Methods for fabricating semiconductor devices having reduced gate-drain capacitance
View Patent ↗Embodiments of a method for fabricating a semiconductor device having a reduced gate-drain capacitance are provided. In one embodiment, the method includes the steps of etching a trench in a semiconductor substrate utilizing an etch mask, widening the trench to define overhanging regions of the etch mask extending partially over the trench, and depositing a gate electrode material into the trench and onto the overhanging regions. The gate electrode material merges between the overhanging regions prior to the filling of the trench to create an empty fissure within the trench. A portion of the semiconductor substrate is removed through the empty fissure to form a void cavity proximate the trench.
1. A method for fabricating a semiconductor device, comprising:
etching a trench in a semiconductor substrate utilizing an etch mask;
widening the trench to define overhanging regions of the etch mask extending partially over the trench;
depositing a gate electrode material into the trench and onto the overhanging regions, the gate electrode material merging between the overhanging regions prior to the filling of the trench to create an empty fissure within the trench; and
removing a portion of the semiconductor substrate through the empty fissure to form a void cavity proximate the trench.
2. A method according to claim 1 wherein the step of widening comprises growing a sacrificial material on the inner surfaces of the semiconductor substrate defining the trench.
3. A method according to claim 2 wherein the step of widening further comprises removing the sacrificial material utilizing, at least in part, an isotropic etching process.
4. A method according to claim 3 further comprising forming a gate dielectric within the trench, the step of forming performed after the step of removing the sacrificial material.
5. A method according to claim 4 wherein the step of forming a gate dielectric comprises growing an oxide on the inner surfaces of the semiconductor substrate defining the trench.
6. A method according to claim 1 wherein the step of removing a portion of the semiconductor substrate comprises forming a sacrificial material in the semiconductor substrate proximate a bottom portion of the trench.
7. A method according to claim 6 wherein the step of forming a sacrificial material comprises:
forming a liner layer over inner surfaces of the semiconductor substrate defining the trench; and
creating an opening in the liner layer through which the semiconductor substrate is exposed.
8. A method according to claim 7 wherein the step of creating an opening comprises anisotropically etching the liner layer to remove a lower portion of the liner layer while generally leaving intact the sidewalls of the liner layer.
9. A method according to claim 8 wherein the step of forming a sacrificial material comprises growing a sacrificial oxide in the region of the semiconductor substrate exposed through the lower opening in the liner layer.
10. A method according to claim 6 further comprising the step of anisotropically etching the gate electrode material to expose the empty fissure through the gate electrode material and to extend the empty fissure to the sacrificial material.
11. A method according to claim 10 wherein the step of removing a portion of the semiconductor substrate further comprises isotropically etching the sacrificial material through the empty fissure to form a void cavity proximate a bottom portion of the trench.
12. A method according to claim 1 further comprising the step of plugging the empty fissure to enclose the void cavity.
13. A method according to claim 12 wherein the step of plugging comprises conformally depositing a plug material over and into the trench.
14. A method for fabricating a semiconductor device, comprising:
providing an etch mask overlying a semiconductor substrate and having an opening therein;
etching the semiconductor substrate through the opening to create a trench having sidewalls generally aligned with the opening;
growing a first sacrificial oxide on the inner surfaces of the semiconductor substrate defining the trench;
removing the first sacrificial oxide to widen the trench and define overhanging regions of the etch mask extending partially over the trench;
depositing a gate electrode material into the trench and onto the overhanging regions, the gate electrode material merging between the overhanging regions prior to the filling of the trench to create an empty fissure within the trench;
removing a portion of the semiconductor substrate through the empty fissure to form a void cavity underlying the trench; and
plugging empty fissure to enclose the void cavity.
15. A method according to claim 14 wherein the step of removing a portion of the semiconductor substrate comprises:
growing a second sacrificial oxide in the semiconductor substrate proximate the bottom of the trench; and
removing the second sacrificial oxide through the empty fissure to form a void cavity proximate a bottom portion of the trench.
16. A method according to claim 14 wherein the step of plugging comprises blanket depositing a dielectric material over and into the empty fissure.
17. A method according to claim 15 wherein the step of forming a second sacrificial oxide comprises:
forming a liner layer over inner surfaces of the semiconductor substrate defining the trench;
anisotropically etching the liner layer to remove a lower portion of the liner layer; and
growing the second sacrificial oxide in the region of the semiconductor substrate exposed through the lower opening in the liner layer.
18. A method according to claim 14 further comprising the step of anisotropically etching the gate electrode material to expose an upper portion the empty fissure through the gate electrode material and to extend the empty fissure to the sacrificial material.