IP Library Granted Patent US 8,193,572
Granted Patent B2
US 8,193,572 · App. 12/647,250 · Granted Jun 5, 2012

Electronic device including trenches and discontinuous storage elements

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,193,572
App. No.
12/647,250
Granted
Jun 5, 2012
Kind
B2
Abstract

An electronic device can include a substrate including a first trench having a first bottom and a first wall. The electrode device can also include a first gate electrode within the first trench and adjacent to the first wall and overlying the first bottom of the first trench, and a second gate electrode within the first trench and adjacent to the first gate electrode and overlying the first bottom of the first trench. The electronic device can further include discontinuous storage elements including a first set of discontinuous storage elements, wherein the first set of the discontinuous storage elements lies between (i) the first gate electrode or the second gate electrode and (ii) the first bottom of the first trench. Processes of forming and using the electronic device are also described.

Claims (44)

1. An electronic device comprising:

a substrate including a portion that defines a first trench having a first bottom, a first wall, and a second wall opposite the first wall;

a first gate electrode within the first trench and adjacent to the first wall and overlying the first bottom of the first trench;

a second gate electrode within the first trench and adjacent to the first gate electrode and overlying the first bottom of the first trench, wherein the first gate electrode lies between the first wall and the second gate electrode;

a first set of discontinuous storage elements, wherein the first set of discontinuous storage elements lies between (i) the first gate electrode or the second gate electrode and (ii) the first bottom of the first trench;

a third gate electrode within the first trench and adjacent to the second wall and overlying the first bottom of the first trench;

a fourth gate electrode within the first trench and adjacent to the third gate electrode and overlying the first bottom of the first trench, wherein the third gate electrode being between the second wall and the fourth gate electrode;

a second set of discontinuous storage elements, wherein the second set of discontinuous storage elements lies between (i) the third gate electrode or the fourth gate electrode and (ii) the first bottom of the first trench; and

wherein a first memory cell comprises the first gate electrode, the second gate electrode, and the first set of discontinuous storage elements; a second memory cell comprises the third gate electrode, the fourth gate electrode, and the second set of discontinuous storage element; and the second gate electrode being between the first gate electrode and the fourth gate electrode.

2. The electronic device of claim 1 , wherein the second gate electrode is conformal to the first gate electrode.

3. The electronic device of claim 2 , wherein:

the first gate electrode is a select gate electrode;

the second gate electrode is a control gate electrode; and

the first set of the discontinuous storage elements only lies between the second gate electrode and the bottom of the first trench, and substantially no discontinuous storage elements lie between the second gate and the first wall.

4. The electronic device of claim 2 , further comprising a first source/drain region and a second source/drain region, wherein:

the substrate has a primary surface;

the first source/drain region lies within the substrate and adjacent to the primary surface and the first wall of the first trench; and

the second source/drain region lies within the substrate and adjacent to the bottom of the first trench and is spaced apart from the first wall of the first trench.

5. The electronic device of claim 1 , wherein within the first memory cell, substantially all of the first and second gate electrodes lie within the first trench.

6. The electronic device of claim 1 , wherein each of the first gate electrode and the second gate electrode has a shape, which from a cross-sectional view, is a sidewall spacer.

7. The electronic device of claim 1 , further comprising a fifth gate electrode, a sixth gate electrode, and a third set of discontinuous storage elements, wherein: the substrate including another portion that defines a second trench having a second bottom and a second wall; the fifth gate electrode lies within the second trench and adjacent to the second wall and overlying the second bottom of the second trench; the sixth gate electrode lies within the second trench and adjacent to the fifth gate electrode and overlying the second bottom of the second trench; and the third set of the discontinuous storage elements lies between (i) the second bottom of the second trench and (ii) the fifth gate electrode or the sixth gate electrode.

8. The electronic device of claim 7 , further comprising a first source/drain region, a second source/drain region, and a third source/drain region, wherein:

the substrate has a primary surface;

the first source/drain region lies within the substrate and adjacent to the primary surface, the first wall of the first trench, and the second wall of the second trench;

the second source/drain region lies within the substrate and adjacent to the bottom of the first trench and is spaced apart from the first wall of the first trench; and

the third source/drain region lies adjacent to the bottom of the second trench and is spaced apart from the second wall of the second trench.

