Method of manufacting an electronic device module with integrated antenna structure
An electronic device module as described herein includes an electronic device package having device contacts. The electronic device module can be manufactured by providing an electrically conductive ground plane having a device opening for an electronic device package, and having an antenna ground section. The manufacturing method continues by embedding the ground plane and the electronic device package in encapsulating material such that device contacts of the electronic device package and a first side of the ground plane reside at a device mounting surface. Thereafter, an antenna circuit structure is formed overlying the device mounting surface. The antenna circuit structure includes an antenna signal element that cooperates with the antenna ground section to form an integrated antenna for the electronic device module.
1. A method of fabricating an electronic device module, the method comprising:
attaching an electronic device package to a temporary carrier structure;
affixing an electrically conductive ground element to the temporary carrier structure, the ground element having defined therein a device opening for the electronic device package and an antenna opening;
applying an encapsulating material overlying the temporary carrier structure, the electronic device package, and the ground element;
thereafter removing the temporary carrier structure to expose a device mounting surface, wherein the ground element and device contacts of the electronic device package are exposed at the device mounting surface; and
thereafter forming an antenna circuit structure overlying the ground element and the device contacts, the antenna circuit structure comprising a patch antenna signal element, wherein a projection of the patch antenna signal element onto the device mounting surface resides within the antenna opening.
2. The method of claim 1 , wherein the forming step forms the antenna circuit structure with an antenna feed line coupled between the patch antenna signal element and one of the device contacts of the electronic device package.
3. The method of claim 1 , wherein the forming step forms the antenna circuit structure with a patch antenna ground element, wherein a projection of the patch antenna ground element onto the device mounting surface resides outside the antenna opening.
4. The method of claim 3 , wherein the forming step forms the antenna circuit structure with conductive plugs between the ground element and the patch antenna ground element.
5. The method of claim 1 , wherein the forming step forms the antenna circuit structure with a device signal line coupled between one of the device contacts of the electronic device package and a conductive plug formed in the encapsulating material.
6. The method of claim 1 , further comprising:
creating a conductive plug in the encapsulating material, the conductive plug terminating at the ground element; and
fabricating an interface circuit structure overlying the encapsulating material, the interface circuit structure comprising a conductive feature coupled to the conductive plug.
7. The method of claim 1 , further comprising:
creating a conductive plug in the encapsulating material, the conductive plug terminating at a location corresponding to the device mounting surface; and
fabricating an interface circuit structure overlying the encapsulating material, the interface circuit structure comprising a conductive feature coupled to the conductive plug.
8. The method of claim 1 , wherein the forming step forms the antenna circuit structure with an antenna access opening, and wherein at least a portion of the patch antenna signal element is exposed through the antenna access opening.
9. The method of claim 1 , further comprising forming a protection layer overlying at least the device contacts of the electronic device package.
10. A method of forming an electronic device module, the method comprising:
providing an electrically conductive ground plane, the ground plane comprising a device opening for an electronic device package, and the ground plane comprising an antenna ground section;
embedding the ground plane and the electronic device package in encapsulating material such that device contacts of the electronic device package and a first side of the ground plane reside at a device mounting surface; and
thereafter forming an antenna circuit structure overlying the device mounting surface, the antenna circuit structure comprising an antenna signal element that cooperates with the antenna ground section to form an integrated antenna for the electronic device module.
11. The method of claim 10 , wherein:
the providing step creates the ground plane with an antenna opening; and
the forming step forms a patch antenna signal element, wherein a projection of the patch antenna signal element onto the device mounting surface resides within the antenna opening.
12. The method of claim 10 , further comprising:
providing a temporary carrier structure;
attaching the electronic device package to the temporary carrier structure; and
affixing the ground plane to the temporary carrier structure; wherein
the embedding step comprises applying the encapsulating material overlying the temporary carrier structure, the electronic device package, and the ground plane.
13. The method of claim 12 , wherein the forming step forms the antenna circuit structure with an antenna feed line that couples the antenna signal element to one of the device contacts of the electronic device package.
14. The method of claim 10 , further comprising:
creating a conductive plug in the encapsulating material, the conductive plug terminating at the ground plane; and
fabricating an interface circuit structure overlying the encapsulating material, the interface circuit structure comprising a conductive feature coupled to the conductive plug.
15. The method of claim 10 , further comprising:
creating a conductive plug in the encapsulating material, the conductive plug terminating at the device mounting surface; and
fabricating an interface circuit structure overlying the encapsulating material, the interface circuit structure comprising a conductive feature coupled to the conductive plug.
16. The method of claim 10 , wherein:
the ground plane comprises a second device opening for a second electronic device package, and a second antenna ground section;
the embedding step embeds the ground plane, the electronic device package, and the second electronic device package in the encapsulating material; and
the forming step forms a second antenna circuit structure comprising a second antenna signal element that cooperates with the second antenna ground section to form a second integrated antenna.
17. The method of claim 16 , further comprising separating the electronic device module into different sub-modules, wherein a first sub-module includes the electronic device package, the antenna ground section, and the antenna circuit structure, and wherein a second sub-module includes the second electronic device package, the second antenna ground section, and the second antenna circuit structure.