IP Library Granted Patent US 8,253,207
Granted Patent B2
US 8,253,207 · App. 12/645,942 · Granted Aug 28, 2012

Insulated gate semiconductor device

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Quick Facts
Patent No.
US 8,253,207
App. No.
12/645,942
Granted
Aug 28, 2012
Kind
B2
Abstract

By integrating a diode and a resistor connected in parallel into the same chip as an IGBT and connecting a cathode of the diode to a gate of the IGBT, the value of dv/dt can be limited to a predetermined range inside the chip of the IGBT without a deterioration in turn-on characteristics. Since the chip includes a resistor having such a resistance that a dv/dt breakdown of the IGBT can be prevented, the IGBT can be prevented from being broken by an increase in dv/dt at a site (user site) to which the chip is supplied.

Claims (10)

1. An insulated gate semiconductor device comprising:

a first semiconductor layer of a first general conductivity type;

a second semiconductor layer of a second general conductivity type and provided on the first semiconductor layer;

an active area provided in a surface of the second semiconductor layer, the active area being an area where transistor cells of an insulated gate semiconductor element are disposed;

a diode provided outside the active area on the surface of the second semiconductor layer, the diode having a cathode connected to a gate electrode of the insulated gate semiconductor element and an anode connected to a terminal for connection to a gate drive circuit, the diode being connected to the gate electrode so that a current from the gate drive circuit flows from the anode to cathode of the diode so as to be supplied to the gate electrode; and

a resistor provided outside the active area on the surface of the second semiconductor layer, the resistor being connected to both ends of the diode in parallel with the diode.

2. The insulated gate semiconductor device according to claim 1 , wherein a rate of voltage change during turn-off of the insulated gate semiconductor element is limited to a desired value or less.

3. The insulated gate semiconductor device according to claim 2 , further comprising a gate pad portion connected to the gate electrode, wherein the diode and the resistor are disposed under the gate pad portion.

4. The insulated gate semiconductor device according to claim 3 , further comprising a gate interconnection portion provided outside the active area on the surface of the second semiconductor layer, the gate interconnection portion connecting the gate electrode with the gate pad portion, and another diode provided under the gate interconnection portion.

5. The insulated gate semiconductor device according to any one of claims 1 to 4 , wherein the insulated gate semiconductor element is an IGBT for performing current control for a luminous tube.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME PREVIOUSLY RECORDED AT REEL: 033813 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 21, 2015
From: SYSTEM SOLUTIONS CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034816/0510 →
CHANGE OF NAME Recorded Dec 3, 2014
From: SANYO SEMICONDUCTOR CO., LTD
To: SYSTEM SOLUTIONS CO., LTD.
Reel/Frame 034537/0044 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2014
From: SANYO SEMICONDUCTOR CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033813/0420 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT #12/577882 PREVIOUSLY RECORDED ON REEL 026594 FRAME 0385. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2014
From: SANYO ELECTRIC CO., LTD
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 032836/0342 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2011
From: SANYO ELECTRIC CO., LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 026594/0385 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2010
From: YONEDA, SHUJI; ISHIDA, HIROYASU; OIKAWA, MAKOTO
To: SANYO ELECTRIC CO., LTD.; SANYO SEMICONDUCTOR CO., LTD.
Reel/Frame 023735/0968 →