Insulated gate bipolar transistor
View Patent ↗In some embodiments, an insulated gate bipolar transistor includes a drift layer, insulation gates formed at a principle surface portion of the drift layer, base regions formed in a between-gate region, an emitter region formed in the base region so as to be adjacent to the insulation gate, an emitter electrode connected to the emitter region, a collector layer formed at the other side of the principle surface portion of the drift layer, and a collector electrode connected to the collector layer. The conductive type base regions are separated with each other by the drift layers, and the drift layer and the emitter electrode are insulated by an interlayer insulation film.
1. An insulated gate bipolar transistor comprising:
a first conductive type drift layer;
a plurality of gate electrodes formed at a principle surface portion of the drift layer so as to extend in a first direction and arranged in parallel with each other in a second direction perpendicular to the first direction;
a plurality of second conductive type base regions each formed in a between-gate region sandwiched by and between a pair of adjacent gate electrodes;
a first conductive type emitter region formed in the base region so as to be adjacent to the gate electrodes;
an emitter electrode connected to the emitter region;
a second conductive type collector layer formed at the other side of the principle surface portion of the drift layer;
a collector electrode connected to the collector layer,
an interlayer insulation film which is located over and covers the gate electrode; and
a hole discharge control region formed only on a side surface of the base region in the second direction,
wherein the plurality of second conductive type base regions are separated with each other in the first direction by the drift layer, and
wherein the drift layer and the emitter electrode are insulated by the interlayer insulation film.
2. The insulated gate bipolar transistor as recited in claim 1 , wherein the gate electrodes is formed in a trench that is formed from the principle surface portion of the drift layer so as to be deeper than the base region.
3. The insulated gate bipolar transistor as recited in claim 1 , wherein the emitter region and the drift layer are separated by the base region.
4. The insulated gate bipolar transistor as recited in claim 1 , wherein in the adjacent between-gate regions, the base regions are arranged in a shifted manner in the second direction.
5. The insulated gate bipolar transistor as recited in claim 1 , further comprising:
a body region which separates the emitter region into two emitter regions.
6. The insulated gate bipolar transistor as recited in claim 1 , wherein the interlayer insulation film is located directly over the gate electrode and extends beyond the gate electrode.