Semiconductor device
A semiconductor device, includes a package substrate having a first surface and a second surface opposite to the first surface, and a semiconductor element installed in the first surface of the package substrate. The package substrate includes a plurality of first land pads disposed in the first surface, second land pads disposed in the second surface and a second testing-dedicated pad disposed in the second surface. The semiconductor element is electrically coupled to the first land pads, an inter-pad distance for the second land pads is larger than an inter-pad distance for the first land pads, the first land pad contains a first testing-dedicated pad electrically coupled to the semiconductor element, the first testing-dedicated pad and the second testing-dedicated pad each include a dedicated terminal, which is essential for applying a specified electrical signal from an LSI tester, when an LSI testing is conducted for a semiconductor wafer and the first testing-dedicated pad is electrically coupled to only the second testing-dedicated pad through a wiring.
1. A semiconductor device, comprising:
a package substrate having a first surface and a second surface opposite to said first surface; and
a semiconductor element installed in said first surface of said package substrate,
wherein said package substrate includes a plurality of first land pads disposed in said first surface, second land pads disposed in said second surface and a second testing-dedicated pad disposed in said second surface,
said semiconductor element is electrically coupled to said first land pads,
an inter-pad distance for said second land pads is larger than an inter-pad distance for said first land pads,
a second land pad is provided with an external coupling terminal,
no external coupling terminal is provided in said second testing-dedicated pad,
said package substrate internally has a wiring,
a first land pad contains a first testing-dedicated pad electrically coupled to said semiconductor element,
said first testing-dedicated pad and said second testing-dedicated pad each comprises a dedicated terminal, which is essential for applying a specified electrical signal from an LSI tester, when an LSI testing is conducted for a semiconductor wafer, and
said first testing-dedicated pad is electrically coupled to only said second testing-dedicated pad through said wiring.
2. The semiconductor device, as set forth in claim 1 , wherein said first land pad is electrically coupled to said second land pad through said wiring.
3. The semiconductor device, as set forth in claim 1 , wherein said second testing-dedicated pad in said second surface is covered with an electrically insulating protective film.
4. The semiconductor device, as set forth in claim 3 , wherein said electrically insulating protective film comprises solder resist.
5. The semiconductor device, as set forth in claim 1 , wherein said semiconductor element is installed in said first surface of said package substrate through a bump.
6. The semiconductor device, as set forth in claim 1 ,
wherein said second land pads are disposed respectively in a circumference section and a central section of said second surface,
a space having a size larger than an inter-pad distance for said second land pads is formed between said circumference section and said central section, and
said second testing-dedicated pad is provided in said space.
7. The semiconductor device, as set forth in claim 1 ,
wherein said package substrate has a rectangular geometry, and
said second testing-dedicated pad is provided in at least one corner portion of said second surface.
8. The semiconductor device, as set forth in claim 1 , wherein said external coupling terminal comprises a solder bump.