IP Library Granted Patent US 8,315,026
Granted Patent B2
US 8,315,026 · App. 12/745,973 · Granted Nov 20, 2012

Semiconductor device and apparatus including semiconductor device

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Quick Facts
Patent No.
US 8,315,026
App. No.
12/745,973
Granted
Nov 20, 2012
Kind
B2
Abstract

A semiconductor device includes a substrate on which an electronic circuit is provided. Two or more pads may be present which can connect the electronic circuit to an external device outside the substrate. A current meter is electrically in contact with at least a part of the substrate and/or the pad. The meter can measure a parameter forming a measure for an aggregate amount of a current flowing between the substrate and said pads. A control unit is connected to the current meter and the electronic circuit, for controlling the electronic circuit based on the measured parameter.

Claims (32)

1. A semiconductor device, comprising:

a substrate on which an electronic circuit is provided;

at least two pads for connecting the electronic circuit to an external device outside the substrate;

a current sensor for sensing a parameter forming a measure for a total amount of current flowing between said substrate and said pads; and

a control unit connected to said current sensor and said electronic circuit, for controlling said electronic circuit based on said total amount of current.

2. A semiconductor device as claimed in claim 1 , wherein said electronic circuit has a normal mode and at least two non-normal modes, and wherein said control unit comprises:

a selection unit connected to said current meter, for selecting a non-normal mode based on said measured parameter and

a mode-controller connected to said selection unit and, for controlling said electronic circuit to be in a selected non-normal mode.

3. A semiconductor device as claimed in claim 1 , wherein said electronic circuit includes a logic circuit which forms said mode-controller.

4. A semiconductor device as claimed in claim 1 , wherein said current sensor includes a sensor portion of said substrate positioned between at least one of the said pads and said electronic circuit, said portion being part of a path for said injected current.

5. A semiconductor device as claimed in claim 1 , wherein at least a pad portion of said substrate surrounding at least one pad of said at least two pads is provided with a doping of a first type and said portion is provided with a doping of a second type.

6. A semiconductor device as claimed in claim 4 , wherein said sensor portion surrounds a circuit region of the substrate, in which circuit region said electronic circuit is present.

7. A semiconductor device as claimed in claim 1 , wherein said electronic circuit includes a logic circuit and said current meter includes an analogue to digital converter connected to the logic circuit.

8. A semiconductor device as claimed in claim 7 , wherein the analogue to digital converter is part of the electronic circuit.

9. A semiconductor device as claimed in claim 1 , wherein said substrate includes a barrier between at least one pad of said at least two pads and the electronic circuit, said barrier at least partially inhibiting a current flow between the at least one pad and the electronic circuit.

10. A semiconductor device as claimed in claim 1 , comprises:

a sensor for sensing said current flowing between said substrate and at least one of said at least two pads;

a detector connected to the sensor, for detecting that said current exceeds a current threshold; and

a current meter controller connected to said detector and to said current meter, for activating said current meter when said current exceeds said threshold.

11. A semiconductor device as claimed in claim 1 , comprising:

a sensor for sensing said current flowing between said substrate and at least one of said at least two pads;

a detector connected to the sensor, for detecting that said current exceeds a current threshold and outputting to said electronic circuit a signal suitable to be processed by said electronic circuit when said current exceeds said threshold.

12. A semiconductor device as claimed in claim 1 , wherein said electronic circuit includes one or more of the group consisting of:

microprocessor, central processing unit, coprocessor, digital signal processor, embedded processor, microcontroller.

13. An apparatus including a semiconductor device as claimed in claim 1 .

14. A semiconductor device as claimed in claim 2 , wherein said electronic circuit includes a logic circuit which forms said mode-controller.

15. A semiconductor device as claimed in claim 2 , wherein said current sensor includes a sensor portion of said substrate positioned between at least one of said two said pads and said electronic circuit, said portion being part of a path for said injected current.

16. A semiconductor device as claimed in claim 3 , wherein said current sensor includes a sensor portion of said substrate positioned between at least one pad of said at least two pads and said electronic circuit, said portion being part of a path for said injected current.

17. A semiconductor device as claimed in claim 2 , wherein at least a pad portion of said substrate surrounding at least one pad of said at least two pads is provided with a doping of a first type and said portion is provided with a doping of a second type.

18. A semiconductor device as claimed in claim 3 , wherein at least a pad portion of said substrate surrounding at least one pad of said at least two pads is provided with a doping of a first type and said portion is provided with a doping of a second type.

19. A semiconductor device as claimed in claim 4 , wherein at least a pad portion of said substrate surrounding at least one pad of said at least two pads is provided with a doping of a first type and said portion is provided with a doping of a second type.

20. A semiconductor device as claimed in claim 2 , wherein said electronic circuit includes a logic circuit and said current meter includes an analogue to digital converter connected to the logic circuit.

Assignments (26)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041354/0148 →
CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040652/0180 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →