IP Library Granted Patent US 8,320,155
Granted Patent B2
US 8,320,155 · App. 12/801,539 · Granted Nov 27, 2012

Semiconductor integrated circuit device

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Quick Facts
Patent No.
US 8,320,155
App. No.
12/801,539
Granted
Nov 27, 2012
Kind
B2
Abstract

A memory device including memory cells each have two transistors and one storage element connected in series in this order between a corresponding one of bit lines and a constant voltage. The two transistors respectively have gate electrodes respectively connected to a corresponding one of first word lines and a corresponding one of second word lines. A memory array includes mats each having the memory cells disposed at all intersections between the bit lines and the first word lines, sense amplifiers each input with a corresponding pair of the bit lines in the same mat as a bit line pair, and first and second word drivers adapted to activate the first and second word lines, respectively.

Claims (32)

1. A semiconductor integrated circuit device comprising a memory array comprising:

mats each comprising memory cells each having two transistors and one storage element connected in series in this order between a corresponding one of bit lines and a constant voltage, said two transistors respectively having gate electrodes respectively connected to a corresponding one of first word lines orthogonal to said bit lines and a corresponding one of second word lines parallel to said bit lines, and said memory cells disposed at all intersections between said bit lines and said first word lines;

sense amplifiers each input with a corresponding pair of the bit lines in the same mat as a bit line pair;

first word drivers adapted to activate said first word lines, respectively; and

second word drivers adapted to activate said second word lines, respectively.

2. The semiconductor integrated circuit device according to claim 1 , wherein said two transistors comprise surround gate transistors stacked in two tiers at a same planar position and the memory cell is selected by simultaneously activating the corresponding first and second word lines.

3. The semiconductor integrated circuit device according to claim 1 , wherein said storage element comprises a capacitor and wherein said capacitor comprises a stack capacitor formed above a semiconductor substrate and said bit lines are formed buried in said semiconductor substrate.

4. The semiconductor integrated circuit device according to claim 1 , wherein said storage element comprises a capacitor and wherein said capacitor comprises a trench capacitor formed buried in a semiconductor substrate and said bit lines are formed above said semiconductor substrate.

5. The semiconductor integrated circuit device according to claim 1 , wherein said first word lines are orthogonal to said bit lines, said second word lines are parallel to said bit lines, and said first and second word lines are orthogonal to each other and wherein, by simultaneously selecting and activating the corresponding first and second word lines, the memory cell at the intersection therebetween is selected.

6. The semiconductor integrated circuit device according to claim 1 , wherein each of said sense amplifiers is shared by the corresponding bit line pairs disposed in adjacent mats.

7. The semiconductor integrated circuit device according to claim 6 , wherein said each of said sense amplifiers is shared by the corresponding bit line pairs disposed in each of said adjacent mats.

8. The semiconductor integrated circuit device according to claim 1 , wherein each of said second word drivers is shared between adjacent mats.

9. A method for accessing a semiconductor integrated circuit device comprising a memory array comprising mats each comprising memory cells each having two transistors and one storage element connected in series in this order between a corresponding one of bit lines and a constant voltage, said two transistors respectively having gate electrodes respectively connected to a corresponding one of first word lines orthogonal to said bit lines and a corresponding one of second word lines parallel to said bit lines, and said memory cells disposed at all intersections between said bit lines and said first word lines, sense amplifiers each input with a corresponding pair of the bit lines in the same mat as a bit line pair, first word drivers adapted to activate said first word lines, respectively, and second word drivers adapted to activate said second word lines, respectively, said method comprising:

accessing a first memory cell by selecting the corresponding first and second word lines;

then accessing a second memory cell by non-selecting said second word line;

precharging and equalizing the bit lines; and

selecting the second word line at a different address.

10. The semiconductor integrated circuit device according to claim 1 , wherein each said mat has its own said second word driver.

11. The memory array according to claim 10 , wherein each said mat has its own said second word driver.

12. A semiconductor integrated circuit device comprising:

a bit line;

a first word line;

a second word line; and

a first transistor, a second transistor and a storage element coupled in series between the bit line and a terminal supplying a specific voltage to form a memory cell, a gate of the first transistor coupled to the first word line, and a gate of the second transistor coupled to the second word line.

13. The device according to claim 12 , wherein each of said first and second transistors comprises a surround gate transistor.

14. The device according to claim 12 , further comprising a first word driver coupled to the first word line to drive the first word line, and a second word driver coupled to the second word line to drive the second line.

15. The device according to claim 14 , wherein the first and second word driver respectively drive the first and second word line when a data stored in the storage is read out to the bit line and a data on the bit line is stored to the storage.

16. The device according to claim 12 , wherein the first word line is elongated to a first direction and the bit line is elongated to a second direction different from the first direction.

17. The device according to claim 12 , wherein the first word line is elongated to a first direction and the second word line is elongated to a second direction different from the first direction.

18. The device according to claim 12 , wherein the first transistor, the second transistor and the storage element are vertically arranged.

19. The device according to claim 12 , wherein the storage element is a capacitor.

20. The device according to claim 14 , wherein the first word driver drives the first word line in a first period and the second word driver drives the second word line in a second period different from the first period.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2014
From: ELPIDA MEMORY, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 032645/0422 →