Supply voltage or ground connections for integrated circuit device
View Patent ↗Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond fingers may be connected together via one or more electrically conductive interconnects.
1. An integrated circuit device, comprising:
an integrated circuit die comprising a plurality of supply voltage bond pads;
a substrate having a plurality of supply voltage bond fingers individually electrically connected to one or more of the plurality of supply voltage bond pads via one or more supply voltage bond interconnects;
one or more supply voltage bond finger interconnects electrically connected to two or more of the plurality of supply voltage bond fingers; and
a plurality of solder balls positioned on a second surface of the substrate,
wherein the integrated circuit and the plurality of bond fingers are positioned on a first surface of said substrate, wherein the plurality of solder balls are individually electrically coupled to one or more of the plurality of supply voltage bond fingers through one or more electrically conductive traces or electrically conductive vias extending from the first surface to the second surface of the substrate, and wherein two or more of the plurality of solder balls are electrically interconnected via an electrically conductive interconnect.
2. The integrated circuit device of claim 1 , wherein the integrated circuit die further comprises a plurality of ground voltage bond pads, and wherein said first surface of the substrate further has positioned thereon a plurality of ground voltage bond fingers individually connected to one or more of the plurality of ground voltage bond pads via one or more ground voltage bond interconnects.
3. The integrated circuit device of claim 2 , further comprising one or more ground voltage bond finger interconnects electrically connected to two or more of the plurality of ground voltage bond fingers.
4. The integrated circuit device of claim 1 , wherein the supply voltage bond pads comprise first supply voltage bond pads, the supply voltage bond fingers comprise first supply voltage bond fingers, said supply voltage bond interconnects comprise first supply voltage bond interconnects, and said supply voltage bond finger interconnects comprise first supply voltage bond finger interconnects, wherein the integrated circuit die further comprises a plurality of second supply voltage bond pads, and wherein said substrate further has positioned thereon a plurality of second supply voltage bond fingers individually connected to one or more of the plurality of second supply voltage bond pads via one or more second supply voltage bond interconnects.
5. The integrated circuit device of claim 4 , further comprising one or more second supply voltage bond finger interconnects electrically connected to two or more of the plurality of second supply voltage bond fingers.
6. A method, comprising:
electrically connecting a plurality of supply voltage bond pads of an integrated circuit to a respective plurality of supply voltage bond fingers positioned on a first surface of a substrate, wherein each of the plurality of supply voltage bond fingers is individually electrically connected to one or more of the plurality of supply voltage bond pads; and
electrically interconnecting two or more of the plurality of supply voltage bond fingers, wherein electrically interconnecting two or more of the plurality of supply voltage bond fingers comprises electrically connecting one or more wires to two or more of said plurality of supply voltage bond fingers.
7. The method of claim 6 , further comprising electrically connecting a plurality of solder balls to one or more of the plurality of supply voltage bond fingers.
8. The method of claim 7 , further comprising electrically connecting two or more of the plurality of solder balls via one or more electrically conductive interconnects positioned on a second surface of the substrate.
9. The method of claim 6 , further comprising:
electrically connecting a plurality of ground voltage bond pads of the integrated circuit to a respective plurality of ground voltage bond fingers positioned on the first surface of the substrate; and
electrically interconnecting two or more of said plurality of ground voltage bond fingers.
10. The method of claim 6 , wherein the supply voltage bond pads comprise first supply voltage bond pads, the supply voltage bond fingers comprise first supply voltage bond fingers, the supply voltage bond wires comprise first supply voltage bond wires, and the supply voltage bond finger interconnects comprise first supply voltage bond finger interconnects, and wherein the method further comprises:
electrically connecting a plurality of second supply voltage bond pads of the integrated circuit to a respective plurality of second supply voltage bond fingers positioned on the first surface of the substrate; and
electrically interconnecting two or more of the plurality of second supply voltage bond fingers via one or more second supply voltage bond finger interconnects.
11. A system, comprising:
a power supply to generate a first supply voltage;
a processor; and
a memory device coupled to the processor, the memory device to receive the first supply voltage from the power supply, the memory device comprising:
an integrated circuit die comprising a plurality of first supply voltage bond pads;
a substrate having positioned thereon a plurality of first supply voltage bond fingers individually electrically connected to one or more of the plurality of first supply voltage bond pads via one or more first supply voltage bond interconnects,
wherein a second surface of the substrate has positioned thereon a plurality of solder balls to receive said first supply voltage from the power supply, the plurality of solder balls individually electrically connected to one or more of the plurality of first supply voltage bond fingers, wherein two or more of the plurality of solder balls are electrically connected via an electrically conductive interconnect formed on the second surface of the substrate; and
one or more first supply voltage bond finger interconnects electrically connected to two or more of the plurality of first supply voltage bond fingers.
12. The system of claim 11 , wherein the integrated circuit die further comprises a plurality of ground voltage bond pads, and wherein the first surface of the substrate further has positioned thereon a plurality of ground voltage bond fingers individually connected to one or more of the plurality of ground voltage bond pads via one or more ground voltage bond interconnects.
13. The system of claim 12 , wherein the memory device further comprises one or more ground voltage bond finger interconnects electrically connected to two or more of the plurality of ground voltage bond fingers.
14. The system of claim 11 , the power supply further to generate a second supply voltage, wherein the integrated circuit die further comprises a plurality of second supply voltage bond pads, and wherein the substrate further has positioned thereon a plurality of second supply voltage bond fingers individually electrically connected to one or more of the plurality of second supply voltage bond pads via one or more second supply voltage bond interconnects.
