IP Library Assignment 025197/0352
Patent Assignment
Reel/Frame 025197/0352

Assignment of Assignor's Interest

Recorded: 2010-10-26 Pages: 7
Assignor
MEMC ELECTRONIC MATERIALS, INC.
Executed: 2010-10-21
Assignee
MEMC SINGAPORE PTE. LTD. (UEN200614794D)
8 CROSS STREET, #11-00, PWC BUILDING, SINGAPORE, 048424, SINGAPORE
Covered Properties (12)
Directional Solidification Furnace for Reducing Melt Contamination and Reducing Wafer Contamination
Patent: 8,317,920 →
Application: 12/563,124 →
Publication: US 2010/0074825
Methods for Preparing a Melt of Silicon Powder for Silicon Crystal Growth
Application: 12/611,567 →
Publication: US 2010/0107966
Methods For Pulling A Multicrystalline Silicon Ingot From A Silicon Melt
Patent: 8,932,550 →
Application: 12/646,303 →
Publication: US 2011/0002835
Pulling Assemblies For Pulling A Multicrystalline Silicon Ingot From A Silicon Melt
Patent: 8,524,000 →
Application: 12/646,350 →
Publication: US 2011/0002819
Methods to Recover and Purify Silicon Particles from Saw Kerf
Patent: 8,231,006 →
Application: 12/647,991 →
Publication: US 2010/0163462
Directional Solidification Furnace for Reducing Melt Contamination and Reducing Wafer Contamination
Application: 61/098,570 →
Methods for Preparing a Melt of Silicon Powder for Silicon Crystal Growth
Application: 61/111,536 →
Methods and Pulling Assemblies for Pulling a Multicrystalline Silicon Ingot from a Silicon Melt
Application: 61/141,567 →
Methods to Recover and Purify Silicon Particles
Application: 61/141,974 →
Silicon Wafers and Ingots with Reduced Oxygen Content and Methods for Producing Them
Application: 61/226,172 →
Coated Crucibles and Methods for Applying a Coating to a Crucible
Application: 61/226,175 →
Coating Compositions
Application: 61/226,176 →
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 9, 2008
From: KIMBEL, STEVEN L.; CHEN, JIHONG (JOHN); SCHRENKER, RICHARD G.; FERRY, LEE W.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 021977/0034 →
Assignment of Assignor's Interest Feb 27, 2009
From: KIMBEL, STEVEN L.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 022322/0428 →
Assignment of Assignor's Interest Mar 19, 2009
From: GRABBE, ALEXIS; RAGAN, TRACY M.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 022420/0674 →
Assignment of Assignor's Interest Apr 20, 2009
From: JAVIDI, MASSOUD; KIMBEL, STEVEN L.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 022567/0517 →
Assignment of Assignor's Interest Jul 29, 2009
From: PHILLIPS, RICHARD J.; KIMBEL, STEVEN L.; DESHPANDE, ADITYA J.; SHI, GANG
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 023023/0680 →
Assignment of Assignor's Interest Jul 29, 2009
From: PHILLIPS, RICHARD J.; KIMBEL, STEVEN L.; DESHPANDE, ADITYA J.; SHI, GANG
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 023023/0769 →
Assignment of Assignor's Interest Jul 29, 2009
From: PHILLIPS, RICHARD J.; KIMBEL, STEVEN L.; DESHPANDE, ADITYA J.; SHI, GANG
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 023023/0731 →
Assignment of Assignor's Interest Oct 19, 2009
From: KIMBEL, STEVEN L.; CHEN, JIHONG (JOHN); SCHRENKER, RICHARD G.; FERRY, LEE W.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 023388/0333 →
Assignment of Assignor's Interest Jan 6, 2010
From: JAVIDI, MASSOUD; KIMBEL, STEVEN L.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 023738/0338 →
Assignment of Assignor's Interest Jan 13, 2010
From: KIMBEL, STEVEN L.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 023777/0018 →
Assignment of Assignor's Interest Jan 13, 2010
From: KIMBEL, STEVEN L.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 023776/0967 →
Assignment of Assignor's Interest Jan 19, 2010
From: GRABBE, ALEXIS; RAGAN, TRACY M.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 023809/0414 →
Assignment of Assignor's Interest Jan 5, 2012
From: KIMBEL, STEVEN L.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 027482/0179 →
Release of Security Interest Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Change of Name Mar 27, 2017
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON, INC.
Reel/Frame 042099/0389 →
Change of Name Mar 29, 2017
From: MEMC SINGAPORE PTE. LTD. (UEN200614794D)
To: SUNEDISON PRODUCTS SINGAPORE PTE. LTD.
Reel/Frame 042110/0866 →
Change of Name Apr 25, 2017
From: MEMC SINGAPORE PTE. LTD. (UEN200614794D)
To: SUNEDISON PRODUCTS SINGAPORE PTE. LTD.
Reel/Frame 042333/0932 →
Assignment of Assignor's Interest Apr 27, 2017
From: SUNEDISON, INC.; SUNEDISON PRODUCTS SINGAPORE PTE. LTD.; MEMC PASADENA, INC.; SOLAICX
To: CORNER STAR LIMITED
Reel/Frame 042351/0659 →