DMOS transistor and method of manufacturing the same
View Patent ↗The invention provides a DMOS transistor in which a leakage current is decreased and the source-drain breakdown voltage of the transistor in the off state is enhanced when a body layer is formed by oblique ion implantation. After a photoresist layer 18 is formed, using the photoresist layer 18 and a gate electrode 14 as a mask, first ion implantation is performed toward a first corner portion 14 C 1 on the inside of the gate electrode 14 in a first direction shown by an arrow A′. A first body layer 17 A′ is formed by this first ion implantation. The first body layer 17 A′ is formed so as to extend from the first corner portion 14 C 1 to under the gate electrode 14 , and the P-type impurity concentration of the body layer 17 A′ in the first corner portion 14 C 1 is higher than that of a conventional transistor.
1. A method of manufacturing a DMOS transistor, comprising:
providing a semiconductor substrate;
forming a source layer of a first conductive type in a front surface of the semiconductor substrate;
forming a gate insulation film on the front surface of the semiconductor substrate;
forming a gate electrode on the gate insulation film so, as to surround in plan view of the semiconductor substrate the source layer to leave an opening having a corner portion in the gate electrode;
forming a body layer of a second conductive type superposed on the source layer so as to extend under the gate electrode; and
forming a drain layer of the first conductive type in the front surface of the semiconductor substrate,
wherein the opening is elongated in a first direction, and
the forming of the body layer comprises performing ion implantation of impurities of the second conductive type by directing an ion beam so that in plan view of the semiconductor substrate the ion beam is oblique relative to the first direction and relative to a direction perpendicular to the first direction.
2. The method of claim 1 , wherein the ion beam is oblique by a first angle relative to a vertical direction to the front surface of the semiconductor substrate and by a second angle relative to the first direction, the first angle ranging from 20° to 45° and the second angle ranging from 15° to 40°.
3. The method of claim 1 , wherein the source layer is formed apart from the corner portion in plan view of the semiconductor substrate.
4. The method of claim 3 , wherein the drain layer is formed so as to have ends aligned with ends of the source layer.
5. The method of claim 1 , wherein the ion beam is oblique by a first angle relative to a vertical direction to the front surface of the semiconductor substrate and by a second angle relative to the first direction, the first angle ranging from 20° to 45° and the second angle ranging from 50° to 75°.
6. A DMOS transistor comprising:
a semiconductor substrate;
a source layer of a first conductive type formed on a front surface of the semiconductor substrate;
a gate insulation film formed on the front surface of the semiconductor substrate;
a gate electrode formed on the gate insulation film so as to surround in plan view of the semiconductor substrate the source layer to leave an opening not occupied by the source layer and having a corner portion in the gate electrode;
a body layer of a second conductive type superposed on the source layer so as to extend under the gate electrode; and
a drain layer of the first conductive type formed in the front surface of the semiconductor substrate,
wherein an impurity concentration of the body layer is lower at the corner portion than at other edge portions of the opening, and the source layer is apart from the corner portion in plan view of the semiconductor device.
7. The DMOS transistor of claim 6 , wherein ends of the drain layer are aligned with ends of the source layer.
8. The DMOS transistor of claim 6 wherein only one source layer exists in the opening of the gate electrode.