Methods to recover and purify silicon particles from saw kerf

1. A method for separating and recovering silicon particles from silicon saw kerf resulting from slicing silicon wafers from a silicon ingot, the saw kerf comprising a lubricating fluid and a mixture of solid particulate comprising abrasive grains, silicon particles, metal particles and oxide particles, the method comprising:

separating at least a portion of the lubricating fluid from the solid particulate mixture;

washing the solid particulate mixture with an acidic solution comprising hydrogen fluoride and hydrochloric acid in which (i) the silicon particles are substantially insoluble, and (ii) the metal particles and oxide particles are soluble, metal particles and oxide particles being dissolved from the solid particulate mixture, the acidic solution creating a flotation froth with the solid particulate mixture, the froth comprising the silicon particles and the abrasive grains;

collecting the washed solid particulate mixture, the washed mixture comprising silicon particles and abrasive grains; and,

separating the silicon particles from the abrasive grains in the washed solid particulate mixture by subjecting the froth to a density-dependent separation technique selected from sedimentation centrifugation, filtration centrifugation, and hydro-cyclone separation and, prior to the density-dependent separation, contacting the silicon particles with a source of iodine, in order to convert at least a portion of the silicon present therein to SiI 4 , wherein the separated silicon particles have a carbon content of less than about 50 ppma and have a content of metal contaminants of less than about 150 ppma.

2. The method of claim 1 wherein the abrasive grains are silicon carbide.

3. The method of claim 1 , wherein the froth is dried prior to separating the silicon particles from the abrasive grains in the washed solid particulate mixture.

4. The method of claim 3 , wherein the silicon particles are recovered from the dried froth by subjecting the dried froth to a non-uniform magnetic field.

5. The method of claim 4 , wherein the method further comprises:

creating a non-uniform magnetic field between a first pole and a second pole of the magnet;

aerosolizing the dried silicon froth; and,

feeding the aerosol into the non-uniform magnetic field to separate silicon particles from abrasive grains present therein.

6. A method for separating and recovering silicon particles from silicon saw kerf resulting from slicing silicon wafers from a silicon ingot, the saw kerf comprising a lubricating fluid and a mixture of solid particulate comprising abrasive grains, silicon particles, metal particles and oxide particles, the method comprising:

separating at least a portion of the lubricating fluid from the solid particulate mixture;

washing the solid particulate mixture with an acidic solution comprising hydrogen fluoride and hydrochloric acid in which (i) the silicon particles are substantially insoluble, and (ii) the metal particles and oxide particles are soluble, metal particles and oxide particles being dissolved from the solid particulate mixture, the acidic solution creating a flotation froth with the solid particulate mixture, the froth comprising the silicon particles and the abrasive grains;

collecting the washed solid particulate mixture, the washed mixture comprising silicon particles and abrasive grains; and,

separating the silicon particles from the abrasive grains in the washed solid particulate mixture by subjecting the froth to a density-dependent separation technique selected from sedimentation centrifugation, filtration centrifugation, and hydro-cyclone separation and, prior to the density-dependent separation, contacting the silicon particles with an aqueous heteropolytungstate solution having a density between about 2.25 and about 3.35 gm/cm 3 to aid in the separation of silicon and abrasive grains present therein, wherein the separated silicon particles have a carbon content of less than about 50 ppma and have a content of metal contaminants of less than about 150 ppma.

7. The method of claim 6 , wherein the abrasive grains are silicon carbide.

8. The method of claim 6 , wherein the froth is dried prior to separating the silicon particles from the abrasive grains in the washed solid particulate mixture.

9. The method of claim 8 , wherein the silicon particles are recovered from the dried froth by subjecting the dried froth to a non-uniform magnetic field.

10. The method of claim 9 , wherein the method further comprises:

creating a non-uniform magnetic field between a first pole and a second pole of the magnet;

aerosolizing the dried silicon froth; and,

feeding the aerosol into the non-uniform magnetic field to separate silicon particles from abrasive grains present therein.

11. A method for separating and recovering silicon particles from silicon saw kerf resulting from slicing silicon wafers from a silicon ingot, the saw kerf comprising a lubricating fluid and a mixture of solid particulate comprising abrasive grains, silicon particles, metal particles and oxide particles, the method comprising:

separating at least a portion of the lubricating fluid from the solid particulate mixture;

washing the solid particulate mixture with an acidic solution in which (i) the silicon particles are substantially insoluble, and (ii) the metal particles and oxide particles are soluble, metal particles and oxide particles being dissolved from the solid particulate mixture, the acidic solution creating a flotation froth with the solid particulate mixture, the froth comprising the silicon particles and the abrasive grains;

drying the froth prior to separating the silicon particles from the abrasive grains in the washed solid particulate mixture;

collecting the washed solid particulate mixture, the washed mixture comprising silicon particles and abrasive grains; and

separating the silicon particles from the abrasive grains in the washed solid particulate mixture by subjecting the dried froth to a non-uniform magnetic field, wherein the separated silicon particles have a carbon content of less than about 50 ppma and have a content of metal contaminants of less than about 150 ppma.

12. The method of claim 11 , wherein the abrasive grains are silicon carbide.

13. The method of claim 11 , wherein the method further comprises:

creating a non-uniform magnetic field between a first pole and a second pole of the magnet;

aerosolizing the dried silicon froth; and,

feeding the aerosol into the non-uniform magnetic field to separate silicon particles from abrasive grains present therein.

