Techniques for controlling a direct injection semiconductor memory device
View Patent ↗Techniques for controlling a direct injection semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for controlling a direct injection semiconductor memory device. The method may comprise applying a first voltage potential to a first region via a bit line and applying a second voltage potential to a second region of the memory device via a source line. The method may also comprise applying a control voltage potential to a body region of the memory device via a word line that is spaced apart and capacitively coupled to the body region, wherein the body region is electrically floating and disposed between the first region and the second region. The method may further comprise applying a third voltage potential to a third region of the memory device via a carrier injection line in order to bias at least one of the first region, the second region, the third region, and the body region to perform one or more operations.
1. A method of controlling a direct injection semiconductor memory device comprising:
applying a first voltage potential to a first region via a bit line;
applying a second voltage potential to a second region of the memory device via a source line;
applying a control voltage potential to a body region of the memory device via a word line that is spaced apart and capacitively coupled to the body region, wherein the body region is electrically floating and disposed between the first region and the second region; and
applying a third voltage potential to a third region of the memory device via a carrier injection line in order to bias at least one of the first region, the second region, the third region, and the body region to perform one or more operations.
2. The method according to claim 1 , wherein the first region, the body region, and the second region forms a first bipolar transistor.
3. The method according to claim 1 , wherein the body region, the second region, and the third region forms a second bipolar transistor.
4. The method according to claim 1 , wherein the carrier injection line surrounds the third region.
5. The method according to claim 1 , wherein the bit line extends horizontally parallel to the source line.
6. The method according to claim 1 , wherein the word line extends horizontally parallel to the carrier injection line.
7. The method according to claim 1 , further comprising a fourth region of the memory device disposed between the third region and a substrate.
8. The method according to claim 7 , wherein the fourth region is an N-doped region and the substrate is a P-type substrate.
9. The method according to claim 1 , wherein the first region and the second region are N-doped regions.
10. The method according to claim 1 , wherein the body region and the third region are P-doped regions.
11. The method according to claim 1 , further comprising increasing at least the second voltage potential applied to the second region to read a data state of the memory device.
12. The method according to claim 11 , wherein increasing at least the second voltage potential applied to the second region comprises increasing the second voltage potential from a low positive voltage to a high positive voltage to read the data state of the memory device.
13. The method according to claim 11 , further comprising increasing at least the control voltage potential applied to the body region to read the data state of the memory device.
14. The method according to claim 13 , wherein increasing at least the control voltage potential applied to the body region comprises increasing the control voltage potential from a high negative voltage to a high positive voltage to read the data state of the memory device.
15. The method according to claim 1 , further comprising increasing at least the control voltage potential applied to the body region to write a logic low data state to the memory device.
16. The method according to claim 15 , further comprising lowering at least the control voltage potential applied to the body region after increasing the control voltage potential applied to the body region to write a logic high data state to the memory device.
17. The method according to claim 15 , further comprising increasing at least the second voltage potential applied to the second region in order to prevent a forward bias a junction between the second region and the third region to maintain the logic low data state written to the memory device.
18. The method according to claim 1 , further comprising increasing at least the third voltage potential applied to the third region to forward bias a junction between the second region and the third region to write a logic high data state to the memory device.
19. The method according to claim 18 , wherein maintaining the second voltage potential applied to the second region at substantially the same voltage potential further allows a logic high data state to be written to the memory device.
20. The method according to claim 18 , wherein the logic high data state is written to the memory device after a logic low data state is written to the memory device.
21. The method according to claim 1 , further comprising decreasing the control voltage potential below at least one of the first voltage potential, the second voltage potential, and the third voltage potential during a hold operation.