IP Library Granted Patent US 8,225,267
Granted Patent B2
US 8,225,267 · App. 12/659,399 · Granted Jul 17, 2012

Method and apparatus for analyzing structure of complex material layer, and storage medium storing program for causing a computer to execute thereof method

Assignee: Renesas Electronics Corporation
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Quick Facts
Patent No.
US 8,225,267
App. No.
12/659,399
Granted
Jul 17, 2012
Kind
B2
Abstract

A structure analysis apparatus ( 1 ) for analyzing structure of a complex material layer containing a plurality of members ( 2 a , 2 b ) for modeling layout data on a complex material layer, includes: an area setting portion ( 21 ) for setting an area to be modeled in the complex material layer; an area dividing portion ( 22 ) for dividing the area into a plurality of elements; an area computing portion ( 23 ) for calculating, based on an occupancy of each of the plurality of members ( 2 a , 2 b ) in the area, the number of elements corresponding respectively to the plurality of members ( 2 a , 2 b ); and an element placing portion ( 24 ) for generating a model of the complex material layer by placing the plurality of members ( 2 a , 2 b ) respectively in the plurality of elements based on the number of the elements corresponding respectively to the plurality of members ( 2 a , 2 b ).

Claims (15)

1. A structure analysis apparatus for analyzing a structure of a complex material layer containing a plurality of members for modeling layout data on the complex material layer, comprising:

an area setting portion for setting an area to be modeled in the complex material layer;

an area dividing portion for dividing the area into a plurality of elements;

an area computing portion for calculating, based on an occupancy of each of the plurality of members in the area, a number of elements corresponding respectively to each of the plurality of members; and

an element placing portion for generating a model of the complex material layer by placing each of the plurality of members respectively in each of the plurality of elements, based on the number of elements corresponding respectively to each of the plurality of members.

2. The structure analysis apparatus according to claim 1 , wherein the area computing portion calculates the number of elements corresponding respectively to each of the plurality of members, based on the occupancy of each of the plurality of members and a number of elements in the divided area.

3. The structure analysis apparatus according to claim 1 , wherein the element placing portion generates the model of the complex material layer by placing the plurality of members respectively in the plurality of elements at random.

4. The structure analysis apparatus according to claim 1 , further comprising a stress analysis portion that calculates a stress analysis value of the complex material layer, based on the model of the complex material layer.

5. The structure analysis apparatus according to claim 4 , wherein the stress analysis value is warpage of the complex material layer.

6. A storage medium storing a program for causing a computer to execute a method comprising:

acquiring layout data on a complex material layer containing a plurality of members;

setting an area for modeling the layout data, based on a user input;

dividing the area into a plurality of elements;

calculating, based on an occupancy of each of the plurality of members in the area, a number of elements corresponding respectively to each of the plurality of members; and

generating a model of the complex material layer by placing the plurality of members respectively in the plurality of, elements, based on the number of elements corresponding respectively to each of the plurality of members.

Assignments (2)
CHANGE OF NAME Recorded Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025193/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2010
From: SEKIGUCHI, TOMOHISA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024105/0215 →
Priority Claims (1)
JP 2009-64895 · Mar 17, 2009 · national
Continuity (1)
Related Publication 20100242002A1 · Sep 23, 2010