Methods for reducing loading effects during film formation
View Patent ↗A method for fabricating a semiconductor device is provided. The method comprises selectively forming a first layer over a first and second exposed portions of a substrate. The first and second exposed portions are of different sizes and are located adjacent to a first and second active devices. During the first layer formation, a gas mixture comprising first and second source gases that function as growth components for forming the first layer and a reactant gas that functions as an etching component for controlling selectivity of the first layer growth is provided. The reactant gas is different from the first and second source gases and one of first and second source gases forms the first layer at a faster rate over the first exposed portion as compared to the second exposed portion and the other source gas exhibits an opposite behavior.
1. A method for fabricating a semiconductor device comprising:
providing a substrate comprising a first and second device structures;
forming a first and a second exposed portions of the substrate adjacent to the first and second device structures respectively, wherein the first and second exposed portions are of different sizes; and
simultaneously forming a first layer over the first and second exposed portions of the substrate, the formation comprising a deposition process and an etch process occurring simultaneously, wherein
the deposition process uses at least two growth components with opposed growth rates versus width of the recess to reduce loading effects, and
the etch process uses an etching component distinct from the at least two growth components for controlling selectivity of growths of the first layer in the first and second device structures.
2. The method as claimed in claim 1 , wherein the first and second exposed portions of the substrate comprises a different material from other exposed portions of the substrate.
3. The method as claimed in claim 2 , wherein selectively forming the first layer comprises selectively growing the first layer in an epitaxial process.
4. The method as claimed in claim 3 , wherein the first layer comprises one of Si, SiGe or SiC or a combination of one or more thereof.
5. The method as claimed in claim 3 , wherein the first and second source gases are silicon source gases.
6. The method as claimed in claim 5 , wherein the first source gas is silane and the second source gas is dichlorosilane.
7. The method as claimed in claim 3 , wherein the etching component comprises HCL.
8. The method as claimed in claim 3 , wherein the first and second exposed portions have a seed window area of 0.07 um 2 or less.
9. The method as claimed in claim 1 , wherein the first and second device structures each comprise a gate stack including a gate dielectric formed over the substrate and a gate electrode overlying the gate dielectric, and spacers surrounding the gate stack.
10. The method as claimed in claim 9 , wherein the first layer is selectively formed in an epitaxial process.
11. The method as claimed in claim 10 , wherein the first layer is a stress inducing layer.
12. The method as claimed in claim 11 , wherein the first and second exposed portions of the substrate are trenches formed within the substrate.
13. The method as claimed in claim 11 , wherein the first layer comprises SiGE.
14. The method as claimed in claim 13 , wherein the first source gas is silane and the second source gas is dichlorosilane.
15. The method as claimed in claim 14 , wherein the etching component comprises HCL.
16. The method as claimed in claim 14 , wherein the flow rate of silane is between around 40-60 sccm and the flow rate of dichlorosilane is between around 90-110 sccm.
17. The method as claimed in claim 1 , wherein the ratio of the first and second source gases is such neither of the sources is significantly more dominant than the other.
18. A method for fabricating a semiconductor device comprising:
providing a substrate comprising a first and second device structures;
forming a first and a second exposed portions of the substrate adjacent to the first and second device structures respectively, wherein the first and second exposed portions are of different sizes, the first and second exposed portions comprising different materials from other exposed portions of the substrate; and
selectively forming a first layer over the first and second exposed portions of the substrate, the formation comprising a deposition process and an etch process occurring simultaneously, wherein
the deposition process uses at least two growth components with opposed growth rates versus width of the recess to reduce loading effects, and
the etch process uses an etching component distinct from the at least two growth components for controlling selectivity of growths of the first layer in the first and second device structures.
19. A method for forming a device comprising:
providing a substrate prepared with first and second recesses, a width W 1 of the first recess being different than a width W 2 of the second recess; and
forming a device layer over the first and second recesses, the formation comprising a deposition process and an etch process occurring simultaneously, wherein
the deposition process uses at least two growth components with opposed growth rates versus width of the recess to reduce loading effects, and
the etch process uses an etching component distinct from the at least two growth components for controlling selectivity of growths of the device layer in the first and second recesses.
20. The method in claim 19 wherein forming the device layer comprises selectively growing the device layer in an epitaxial process.