15. The system of claim 14 , the memory device further comprising one or more second supply voltage bond finger interconnects electrically connected to two or more of the plurality of second supply voltage bond fingers.
16. A method, comprising:
receiving a supply voltage at two or more supply voltage bond fingers positioned on a first surface of a substrate, wherein the two or more supply voltage bond fingers are electrically connected via one or more supply voltage bond finger interconnects,
wherein receiving the supply voltage further comprises receiving the supply voltage at a plurality of supply voltage solder balls positioned on a second surface of the substrate, wherein the plurality of supply voltage solder balls are individually electrically coupled to one or more of the two or more supply voltage bond fingers through one or more electrically conductive supply voltage vias extending from the first surface to the second surface of the substrate,
wherein receiving the supply voltage further comprises receiving the supply voltage at two or more of the plurality of supply voltage solder balls electrically interconnected via an electrically conductive supply voltage solder ball interconnect positioned on the second surface of the substrate; and
transmitting the supply voltage from the two or more supply voltage bond fingers to one or more supply voltage bond pads positioned on an integrated circuit die, the integrated circuit die positioned on the first surface of the substrate.
17. The method of claim 16 , further comprising:
receiving a ground voltage at two or more ground voltage bond fingers positioned on the first surface of the substrate, wherein the two or more ground voltage bond fingers are electrically connected via one or more ground voltage bond finger interconnects; and
transmitting the ground voltage from the two or more ground voltage bond fingers to one or more ground voltage bond pads positioned on the integrated circuit die.
18. The method of claim 17 , wherein receiving the ground voltage further comprises receiving the ground voltage at a plurality of ground voltage solder balls positioned on the second surface of the substrate, wherein the plurality of ground voltage solder balls are individually electrically coupled to one or more of the two or more ground voltage bond fingers through one or more electrically conductive ground voltage vias extending from the first surface to the second surface of the substrate.
19. The method of claim 18 , wherein receiving the ground voltage further comprises receiving the ground voltage at two or more of the plurality of ground voltage solder balls electrically interconnected via an electrically conductive ground voltage solder ball interconnect positioned on the second surface of the substrate.
20. The method of claim 19 , further comprising:
receiving a second supply voltage at two or more second supply voltage bond fingers positioned on the first surface of the substrate, wherein the two or more second supply voltage bond fingers are electrically connected via one or more second supply voltage bond finger interconnects; and
transmitting the second supply voltage from the two or more second supply voltage bond fingers to one or more second supply voltage bond pads positioned on the integrated circuit die.
21. The method of claim 20 , wherein receiving the second supply voltage further comprises receiving the second supply voltage at a plurality of second supply voltage solder balls positioned on the second surface of the substrate, wherein the plurality of second supply voltage solder balls are individually electrically coupled to one or more of the two or more second supply voltage bond fingers through one or more electrically conductive second supply voltage vias extending from the first surface to the second surface of the substrate.
22. The method of claim 21 , wherein receiving the second supply voltage further comprises receiving the second supply voltage at two or more of the plurality of second supply voltage solder balls electrically interconnected via an electrically conductive second supply voltage solder ball interconnect positioned on the second surface of the substrate.
23. The method of claim 16 , wherein the receiving a supply voltage comprises;
receiving the supply voltage at two or more parallel supply voltage bond fingers positioned on a first surface of a substrate, wherein the two or more parallel supply voltage bond fingers are electrically connected via one or more supply voltage bond finger interconnects; and
transmitting the supply voltage from the two or more parallel supply voltage bond fingers to the one or more parallel supply voltage bond pads positioned on the integrated circuit die, the integrated circuit die positioned on the first surface of the substrate.
24. An integrated circuit device, comprising:
an integrated circuit die comprising a plurality of supply voltage bond pads, wherein the plurality of supply voltage bond pads comprises a plurality of parallel supply voltage bond pads;
a substrate having a plurality of supply voltage bond fingers individually electrically connected to one or more of the plurality of supply voltage bond pads via one or more supply voltage bond interconnects, wherein the substrate has a plurality of parallel supply voltage bond fingers individually electrically connected to one or more of the plurality of parallel supply voltage bond pads via one or more supply voltage bond interconnects;
one or more supply voltage bond finger interconnects electrically connected to two or more of the plurality of supply voltage bond fingers; and
one or more supply voltage bond finger interconnects electrically connected to two or more of the plurality of parallel supply voltage bond fingers.
25. An integrated circuit device, comprising:
an integrated circuit die comprising a plurality of supply voltage bond pads;
a substrate having a plurality of supply voltage bond fingers individually electrically connected to one or more of the plurality of supply voltage bond pads via one or more supply voltage bond interconnects; and
one or more supply voltage bond finger interconnects electrically connected to two or more of the plurality of supply voltage bond fingers,
wherein the one or more supply voltage bond finger interconnects are wires.
26. A method, comprising:
electrically connecting a plurality of supply voltage bond pads of an integrated circuit to a respective plurality of supply voltage bond fingers positioned on a first surface of a substrate;
electrically interconnecting two or more of the plurality of supply voltage bond fingers, wherein electrically interconnecting two or more of the plurality of supply voltage bond fingers comprises electrically connecting one or more wires to two or more of said plurality of supply voltage bond fingers;
electrically connecting a plurality of solder balls to one or more of the plurality of supply voltage bond fingers via one or more electrically conductive interconnects positioned on a second surface of the substrate.