Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer
View Patent ↗A semiconductor device structure has a semiconductor die that has a bond pad with a passivation layer surrounding a portion of the bond pad. A nickel layer, which is deposited, is on the inner portion. A space is between a sidewall of the nickel layer and the passivation layer and extends to the bond pad. A palladium layer is over the nickel layer and fills the space. The space is initially quite small but is widened by an isotropic etch so that when the palladium layer is deposited, the space is sufficiently large so that the deposition of palladium is able to fill the space. Filling the space results in a structure in which the palladium contacts the nickel layer, the passivation layer and the bond pad.
1. A method for forming over pad metallization (OPM) on a semiconductor die having a bond pad in which the bond pad has an inner portion surrounded by a passivation layer, comprising:
depositing a nickel layer on the bond pad, wherein a lack of adhesion between the nickel layer and the passivation layer results in a space between the nickel layer and the passivation layer down to the bond pad;
applying an isotropic etchant selective for nickel to the nickel layer to widen the space between the nickel layer and the passivation layer down to the bond pad; and
depositing a palladium layer on the nickel layer and in the space so as to be in contact, in the space, with the bond pad, the passivation layer, and the nickel layer.
2. The method of claim 1 , further comprising depositing a gold layer on the palladium layer.
3. The method of claim 2 , further comprising forming a ball bond on the gold layer.
4. The method of claim 1 , further comprising forming a ball bond on the palladium layer.
5. The method of claim 1 , wherein the applying an isotropic etchant comprises applying a wet etchant that etches nickel selective to the passivation layer and the bond pad.
6. The method of claim 1 , wherein the bond pad comprises one of a group consisting of aluminum and copper.
7. The method of claim 1 , wherein the passivation layer comprises nitride and polyimide.
8. The method of claim 1 , wherein the depositing the nickel layer is further characterized by the nickel layer extending above a height of the passivation layer.
9. The method of claim 8 , wherein the step of depositing the nickel layer is further characterized by the nickel layer extending over a portion of the passivation layer.
10. The method of claim 1 , wherein:
the semiconductor die further comprises a second bond pad;
the passivation layer surrounds an inner portion of the second bond pad;
the step of depositing a nickel layer includes depositing a second nickel layer on the second bond pad;
the step of applying an isotropic etchant to the nickel layer additionally widens a space between the second nickel layer and the passivation layer down to the second bond pad; and
the step of depositing a palladium layer includes depositing an additional palladium layer on the second nickel layer;
the bond pad is adjacent to the second bond pad; and
a closest distance between the space between the second nickel layer and the passivation layer at the second bond pad and the space between the nickel layer and the passivation layer at the bond pad is not more than four microns.