14. A method for separating and recovering silicon particles from silicon saw kerf resulting from slicing silicon wafers from a silicon ingot, the saw kerf comprising a lubricating fluid and a mixture of solid particulate comprising abrasive grains, silicon particles, metal particles and oxide particles, the method comprising:

separating at least a portion of the lubricating fluid from the solid particulate mixture;

washing the solid particulate mixture with an acidic solution in which (i) the silicon particles are substantially insoluble, and (ii) the metal particles and oxide particles are soluble, metal particles and oxide particles being dissolved from the solid particulate mixture, wherein the solid particulate mixture is separately contacted with (i) an aqueous hydrofluoric acid solution, and (ii) an aqueous hydrochloric acid solution;

collecting the washed solid particulate mixture, the washed mixture comprising silicon particles and abrasive grains; and,

separating the silicon particles from the abrasive grains in the washed solid particulate mixture by subjecting the washed solid particulate mixture to a density-dependent separation technique selected from sedimentation centrifugation, filtration centrifugation, and hydro-cyclone separation and, prior to the density-dependent separation, contacting the silicon particles with a source of iodine in order to convert at least a portion of the silicon present therein to SiI 4 , wherein the separated silicon particles have a carbon content of less than about 50 ppma and have a content of metal contaminants of less than about 150 ppma.

15. The method of claim 14 , wherein the abrasive grains are silicon carbide.

16. The method of claim 14 , wherein the solid particulate mixture is separately contacted with between about 2 and about 4 stoichiometric equivalents (i) the aqueous hydrofluoric acid solution, and (ii) the aqueous hydrochloric acid solution, relative to concentration if silicon present in the solid particulate mixture.

17. The method of claim 14 , wherein the washed solid particulate mixture is dried prior to separating the silicon particles from the abrasive grains therein.

18. The method of claim 17 , wherein the silicon particles are separated from the abrasive grains in the dried, solid particulate mixture by subjecting the dried mixture to a non-uniform magnetic field.

19. The method of claim 18 , wherein the method further comprises:

creating a non-uniform magnetic field between a first pole and a second pole of the magnet;

aerosolizing the dried, solid particulate mixture; and,

feeding the aerosol into the non-uniform magnetic field to separate silicon particles from abrasive grains present therein.

20. A method for separating and recovering silicon particles from silicon saw kerf resulting from slicing silicon wafers from a silicon ingot, the saw kerf comprising a lubricating fluid and a mixture of solid particulate comprising abrasive grains, silicon particles, metal particles and oxide particles, the method comprising:

separating at least a portion of the lubricating fluid from the solid particulate mixture;

washing the solid particulate mixture with an acidic solution in which (i) the silicon particles are substantially insoluble, and (ii) the metal particles and oxide particles are soluble, metal particles and oxide particles being dissolved from the solid particulate mixture, wherein the solid particulate mixture is separately contacted with (i) an aqueous hydrofluoric acid solution, and (ii) an aqueous hydrochloric acid solution;

collecting the washed solid particulate mixture, the washed mixture comprising silicon particles and abrasive grains; and,

separating the silicon particles from the abrasive grains in the washed solid particulate mixture by subjecting the washed solid particulate mixture to a density-dependent separation technique selected from sedimentation centrifugation, filtration centrifugation, and hydro-cyclone separation and, prior to the density-dependent separation, contacting the silicon particles with an aqueous heteropolytungstate solution having a density between about 2.25 and about 3.35 gm/cm 3 to aid in the separation of silicon and abrasive grains present therein, wherein the separated silicon particles have a carbon content of less than about 50 ppma and have a content of metal contaminants of less than about 150 ppma.

21. The method of claim 20 , wherein the abrasive grains are silicon carbide.

22. The method of claim 20 , wherein the solid particulate mixture is separately contacted with between about 2 and about 4 stoichiometric equivalents (i) the aqueous hydrofluoric acid solution, and (ii) the aqueous hydrochloric acid solution, relative to concentration if silicon present in the solid particulate mixture.

23. The method of claim 20 , wherein the washed solid particulate mixture is dried prior to separating the silicon particles from the abrasive grains therein.

24. The method of claim 23 , wherein the silicon particles are separated from the abrasive grains in the dried, solid particulate mixture by further subjecting the dried mixture to a non-uniform magnetic field.

25. The method of claim 24 , wherein the method further comprises:

creating a non-uniform magnetic field between a first pole and a second pole of the magnet;

aerosolizing the dried, solid particulate mixture; and,

feeding the aerosol into the non-uniform magnetic field to separate silicon particles from abrasive grains present therein.

26. A method for separating and recovering silicon particles from silicon saw kerf resulting from slicing silicon wafers from a silicon ingot, the saw kerf comprising a lubricating fluid and a mixture of solid particulate comprising abrasive grains, silicon particles, metal particles and oxide particles, the method comprising:

separating at least a portion of the lubricating fluid from the solid particulate mixture;

washing the solid particulate mixture with an acidic solution in which (i) the silicon particles are substantially insoluble, and (ii) the metal particles and oxide particles are soluble, metal particles and oxide particles being dissolved from the solid particulate mixture, wherein the solid particulate mixture is separately contacted with (i) an aqueous hydrofluoric acid solution, and (ii) an aqueous hydrochloric acid solution;

collecting the washed solid particulate mixture, the washed mixture comprising silicon particles and abrasive grains;

drying the washed solid particulate mixture prior to separating the silicon particles from the abrasive grains therein; and,

separating the silicon particles from the abrasive grains in the washed solid particulate mixture by subjecting the washed solid particulate mixture to a non-uniform magnetic field, wherein the separated silicon particles have a carbon content of less than about 50 ppma and have a content of metal contaminants of less than about 150 ppma.

27. The method of claim 26 , wherein the abrasive grains are silicon carbide.

28. The method of claim 26 , wherein the method further comprises:

creating a non-uniform magnetic field between a first pole and a second pole of the magnet;

aerosolizing the dried, solid particulate mixture; and,

feeding the aerosol into the non-uniform magnetic field to separate silicon particles from abrasive grains present therein.