9. An electronic device comprising: a substrate including a portion that defines a first trench having a bottom, a first wall, and a second wall opposite the first wall; a first gate electrode within the first trench and adjacent to the first wall and overlying the bottom of the first trench; a second gate electrode within the first trench and adjacent to the first gate electrode and overlying the bottom of the first trench, wherein the first gate electrode lies between the first wall and the second gate electrode; and a first set of discontinuous storage elements, wherein the set of discontinuous storage elements lies between the first gate electrode and the bottom of the first trench; a third gate electrode within the first trench and adjacent to the second wall and overlying the bottom of the first trench; a fourth gate electrode within the first trench and adjacent to the third gate electrode and overlying the bottom of the first trench, wherein the third gate electrode being between the second wall and the fourth gate electrode; a second set of discontinuous storage elements, wherein the second set of discontinuous storage elements lies between (i) the third gate electrode or the fourth gate electrode and (ii) the first bottom of the first trench; and wherein a first memory cell comprises the first gate electrode, the second gate electrode, and the first set of discontinuous storage elements; a second memory cell comprises the third gate electrode, the fourth gate electrode, and the second set of discontinuous storage element; and the second gate electrode being between the first gate electrode and the fourth gate electrode.

10. The electronic device of claim 9 , wherein substantially no discontinuous storage element lies between a bottom surface of the second gate electrode and the bottom of the first trench.

11. The electronic device of claim 9 , wherein:

within the first memory cell, substantially all of the first and second gate electrodes lie within the first trench;

the substrate includes other portions that define other trenches and other sets of discontinuous storage elements lying within the other trenches; and

substantially all of the discontinuous storage elements lie within the first and other trenches.

12. An electronic device comprising: a substrate including a portion that defines a first trench having a bottom and a first wall and a second wall opposite the first wall; a first gate electrode within the first trench and adjacent to the first wall and overlying the bottom of the first trench; a second gate electrode within the first trench and adjacent to the first gate electrode and overlying the bottom of the first trench; wherein the first gate electrode lies between the first wall and the second gate electrode; and a first set of discontinuous storage elements, wherein the set of discontinuous storage elements lies between the second gate electrode and the bottom of the first trench; a third gate electrode within the first trench and adjacent to the second wall and overlying the bottom of the first trench; a fourth gate electrode within the first trench and adjacent to the third gate electrode and overlying the bottom of the first trench, wherein the third gate electrode being between the second wall and the fourth gate electrode; a second set of discontinuous storage elements, wherein the second set of discontinuous storage elements lies between (i) the third gate electrode or the fourth gate electrode and (ii) the first bottom of the first trench; and wherein a memory cell comprises the first gate electrode, the second gate electrode, and the set of discontinuous storage elements, a second memory cell comprises the third gate electrode, the fourth gate electrode, and the second set of discontinuous storage element; and the second gate electrode being between the first gate electrode and the fourth gate electrode.

13. The electronic device of claim 12 , wherein:

the first gate electrode is a select gate electrode;

the second gate electrode is a control gate electrode; and

the first set of discontinuous storage elements is spaced apart from the wall of the first trench.

14. The electronic device of claim 13 , wherein within the device, substantially all of the first, second, third, and fourth gate electrodes lie within the first trench.

15. The electronic device of claim 14 , wherein substantially no discontinuous storage element lies between the first gate electrode and the bottom of the first trench.

16. The electronic device of claim 12 , wherein substantially no discontinuous storage element lies between the first gate electrode and the bottom of the first trench.

17. The electronic device of claim 12 , wherein:

the substrate includes other portions that define other trenches;

other sets of discontinuous storage elements lie within the other trenches; and

substantially all of the discontinuous storage elements of a memory array that includes the first and second memory cells lie within the first and other trenches.

Assignments (24)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041354/0148 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037355/0723 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →