality of depressions has a width that is less than a width of the plurality of openings.
9. The method of claim 7 , wherein each of the plurality of depressions has a width and a length, and the length of the plurality of depressions is greater than a width of the plurality of openings.
10. A method for forming microelectronic assemblies comprising:
providing a device substrate having a plurality of electronic components coupled thereto;
providing a carrier substrate having first and second opposing surfaces and comprising a plurality of openings extending between the first and second opposing surfaces and a plurality of depressions formed on the first opposing surface;
attaching the device substrate to the first opposing surface of the carrier substrate using a solvent soluble adhesive such that at least some of the adhesive is adjacent to at least some of the plurality of depressions;
forming a plurality of insulating layers and conductors over the device substrate while the device substrate is attached to the carrier substrate with the solvent soluble adhesive; and
removing the device substrate from the carrier substrate, the removing comprising exposing the solvent soluble adhesive to a solvent, wherein at least some of the solvent passes through the plurality of openings in the carrier substrate.
11. The method of claim 10 , wherein each of the plurality of electronic components comprises a microelectronic die having an integrated circuit formed thereon.
12. The method of claim 11 , wherein the device substrate further comprises an encapsulation material and the microelectronic die of the plurality of electronic components are embedded within the encapsulation material.
13. The method of claim 12 , further comprising separating the device substrate into a plurality of individual packages, each of the individual packages comprising a respective one of the plurality of microelectronic die.
14. The method of claim 10 , wherein each of the plurality of depressions is positioned between at least two of the plurality of openings and a depth of the plurality of depressions is less than a thickness of the adhesive and less than a thickness of the carrier substrate.
15. The method of claim 10 , wherein each of the plurality of depressions has a width that is less than a width of the plurality of openings.
16. The method of claim 10 , wherein each of the plurality of depressions has width and a length, and wherein the length is greater than a width.
17. The method of claim 10 , wherein the first opposing surface of the carrier substrate comprises inner and outer portions.
18. The method of claim 17 , wherein the plurality of depression are on only one of the inner and outer portions of the first opposing surface of the carrier substrate.