Failure analysis method, apparatus, and program for semiconductor integrated circuit

1. A failure analysis method, for a semiconductor integrated circuit, said method comprising:

deriving a coordinate in a device coordinate system in analysis data for abnormal signal data included in analysis data of a semiconductor integrated circuit obtained from a semiconductor inspection apparatus;

deriving a correspondence between a coordinate in said device coordinate system and a coordinate in a design coordinate system in design data of said semiconductor integrated circuit for a plurality of reference points in said semiconductor integrated circuit;

deriving a coordinate conversion formula between the device coordinate system and the design coordinate system;

deriving a position error between a coordinate in said device coordinate system converted by said coordinate conversion formula and a coordinate in said design coordinate system; and

extracting a circuit related to an abnormal signal in said design data based on the coordinates of said abnormal signal in said device coordinate system using said coordinate conversion formula and said position error, and

displaying image data of said analysis data and image data of said design data,

wherein,

said coordinate conversion includes specifying said plurality of reference points,

said extracting a circuit includes a signal coordinate calculation that derives a range of the abnormal signal in said design coordinate system using said coordinate conversion formula and said position error, and

said specifying lets a user input coordinates of said reference points in said device coordinate system and said design coordinate system using the image data of said analysis data and said design data of said semiconductor integrated circuit.

2. The failure analysis method as defined in claim 1 , wherein said plurality of reference points are specified when coordinates are converted, and

a range of the abnormal signal in said design coordinate system is derived using said coordinate conversion formula and said position error when said circuit is extracted.

3. The failure analysis method as defined in claim 1 , wherein said coordinate conversion formula is calculated for a plurality of coordinates in said device coordinate system, said design coordinate system respectively using a least-squares method when said coordinates are converted.

4. The failure analysis method as defined in claim 1 wherein, when said position error is derived, a mean square error by said coordinate conversion formula is derived for a plurality of coordinates, and said position error is derived from said mean square error.

5. The failure analysis method as defined in claim 1 wherein, when said coordinates are converted, correspondences between said coordinates are derived for a number of said reference points exceeding a minimum required number for deriving a coordinate conversion formula, a coordinate conversion formula is tentatively derived using an arbitrary number of reference points among the reference points for which coordinate correspondences are derived, a sum of a position error of each reference point is derived as a conversion error using said tentatively derived coordinate conversion formula, and a coordinate conversion formula that derives a smallest conversion error is deemed a final coordinate conversion formula.

6. The failure analysis method as defined in claim 1 , wherein said coordinate conversion formula comprises a coordinate conversion formula using a projective transformation, and when said coordinates are converted, parameters of said projective transformation are calculated from coordinates of at least four of said reference points in said device coordinate system and said design coordinate system.

7. The failure analysis method as defined in claim 1 , wherein

said coordinate conversion formula comprises a coordinate conversion formula using a movement amount, a rotation amount, an inclination amount, and an elasticity amount, and

when said coordinates are converted, said movement amount, said rotation amount, said inclination amount, and said elasticity amount are calculated from coordinates of at least three said reference points in said device coordinate system and said design coordinate system.

8. A failure analysis apparatus, for a semiconductor integrated circuit, said apparatus comprising:

a signal detection portion that derives a coordinate in a device coordinate system in analysis data for abnormal signal data included in analysis data of a semiconductor integrated circuit obtained from a semiconductor inspection apparatus;

a coordinate conversion portion that derives a correspondence between a coordinate in said device coordinate system and a coordinate in said design coordinate system in design data of said semiconductor integrated circuit for a plurality of reference points in said semiconductor integrated circuit, and that derives a coordinate conversion formula between the device coordinate system and the design coordinate system;

an error calculation portion that derives a position error between a coordinate in said device coordinate system converted by said coordinate conversion formula and a coordinate in said design coordinate system;

a circuit extraction portion that extracts a circuit related to said abnormal signal in said design data based on coordinates of an abnormal signal in said device coordinate system using said coordinate conversion formula and said position error, and

a display unit that displays image data of said analysis data and image data of said design data,

wherein,

said coordinate conversion portion includes a reference point specifying portion that specifies said plurality of reference points,

said circuit extraction portion includes a signal coordinate calculation portion that derives a range of the abnormal signal in said design coordinate system using said coordinate conversion formula and said position error, and

said reference point specifying portion lets a user input coordinates of said reference points in said device coordinate system and said design coordinate system using the image data of said analysis data and said design data displayed by said display unit.

9. The failure analysis apparatus as defined in claim 8 , wherein said display unit displays the image data of said analysis data including said abnormal signal and the image data of said design data including an image of the range of the abnormal signal derived by said signal coordinate calculation portion superimposed.

10. The failure analysis apparatus as defined in claim 8 , wherein said coordinate conversion portion calculates said coordinate conversion formula for a plurality of coordinates in said device coordinate system and said design coordinate system respectively using a least-squares method.

11. The failure analysis apparatus as defined in claim 8 , wherein said error calculation portion derives a mean square error by said coordinate conversion formula for a plurality of coordinates, and said position error is derived from said mean square error.

12. The failure analysis apparatus as defined in claim 8 , wherein said coordinate conversion portion derives correspondences between said coordinates for a number of said reference points exceeding a minimum required number for deriving a coordinate conversion formula, tentatively derives a coordinate conversion formula using an arbitrary number of reference points among the reference points for which coordinate correspondences are derived, derives a sum of a position error of each reference point as a conversion error using said tentatively derived coordinate conversion formula, and deems a coordinate conversion formula that derives a smallest conversion error as a final coordinate conversion formula.

13. The failure analysis apparatus as defined in claim 8 , wherein said coordinate conversion formula uses a projective transformation, and said coordinate conversion portion calculates parameters of said projective transformation from coordinates of at least four of said reference points in said device coordinate system and said design coordinate system.

14. The failure analysis apparatus as defined in claim 8 , wherein

said coordinate conversion formula uses a movement amount, a rotation amount, an inclination amount, and an elasticity amount, and

said coordinate conversion portion calculates said movement amount, said rotation amount, said inclination amount, and said elasticity amount from coordinates of at least three said reference points in said device coordinate system and said design coordinate system.

15. A failure analysis program which causes a computer to execute the failure analysis method as defined in claim 1 .

16. A failure analysis program which causes a computer to function as the failure analysis apparatus as defined in claim 8 .

17. A computer readable storage medium storing said program as defined in claim 15 .

18. A computer readable storage medium storing said program as defined in claim 16 .