Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation
View Patent ↗Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed.
1. An apparatus comprising:
a package including a die and an encapsulant material formed over the die;
a plurality of first topological features formed proximate to a first corner of an external surface of the encapsulant material and each of the first topological features spans from a first edge of the external surface to a second edge adjacent to the first edge, and the first topological features are configured to resist out-of-plane deformation of the package; and
a plurality of second topological features formed proximate to a second corner of the external surface of the encapsulant material and each of the second topological features spans from the second edge to a third edge, wherein a central section of the second edge is completely free of any grooves and extends between the plurality of first topological features and the plurality of second topological features, wherein a completely grooveless region of the external surface extends from the central section of the second edge to a central section of the first edge and extends between the plurality of the first topological features and the plurality of the second topological features, and wherein the central section of the first edge is completely free of any grooves.
2. The apparatus of claim 1 , wherein the plurality of first topological features comprises a plurality of grooves formed on the external surface of the encapsulant material.
3. The apparatus of claim 2 , wherein the plurality of grooves are formed at substantially 45 degrees from an edge of the external surface.
4. The apparatus of claim 1 , wherein the plurality of first topological features comprises a plurality of grooves formed in a top surface of the encapsulant material.
5. The apparatus of claim 1 , wherein the plurality of first topological features comprises a plurality of recesses formed on the external surface of the encapsulant material.
6. The apparatus of claim 1 , wherein the plurality of first topological features comprises a plurality of recesses aligned at substantially 45 degrees from an edge of the external surface.
7. The apparatus of claim 1 , wherein at least one edge of the external surface is rounded.
8. The apparatus of claim 1 , wherein the plurality of first topological features is further configured to cause in-plane deformation of the package.
9. The apparatus of claim 1 , wherein an entire area of a portion of the external surface located directly between the plurality of first topological features and the plurality of second topological features is free of any recess.
10. The apparatus of claim 1 , wherein the first topological features are grooves that extend along corresponding straight paths extending between the first edge and the second edge.
11. The apparatus of claim 1 , wherein the completely grooveless region extends across most of the external surface of the encapsulant material and to the first edge, the second edge, and the third edge.
12. An apparatus comprising:
a package including a die and an encapsulant material formed over the die, wherein at least one edge of an external surface of the encapsulant material is rounded, wherein a plurality of first recesses extends between a first edge of the external surface and a second edge of the external surface, wherein a plurality of second recesses extends between the second edge of the external surface and a third edge of the external surface, wherein a section of the second edge extending between the plurality of first recesses and the plurality of second recesses is completely free of any recesses, and wherein a grooveless area of the external surface extends from the section of the second edge to a central section of the first edge.
13. The apparatus of claim 12 , wherein at least one of the first recesses is configured to resist out-of-plane deformation of the package.
14. The apparatus of claim 12 , wherein at least one of the first recesses comprises a groove formed on the external surface of the encapsulant material.
15. A method comprising:
forming at least one topological feature on an external surface of an encapsulant material formed over a die of a package, wherein the at least one topological feature includes a plurality of first recesses and a plurality of second recesses positioned along the external surface, each first recess extends between a first edge of the external surface and a second edge of the external surface, wherein each second recess extends between the second edge of the external surface and a third edge of the external surface, a section of the second edge between the plurality of first recesses and the plurality of second recesses is completely free of any recesses, and a completely grooveless region of the external surface extends from the section of the second edge to a central section of the first edge adjacent to the plurality of first recesses; and
providing the package having the at least one topological feature formed on the external surface of the encapsulant material for distribution, sale, or operational use.
16. The method of claim 15 , wherein the forming the at least one topological feature comprises forming the first recesses on the external surface of the encapsulant material.
17. The method of claim 15 , wherein the forming the at least one topological feature comprises laser cutting the escapsulant material to form the plurality of first recesses.
18. The method of claim 15 , further comprising rounding at least one edge of the external surface.
19. A system comprising:
a substrate including a host logic device bus;
a flash memory device including a package physically coupled to the substrate, wherein the package includes at least one die and an encapsulant material formed over the die, wherein at least one first topological feature is formed on an external surface of the encapsulant material and spans from a first edge of the external surface to a second edge adjacent to the first edge to resist out-of-plane deformation of the package, wherein at least one second topological feature is formed on the external surface of the encapsulant material and spans from the second edge of the external surface to a third edge adjacent to the second edge to resist out-of-plane deformation of the package, wherein a completely grooveless region of the external surface extends from a central section of the second edge to a central section of the first edge, the central section of the second edge extends between the at least one first topological feature and the at least one second topological feature, wherein the at least one first topological feature comprises a plurality of first grooves, wherein the at least one second topological feature comprises a plurality of second grooves, and wherein the flash memory device is electrically coupled to the host logic device bus; and
a host logic device physically mounted to the substrate, and electrically coupled with the host logic device bus.
20. The system of claim 19 , wherein the flash memory device comprises phase change memory device.
21. The system of claim 19 , wherein the host logic device comprises a plurality of processor cores.
22. The system of claim 19 , wherein the system is a selected one of a set-top box, a digital recorder, a game console, a personal digital assistant, a mobile phone, a digital media player, or a digital camera.