METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

1 . A method of manufacturing a semiconductor device comprising:

forming a first bond of a first wire loop;

bonding a wire through a ball to a lead or a chip electrode of a semiconductor chip to form a second bond of said first wire loop and a first bond of a second wire loop; and

forming a second bond of said second wire loop.

2 . The method of manufacturing a semiconductor device according to claim 1 , wherein said wire includes:

a first portion which forms said wire loop;

a second portion which forms said wire loop; and

a middle portion between said first portion and said second portion,

further comprising melting said middle portion to form said ball on said wire.

3 . The method of manufacturing a semiconductor device according to claim 2 , further comprising:

fixing said wire by the clip; and

forming a bent portion in said middle portion by using said clip,

said bent portion is melt in said melting said middle portion.

4 . The method of manufacturing a semiconductor device according to claim 1 , further comprising forming said ball on said chip electrode or said lead, and

wherein said wire is bonded to said ball in said bonding said wire.

5 . The method of manufacturing a semiconductor device according to claim 1 , further comprising:

bonding said wire through a ball to said lead to form said second bond of said second wire loop and a first bond of a third wire loop;

bonding said wire through a ball to another chip electrode of said semiconductor chip to form a second bond of said third wire loop and a first bond of a fourth wire loop; and

forming a second bond of said fourth wire loop on said lead,

wherein said wire is bonded through a ball to said lead in said forming said first bond of said first wire loop, and

said wire is bonded to said chip electrode to form said second bond of said first wire loop and said first bond of said second wire loop.

6 . A method of operating a wire bonding apparatus comprising:

fixing by a clip, a wire extending from a tip of a capillary;

forming a bent portion in said wire between said clip and said capillary;

melting said bent portion to form a ball on said wire; and

bonding said ball to one of a lead and a chip electrode of a semiconductor chip by using said capillary.

7 . The method of operating a wire bonding apparatus according to claim 6 , further comprising:

feeding said wire from said tip of said capillary after said bonding said ball; and

bonding a fed portion of said wire, which is fed in said feeding said wire, to another of said lead and said chip electrode,

wherein said wire is not cut between said bonding said ball and said bonding said fed portion.

8 . A wire bonding apparatus comprising:

a capillary;

a clip configured to fix a wire extending from a tip of said capillary; and

an energy providing device configured to provide energy to melt said wire to form a ball on said wire.

9 . The wire bonding apparatus according to claim 8 , wherein said clip and said capillary are configured to form a bent portion in said wire between said clip and said capillary, and

said energy providing device melts said bent portion to form said ball.