IP Library Granted Patent US 8,243,533
Granted Patent B2
US 8,243,533 · App. 12/648,579 · Granted Aug 14, 2012

Semiconductor memory device and method of operating the same

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Quick Facts
Patent No.
US 8,243,533
App. No.
12/648,579
Granted
Aug 14, 2012
Kind
B2
Abstract

A semiconductor memory device allows a read command to be inputted thereto after a passage of a relatively short time period from a point in time where a write command has been inputted thereto. A method of operating the semiconductor memory device includes inputting a write command, inputting a read command in a preset period of time after the write command has been inputted, loading read data of a memory cell onto a data bus in response to the read command; and loading write data from outside of the semiconductor memory device onto the data bus in response to the write command.

Claims (23)

1. A method of operating a semiconductor memory device, the method comprising:

receiving a write command;

receiving a read command;

determining whether the read command is received in a preset period of time after the write command has been received;

loading read data of a memory cell onto a data bus before loading write data from outside of the semiconductor memory device onto the data bus when the read command is determined to be received in the preset of time; and

loading the write data from outside of the semiconductor memory device onto the data bus before loading the read data onto the data bus when the read command is determined to be received after the preset period of time.

2. The method of claim 1 , wherein the preset period of time is in a range from a point in time of a minimum column address strobe (CAS) to CAS delay (tCCD_min) to a point in time obtained by subtracting the tCCD_min from a CAS write latency.

3. The method of claim 1 , wherein the read data is outputted outside of the semiconductor memory device after the read command has been inputted and after a passage of time corresponding to a column address strobe latency.

4. The method of claim 1 , wherein the write data is inputted from outside of the semiconductor memory device to be loaded onto the data bus after the write command has been inputted and after a passage of time corresponding to a column address strobe write latency.

5. A semiconductor memory device, comprising:

a data input/output pad block;

a memory cell block; and

a data bus configured to transfer data between the data input/output pad block and the memory cell block,

wherein, when a read command is being inputted in a preset period of time after a write command has been inputted, read data read out of the memory cell block in response to the read command is loaded onto the data bus prior to loading write data onto the data input/output pad block in response to the write command, and

when the read command is being inputted after the preset period of time after the write command has been inputted, the write data is loaded onto the data input/output pad block prior to loading the read data onto the data bus in response to the read command.

6. The semiconductor memory device of claim 5 , wherein the read command is inputted to the semiconductor memory device ahead of the write data by a time required for the data bus to transfer, when the read command is being inputted in the preset of time, the read data in response to the read command.

7. The semiconductor memory device of claim 5 , wherein the preset period of time is in a range from a point in time of a minimum column address strobe (CAS) to CAS delay (tCCD_min) to a point in time obtained by subtracting the tCCD_min from a CAS write latency.

8. The semiconductor memory device of claim 5 , wherein the data bus comprises a plurality of global input/output lines and a plurality of local input/output lines.

9. The semiconductor memory device of claim 5 , wherein the data bus comprises a path through which the read data moves and a path through which the write data moves, the paths being separated from each other.

10. The semiconductor memory device of claim 5 , wherein the data bus comprises a plurality of read and write drivers configured to transmit respective read and write data between the data input/output pad block and the memory cell block in response to a control signal.

11. The semiconductor memory device of claim 10 , wherein the read driver is activated to transmit the read data from the memory cell block to the data input/output pad block in response to the enabled control signal, and the write driver is activated to transmit the write data from the data input/output pad block to the memory cell block in response to the disabled control signal.

12. The semiconductor memory device of claim 11 , wherein the control signal is enabled when the read command is being inputted to the semiconductor memory device ahead of the write data by a time required for the data bus to transfer the read data in response to the read command.

13. The semiconductor memory device of claim 12 , wherein the control signal is enabled for the time required for the data bus to transfer the read data in response to the read command.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE IS HYNIX SEMICONDUCTOR INC. NOT HYNIX-SEMICONDUCTOR INC. THERE IS NO HYPHEN IN THE NAME. PREVIOUSLY RECORDED ON REEL 67328 FRAME 814. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
CHANGE OF NAME Recorded May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2009
From: KU, KIE-BONG
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 023712/0459 →