Semiconductor device and fabricating method thereof
View Patent ↗A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.
1. A semiconductor device comprising:
a semiconductor die comprising a first surface comprising a bond pad;
a dielectric directly covering at least the first surface of the semiconductor die, wherein the bond pad is exposed to the outside through an opening in the dielectric, the opening comprising:
a first opening formed at a position corresponding to the bond pad;
a second opening coupled to the first opening and having a diameter larger than the first opening; and
a first surface of the dielectric between the first opening and the second opening; and
a conductive pattern plated on the bond pad and filling the opening of the dielectric, wherein a first surface of the conductive pattern and a first exposed outer surface of the dielectric are coplanar.
2. The semiconductor device of claim 1 further comprising an encapsulant encapsulating the semiconductor die.
3. The semiconductor device of claim 2 wherein the encapsulant encapsulates a second surface and lateral surfaces of the semiconductor die and exposes the first surface of the semiconductor die.
4. The semiconductor device of claim 3 wherein a first surface of the encapsulant and the first surface of the semiconductor die are coplanar.
5. The semiconductor device of claim 4 wherein the dielectric encloses the first surface of the encapsulant and the first surface of the semiconductor die.
6. The semiconductor device of claim 1 wherein the second opening is slanted.
7. The semiconductor device of claim 1 wherein the conductive pattern comprises:
a via region coupled to the bond pad;
a land region; and
a connecting region coupling the via region to the land region.
8. The semiconductor device of claim 1 further comprising a dummy wafer comprising a first surface, a second surface of the semiconductor die being coupled to the first surface of the dummy wafer.
9. The semiconductor device of claim 8 wherein the dielectric encloses lateral surfaces of the semiconductor die and the first surface of the dummy wafer.
10. A semiconductor device comprising:
a semiconductor die comprising a first surface comprising a bond pad;
a dielectric directly covering at least the first surface of the semiconductor die, wherein the bond pad is exposed to the outside through an opening in the dielectric, the opening comprising:
a first opening formed at a position corresponding to the bond pad;
a second opening coupled to the first opening and having a diameter larger than the first opening; and
a first surface of the dielectric between the first opening and the second opening; and
a conductive pattern filling the opening of the dielectric, wherein a first surface of the conductive pattern and a first exposed outer surface of the dielectric are coplanar.
11. The semiconductor device of claim 10 wherein the second opening is slanted.
12. The semiconductor device of claim 10 wherein the second opening is non-perpendicular to the first exposed outer surface of the dielectric.
13. The semiconductor device of claim 10 wherein the first surface of the opening is planar.
14. A semiconductor device comprising:
a semiconductor die comprising a first surface comprising a bond pad;
a dielectric directly covering at least the first surface of the semiconductor die;
a conductive pattern in an opening of the dielectric, wherein a first surface of the conductive pattern and a first exposed outer surface of the dielectric are coplanar, the conductive pattern comprising:
a via region connected to the bond pad;
a land region having a diameter larger than the via region; and
a connecting region connecting the via region and the land region.
15. The semiconductor device of claim 14 , wherein the opening comprises:
a first opening formed at a position corresponding to the bond pad;
a second opening coupled to the first opening and having a diameter larger than the first opening; and
a first surface of the dielectric between the first opening and the second opening.
16. The semiconductor device of claim 15 wherein the via region is within the first opening.
17. The semiconductor device of claim 15 wherein the land region is within the second opening.
18. The semiconductor device of claim 15 wherein the connecting region is on the first surface of the opening.