Method of forming openings in a semiconductor device and a semiconductor device fabricated by the method
View Patent ↗A method of forming openings to a layer of a semiconductor device comprises forming a dielectric layer over the layer of the semiconductor device, and forming a mask over the dielectric layer. The mask comprises a plurality of mask openings arranged in a regular pattern extending over the dielectric layer and the plurality of mask openings include a plurality of first mask openings and a plurality of second mask openings, each of the plurality of first mask openings being greater in size than each of the plurality of second mask openings. The method further comprises reducing the size of the plurality of second mask openings such that each of the second mask openings is substantially closed and removing portions of the dielectric layer through the plurality of first mask openings to provide openings extending through the dielectric layer to the layer.
1. A method of forming openings to a layer of a semiconductor device comprising:
forming a dielectric layer over the layer of the semiconductor device;
forming a mask over the dielectric layer, the mask comprising a plurality of mask openings arranged in a pattern extending over the dielectric layer, the plurality of mask openings including a plurality of first mask openings and a plurality of second mask openings, each of the plurality of first mask openings being greater in size than each of the plurality of second mask openings;
reducing the size of the plurality of second mask openings such that each of the second mask openings is substantially closed, wherein reducing the size of the plurality of second mask openings comprises depositing a polymer over the mask and etching the deposited polymer and repeating the depositing and etching until the second mask openings are substantially closed; and
removing portions of the dielectric layer through the plurality of first mask openings to provide openings extending through the dielectric layer to the layer.
2. A method according to claim 1 , wherein forming a mask comprises:
providing a layout pattern for a layer of a semiconductor device including a plurality of first layout openings and a plurality of second layout openings arranged in a pattern, the size of the second layout openings being less than the size of the first layout openings;
forming a layer of photosensitive material over the dielectric layer; and
transferring the layout pattern to the layer of photosensitive material to form the mask over the dielectric layer, the first layout openings forming the first mask openings and the second layout openings forming the second mask openings.
3. A method according to claim 2 , wherein the providing a layout pattern comprises:
providing a layout pattern for a layer of a semiconductor device including the plurality of first layout openings; and
adding the plurality of second layout openings to the layout pattern such that the layout pattern includes the plurality of first and second layout openings arranged in a pattern.
4. A method according to claim 3 , wherein the providing and adding steps are performed by an OPC process.
5. A method according to claim 1 , wherein the first mask openings correspond to the openings to be formed to the layer.
6. A method according to claim 1 , wherein the pattern is a dense pattern.
7. A method according to claim 1 , wherein a pitch between adjacent first and second mask openings is substantially the same.
8. A method according to claim 1 , wherein the pattern of the plurality of mask openings is orientated with respect to an xy axes of a design layout for the semiconductor device such that a line through the centres of a line of the mask openings is at an angle A that is skewed relative to the x axis of the design layout.
9. A method according to claim 8 , wherein the angle A is 45° or is given by the following equation:
A =ArcTan( O. 5 /N )
where N is an integer (1, 2, 3, . . . ).
10. A method as claimed in claim 1 , further comprising forming an additional layer over the dielectric layer and wherein the openings are arranged to extend between the layer and the additional layer.
11. A method as claimed in any preceding claim 1 , wherein the openings are at least one of contact holes, vias, lines and trenches.
12. A method according to claim 2 , wherein the first mask openings correspond to the openings to be formed to the layer.
13. A method according to claim 3 , wherein the first mask openings correspond to the openings to be formed to the layer.
14. A method according to claim 2 , wherein the pattern is a dense pattern.
15. A method according to claim 3 , wherein the pattern is a dense pattern.
16. A method according to claim 2 , wherein a pitch between adjacent first and second mask openings is substantially the same.
17. A method according to claim 3 , wherein a pitch between adjacent first and second mask openings is substantially the same.
18. A method according to claim 1 , wherein the second mask openings have a size of substantially zero following reducing the size.
19. A method according to claim 1 , wherein, during removing portions of the dielectric layer, the dielectric layer is not removed through the substantially closed second mask openings.
20. A method according to claim 1 , wherein the pattern includes a grid pattern.