IP Library Granted Patent US 8,421,489
Granted Patent B2
US 8,421,489 · App. 12/656,453 · Granted Apr 16, 2013

Semiconductor device having CMOS transfer circuit and clamp element

Inventors: Shinya Tashiro (Kanagawa, JP); Kazutaka Taniguchi (Kanagawa, JP)
Assignee: Renesas Electronics Corporation
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Quick Facts
Patent No.
US 8,421,489
App. No.
12/656,453
Granted
Apr 16, 2013
Kind
B2
Abstract

A semiconductor device includes an internal power-supply circuit which produces an internal potential, an external terminal which outputs the internal potential and inputs and outputs a signal with an outside, and a test mode signal terminal which transfers a test mode signal. The semiconductor device further includes a first CMOS transfer circuit and a second CMOS transfer circuit which are provided between the internal power-supply circuit and the external terminal, and which are controlled by the test mode signal, a clamp element which is connected between the first and second CMOS transfer circuits and suppresses a potential variation, and a delay element provided between the clamp element and the first CMOS transfer circuit.

Claims (13)

1. A semiconductor device, comprising:

an internal power-supply circuit which produces an internal voltage potential;

an external terminal;

a test terminal which transfers a test mode signal;

an inverter which receives the test mode signal and outputs an inverted test mode signal;

a first transfer circuit which includes a first transistor of a first conductivity type coupled between the internal power-supply circuit and a first node and having a control gate supplied with the inverted test mode signal, and a second transistor of a second conductivity type coupled in parallel with the first transistor between the internal power-supply circuit and the first node and having a control gate supplied with the test mode signal;

a resister coupled between the first node and a second node;

a second transfer circuit which includes a third transistor of the first conductivity type coupled between the external terminal and the second node and having a control gate supplied with the inverted test mode signal, and a fourth transistor of the second conductivity type coupled in parallel with the third transistor between the external terminal and the second node and having a control gate supplied with the test mode signal; and

a clamp element which clamps a potential on the second node.

2. The semiconductor device as claimed in claim 1 , wherein the clamp element includes a fifth transistor of the first conductivity type coupled between a first power source and the second node and having a control gate supplied with the first power source.

3. The semiconductor device as claimed in claim 2 , wherein the clamp element further includes a sixth transistor of the second conductivity type coupled between a second power source and the second node, and having a control gate supplied with the second power source.

4. The semiconductor device as claimed in claim 1 , wherein the clamp element includes a fifth transistor of the first conductivity type coupled between a first power source and the second node, and having a control gate supplied with the inverted test mode signal.

5. The semiconductor device as claimed in claim 1 , further comprising an output circuit which outputs a data based on the test mode signal.

Assignments (2)
CHANGE OF NAME Recorded Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025193/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2010
From: TASHIRO, SHINYA; TANIGUCHI, KAZUTAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 023959/0877 →
Priority Claims (1)
JP 2009-022764 · Feb 3, 2009 · national
Continuity (1)
Related Publication 20100219855A1 · Sep 2, 2010