Top feature package and method

1. An electronic component package comprising:

a substrate comprising a first surface;

an electronic component mounted to the first surface, the electronic component comprising a bond pad;

a first antenna terminal on the first surface electrically connected to the bond pad;

a second antenna terminal on the first surface electrically connected to the first antenna terminal;

a dielectric package body directly contacting and enclosing the electronic component and the first surface, the package body comprising a principal surface;

an antenna on the principal surface; and

an embedded interconnect extending through the package body between the first surface and the principal surface and electrically connecting the second antenna terminal to the antenna.

2. The electronic component package of claim 1 further comprising:

a via aperture in the package body, wherein the embedded interconnect comprises an electrically conductive material filling the via aperture.

3. The electronic component package of claim 2 wherein the via aperture is formed by ablating the package body with a laser.

4. The electronic component package of claim 1 wherein the antenna comprises conductive material applied to the principal surface.

5. The electronic component package of claim 4 wherein the conductive material comprises electrically conductive paint that has been cured.

6. The electronic component package of claim 1 further comprising a shielding structure shielding the electronic component.

7. The electronic component package of claim 6 wherein the shielding structure comprises a shield lid formed directly on and covering a portion of the principal surface directly above the electronic component.

8. The electronic component package of claim 7 wherein the package body further comprises sides, the shielding structure further comprising shield lid sidewalls formed directly on and covering portions of the sides adjacent the electronic component.

9. The electronic component package of claim 8 wherein the shield lid and shield lid sidewalls are formed of an electrically conductive material applied to the portion of the principal surface directly above the electronic component and to the portions of the sides adjacent the electronic component.

10. The electronic component package of claim 8 wherein the substrate further comprises sides, the shield lid sidewalls formed directly on and covering portions of the sides of the substrate adjacent the electronic component.

11. The electronic component package of claim 7 further comprising:

a shield trace on the first surface of the substrate, wherein the shielding structure further comprises a shield lid interconnect extending from the shield trace to the shield lid through the package body and electrically connecting the shield trace to the shield lid.

12. The electronic component package of claim 11 wherein the shield lid interconnect comprises one or more wires.

13. The electronic component package of claim 6 wherein the shielding structure comprises a metal can enclosed in the package body.

14. An electronic component package comprising:

a substrate comprising a first surface;

an electronic component mounted to the first surface, the electronic component comprising a bond pad;

a first trace on the first surface electrically connected to the bond pad;

a package body directly contacting and enclosing the electronic component and the first surface, the package body comprising a principal surface;

an electrically conductive conformal shield on the package body;

a shield isolation layer on the conformal shield;

a conformal top feature layer on the shield isolation layer; and

an embedded interconnect extending through the package body between the first surface and the principal surface and electrically connecting the first trace to the conformal top feature layer.

15. The electronic component package of claim 14 wherein the conformal shield comprises a conformal shield opening and wherein the shield isolation layer comprises a shield isolation layer opening, the embedded interconnect being exposed through the conformal shield opening and the shield isolation layer opening.

16. The electronic component package of claim 15 wherein the conformal top feature layer is formed within the shield isolation layer opening and the conformal shield opening to directly contact and be electrically connected to the embedded interconnect.

17. The electronic component package of claim 14 wherein the conformal shield is electrically connected to a ground plane of the substrate.

18. The electronic component package of claim 17 wherein the conformal top feature layer comprises a top feature connected to the embedded interconnect.

19. The electronic component package of claim 18 wherein the top feature is selected from the group consisting of a trace and an antenna.

20. A method of forming an electronic component package comprising:

mounting an electronic component to a first surface of a substrate;

electrically connecting a bond pad of the electronic component to a first trace on the first surface;

directly contacting and enclosing the electronic component and the first surface in a package body, the package body comprising a principal surface;

forming an electrically conductive conformal shield on the package body;

forming a shield isolation layer on the conformal shield;

forming a conformal top feature layer on the shield isolation layer; and

electrically connecting the first trace to the conformal top feature layer with an embedded interconnect extending through the package body between the first surface and the principal surface.