Flex circuit package and method
View Patent ↗A flex circuit package includes a package body enclosing an electronic component and a first surface of the substrate. Columns are physically and electrically connected to first traces of the substrate, the columns extending through the package body. A flexible circuit connector has first terminals connected to the columns. The flexible circuit connector further includes second terminals that provide an electrical interconnection structure for electrical connection to a second electronic component structure. By connecting the flexible circuit connector to the columns extending through the package body, special routing of traces of the substrate of the flex circuit package to provide an interface for the flexible circuit connector is avoided.
1. A flex circuit package comprising:
an electronic component mounted to a first surface of a substrate;
first traces on the first surface of the substrate, the first traces being electrically connected to the electronic component;
a package body enclosing the electronic component and the first surface of the substrate;
columns physically and electrically connected to the first traces, the columns comprising non-collapsing material extending through the package body, the columns comprising:
spherical portions enclosed within the package body; and
necks between the spherical portions, the necks having a smaller diameter than the spherical portions; and
a flexible circuit connector having first terminals connected to the columns.
2. The flex circuit package of claim 1 further comprising bumps electrically connecting the first terminals of the flexible circuit connector to the columns.
3. The flex circuit package of claim 1 wherein the flexible circuit connector comprises:
a dielectric substrate; and
a circuit on the dielectric substrate, the circuit comprising the first terminals.
4. The flex circuit package of claim 1 wherein the flexible circuit connector comprises a first end comprising the first terminals.
5. The flex circuit package of claim 4 wherein the flexible circuit connector further comprises a second end comprising second terminals.
6. The flex circuit package of claim 5 wherein the first terminals are electrically connected to the second terminals by a circuit of the flexible circuit connector.
7. The flex circuit package of claim 5 wherein the second terminals provide an electrical interconnection structure for electrical connection to a second electronic component structure.
8. The flex circuit package of claim 1 wherein the columns directly contact the first traces and the first terminals.
9. The flex circuit package of claim 1 wherein the columns protrude above a principal surface of the package body.
10. A flex circuit package comprising:
an electronic component mounted to a first surface of a substrate;
first traces on the first surface of the substrate, the first traces being electrically connected to the electronic component;
a package body enclosing the electronic component and the first surface of the substrate; and
interconnection ball stacks physically and electrically connected to the first traces, the interconnection ball stacks comprising non-collapsing material extending through the package body, the interconnection ball stacks comprising at least three interconnection balls stacked one upon another.
11. The flex circuit package of claim 10 further comprising through via apertures formed in the package body prior to formation of the interconnection ball stacks, the interconnection ball stacks being formed in the through via apertures.
12. The flex circuit package of claim 10 wherein the package body is formed after the interconnection ball stacks are formed such that the package body completely encloses the interconnection ball stacks.
13. The flex circuit package of claim 10 further comprising a flexible circuit connector having first terminals in contact with the interconnection ball stacks.
14. A flex circuit package comprising:
an electronic component mounted to a first surface of a substrate;
first traces on the first surface of the substrate, the first traces being electrically connected to the electronic component;
a package body enclosing the electronic component and the first surface of the substrate; and
columns physically and electrically connected to the first traces, the columns comprising non-collapsing material extending through the package body, the columns comprising:
spherical portions enclosed within the packaged body; and
necks between the spherical portions, the necks having a smaller diameter than the spherical portions.
15. The flex circuit package of claim 1 wherein the non-collapsing material comprises copper.
16. The flex circuit package of claim 1 wherein the non-collapsing material has a higher melting temperature than solder.
17. The flex circuit package of claim 10 wherein the non-collapsing material comprises copper.
18. The flex circuit package of claim 10 wherein the non-collapsing material has a higher melting temperature than solder.
19. The flex circuit package of claim 14 wherein the non-collapsing material comprises copper.
20. The flex circuit package of claim 14 wherein the non-collapsing material has a higher melting temperature than solder.