IP Library Granted Patent US 8,310,029
Granted Patent B2
US 8,310,029 · App. 12/801,214 · Granted Nov 13, 2012

Group III nitride semiconductor free-standing substrate and method of manufacturing the same, group III nitride semiconductor device and method of manufacturing the same

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Quick Facts
Patent No.
US 8,310,029
App. No.
12/801,214
Granted
Nov 13, 2012
Kind
B2
Abstract

A group III nitride semiconductor free-standing substrate includes an as-grown surface, more than half of a region of the as-grown surface including a single crystal plane. The single crystal plane includes an off-angle inclined in an m-axis or a-axis direction from a C-plane with a group III polarity, or in a c-axis or a-axis direction from an M-plane.

Claims (20)

1. A group III nitride semiconductor free-standing substrate, comprising:

an as-grown surface, more than half a region of the as-grown surface comprising a single crystal face,

wherein said single crystal face comprises an off-angle in a c-axis direction or an a-axis direction from a M-plane with a group III polarity.

2. A group III nitride semiconductor device, comprising:

a group III nitride semiconductor layer over the group III nitride semiconductor free-standing substrate according to claim 1 .

3. A group III nitride semiconductor free-standing substrate, comprising:

an as-grown surface, more than half a region of the as-grown surface comprising a single crystal face,

wherein said single crystal face comprises an off-angle in an m-axis direction from a C-plane with a group III polarity.

4. A group III nitride semiconductor device, comprising

a group III nitride semiconductor layer over the group III nitride semiconductor free-standing substrate according to claim 3 .

5. The group III nitride semiconductor free-standing substrate according to claim 3 , wherein the as-grown surface comprises a crystal surface in a state that a crystal is grown other than being subjected to a grinding and a polishing thereon.

6. A group III nitride semiconductor free-standing substrate, comprising:

an as-grown surface, more than half a region of the as-grown surface comprising a single crystal face,

wherein said single crystal face comprises an off-angle in an a-axis direction from a C-plane with a group III polarity.

7. A group III nitride semiconductor device, comprising

a group III nitride semiconductor layer over the group III nitride semiconductor free-standing substrate according to claim 6 .

8. The group III nitride semiconductor free-standing substrate according to claim 6 , wherein the as-grown surface comprises a crystal surface in a state that a crystal is grown other than being subjected to a grinding and a polishing thereon.

9. The group III nitride semiconductor free-standing substrate according to claim 1 , wherein the off-angle is in the c-axis direction from the M-plane.

10. The group III nitride semiconductor free-standing substrate according to claim 1 , wherein the off-angle is in the a-axis direction from the M-plane.

11. The group III nitride semiconductor free-standing substrate according to claim 1 , wherein the as-grown surface comprises a crystal surface in a state that a crystal is grown other than being subjected to a grinding and a polishing thereon.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037827/0453 →
COMPANY SPLIT Recorded Jul 24, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036181/0104 →
MERGER AND CHANGE OF NAME Recorded Dec 15, 2014
From: HITACHI CABLE, LTD.; HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 034630/0897 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2010
From: FUJIKURA, HAJIME; ERI, TAKESHI
To: HITACHI CABLE, LTD.
Reel/Frame 024498/0806 →