IP Library Granted Patent US 8,282,985
Granted Patent B2
US 8,282,985 · App. 12/764,607 · Granted Oct 9, 2012

Flow-fill spacer structures for flat panel display device

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Quick Facts
Patent No.
US 8,282,985
App. No.
12/764,607
Granted
Oct 9, 2012
Kind
B2
Abstract

A preferred embodiment of the invention is directed to support structures such as spacers used to provide a uniform distance between two layers of a device. In accordance with a preferred embodiment, the spacers may be formed utilizing flow-fill deposition of a wet film in the form of a precursor such as silicon dioxide. Formation of spacers in this manner provides a homogenous amorphous support structure that may be used to provide necessary spacing between layers of a device such as a flat panel display.

Claims (26)

1. A method of forming a structure on a display component, comprising:

depositing photoresist on the display component;

forming an opening in the photoresist, wherein the opening extends to the substrate; and

flow-fill depositing a substantially liquid sol-gel precursor in the opening.

2. The method of forming a structure on a display component as recited in claim 1 , wherein the flow-fill depositing step further comprises depositing silicon dioxide (SiO 2 ) doped with a material from the group of boron (B) and phosphor (P).

3. The method of forming a structure on a display component as recited in claim 1 , wherein the flow-fill depositing step comprises:

initially cooling the display component;

mixing separated reactive gases; and

depositing a sol-gel precursor over the photoresist.

4. The method of forming a structure on a display component as recited in claim 3 , wherein the flow-fill depositing step comprises initially cooling the display component to a temperature between 0° C. and 50° C.; mixing silane (SiH 4 ) gas and hydrogen peroxide (H 2 O 2 ); and depositing a wet-film sol-gel precursor in the opening of the photoresist.

5. The method of forming a structure on a display component as recited in claim 1 , wherein the flow-fill depositing step comprises initially cooling the display component to a temperature between 0° C. and 50° C.

6. The method of forming a structure on a display component as recited in claim 1 , further comprising forming structures having a substantially circular cross-section normal to the surface of the substrate.

7. A method of fabricating a flat panel display having a cathode and a faceplate, comprising:

depositing a first photoresist on the faceplate;

depositing a patterned second photoresist on the first photoresist, wherein the second photoresist exposes a portion of the first photoresist;

exposing the second photoresist and the portion of the first photoresist to a light source;

removing exposed portions of the first and second photoresist, wherein removing defines an opening in the first photoresist down to the faceplate;

flow-fill depositing a wet sol-gel on the first photoresist and in the opening;

baking the sol-gel into a solid silicon oxide;

removing the silicon oxide on the first photoresist while retaining the silicon oxide in the opening;

removing remains of the first photoresist while retaining remains of the silicon oxide; and

assembling the flat panel display with the cathode and the faceplate separated by the spacers.

8. The method in claim 7 , wherein the act of removing the silicon oxide comprises planarizing.

9. The method in claim 7 , further comprising prior to the act of flow-fill depositing a wet sol-gel, depositing an underlayer on the faceplate.

10. The method in claim 9 , wherein the act of depositing an underlayer on the faceplate is performed using plasma enhanced chemical vapor deposition (PECVD).

11. The method in claim 10 , further comprising after the act of flow-fill depositing a wet sol-gel, forming an oxide capping layer over the spacers on the faceplate using PECVD.

Assignments (6)
RELEASE OF U.S. PATENT AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Oct 12, 2018
From: ROYAL BANK OF CANADA, AS LENDER
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 047645/0424 →
U.S. PATENT SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Sep 9, 2014
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CPPIB CREDIT INVESTMENTS INC., AS LENDER; ROYAL BANK OF CANADA, AS LENDER
Reel/Frame 033706/0367 →
CHANGE OF ADDRESS Recorded Sep 3, 2014
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 033678/0096 →
RELEASE OF SECURITY INTEREST Recorded Aug 7, 2014
From: ROYAL BANK OF CANADA
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.; CONVERSANT IP N.B. 868 INC.; CONVERSANT IP N.B. 276 INC.
Reel/Frame 033484/0344 →
CHANGE OF NAME Recorded Mar 13, 2014
From: MOSAID TECHNOLOGIES INCORPORATED
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 032439/0638 →
U.S. INTELLECTUAL PROPERTY SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) - SHORT FORM Recorded Jan 10, 2012
From: 658276 N.B. LTD.; 658868 N.B. INC.; MOSAID TECHNOLOGIES INCORPORATED
To: ROYAL BANK OF CANADA
Reel/Frame 027512/0196 →