IP Library Granted Patent US 8,507,051
Granted Patent B2
US 8,507,051 · App. 12/805,083 · Granted Aug 13, 2013

Polycrystalline silicon producing method

Inventors: Makoto Urushihara (Nakagun, JP); Kazuki Mizushima (Saitama, JP)
Assignee: Mitsubishi Materials Corporation
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Quick Facts
Patent No.
US 8,507,051
App. No.
12/805,083
Granted
Aug 13, 2013
Kind
B2
Abstract

A polycrystalline silicon producing method includes: the first process and the second process. In the first process, a surface temperature is maintained at a predetermined range by adjusting the current value to the silicon seed rod, and the raw material gas is supplied while maintaining a supply amount of chlorosilanes per square millimeter of the surface of the rod in a predetermined range until a temperature of the center portion of the rod reaches a predetermined temperature lower than the melting point of the polycrystalline silicon, and in the second process, a previously determined current value is set corresponding to a rod diameter and the supply amount of the raw material gas per square millimeter of the surface of the rod is decreased to maintain the surface temperature and the temperature of the center portion of the rod at predetermined ranges, respectively.

Claims (22)

1. A polycrystalline silicon producing method comprising:

supplying electric current to a silicon seed rod in a reactor to make the silicon seed rod to generate heat;

supplying raw material gas including chlorosilanes to the silicon seed rod; and

depositing polycrystalline silicon on a surface of the silicon seed rod to be grown as a rod,

wherein a pressure in the reactor is equal to or greater than 0.4 MPa and equal to or less than 0.9 MPa,

the method includes a first process and a second process,

in the first process, a surface temperature of the rod is maintained at a predetermined range by adjusting the current value in the silicon seed rod, and the raw material gas is supplied while maintaining a supply amount of chlorosilanes per square millimeter of the surface of the rod to be equal to or greater than 2.0×10 -7 mol/sec/mm 2 and equal to or less than 3.5×10 -7 mol/sec/mm 2 until a temperature of the center portion of a rod reaches a predetermined temperature lower than the melting point of the polycrystalline silicon, and

in the second process, after the temperature of the center portion of the rod reaches a predetermined temperature lower than the melting point of the polycrystalline silicon, a previously determined current value is set corresponding to a rod diameter and the supply amount of the raw material gas per square millimeter of the surface of the rod is decreased to maintain the surface temperature and the temperature of the center portion of the rod to be within predetermined ranges, respectively.

2. The polycrystalline silicon producing method according to claim 1 ,

wherein the temperature of the center portion of the rod in the second process is in the range equal to or higher than 1200° C. and equal to or lower than 1300° C.

3. The polycrystalline silicon producing method according to claim 1 ,

wherein the temperature of the inner surface of the reactor is adjusted to be equal to or higher than 250° C. and equal to or lower than 400° C.

4. The polycrystalline silicon producing method according to claim 1 ,

wherein the raw material gas is pre-heated to have a temperature equal to or higher than 200° C. and equal to or lower than 600° C. and then supplied to the reactor.

5. The polycrystalline silicon producing method according to claim 4 ,

wherein the raw material gas is pre-heated to have a temperature equal to or higher than 200° C. and equal to or lower than 400° C. and then supplied to the reactor.

6. The polycrystalline silicon producing method according to claim 5 ,

wherein discharge gas discharged from the reactor and the raw material gas are heat-exchanged to pre-heat the raw material gas.

7. The polycrystalline silicon producing method according to claim 1 ,

wherein in the reactor, a raw material gas supply nozzle is not disposed between a rod positioned at the outermost circumference and the inner surface of the reactor.

8. The polycrystalline silicon producing method according to claim 1 , wherein in the second process, the current value is increased in response to an increasing rod diameter in order to set the previously determined current value.

9. The polycrystalline silicon producing method according to claim 1 , wherein in the second process, a surface temperature of the rod is constant in a range of 1000° C. to 1100° C.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2023
From: MITSUBISHI MATERIALS CORPORATION
To: HIGH-PURITY SILICON CORPORATION
Reel/Frame 063858/0867 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2010
From: URUSHIHARA, MAKOTO; MIZUSHIMA, KAZUKI
To: MITSUBISHI MATERIALS CORPORATION
Reel/Frame 024714/0856 →
Priority Claims (1)
JP 2009-167185 · Jul 15, 2009 · national
Continuity (1)
Related Publication 20110014468A1 · Jan 20, 2011