IP Library Granted Patent US 8,408,789
Granted Patent B2
US 8,408,789 · App. 12/813,049 · Granted Apr 2, 2013

X-ray analysis apparatus and X-ray analysis method

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Quick Facts
Patent No.
US 8,408,789
App. No.
12/813,049
Granted
Apr 2, 2013
Kind
B2
Abstract

An X-ray analysis apparatus including: a radiation source configured to irradiate an irradiation point on a sample with radiation; an X-ray detector configured to detect a characteristic X-ray emitted from the sample, and output a signal including energy information about the characteristic X-ray; an analyzer configured to analyze the signal; a sample stage configured to allow placement of the sample thereon; a shifting mechanism being capable of relatively shifting the sample on the sample stage and the radiation source and the X-ray detector with respect to each other; a height measuring mechanism being capable of measuring the height of the irradiation point on the sample; and a controller configured to control the shifting mechanism on the basis of the measured height of the irradiation point on the sample and adjust the distance of the sample with respect to the radiation source and the X-ray detector is used.

Claims (31)

1. An X-ray analysis apparatus comprising:

a radiation source configured to irradiate an irradiation point on a sample with radiation;

an X-ray detector configured to detect a characteristic X-ray and a scattered X-ray emitted from the sample and output a signal including energy information about the characteristic X-ray and the scattered X-ray;

an analyzer configured to analyze the signal;

a sample stage configured to allow placement of the sample thereon;

a shifting mechanism being capable of relatively shifting the sample on the sample stage and the radiation source and the X-ray detector with respect to each other;

a height measuring mechanism being capable of measuring the height of the irradiation point on the sample; and

a controller configured to control the shifting mechanism on the basis of the measured height of the irradiation point on the sample and adjust the distance of the sample with respect to the radiation source and the X-ray detector.

2. The X-ray analysis apparatus according to claim 1 , wherein the height measuring mechanism includes a laser displacement sensor.

3. The X-ray analysis apparatus according to claim 2 , wherein the laser displacement sensor employs a triangulation-based system.

4. The X-ray analysis apparatus according to claim 2 , wherein the optical axis of the radiation irradiated from the radiation source and the optical axis of the laser displacement sensor are coaxial, and the sample is irradiated with the radiation and a laser emitted from the laser displacement sensor.

5. The X-ray analysis apparatus according to claim 1 comprising:

a sample observation system configured to observe the sample; and

a focus switching drive mechanism configured to switch the focus of the sample observation system, wherein

the focus position of the sample observation system is adjusted by controlling the focus switching drive mechanism on the basis of the height of the irradiation point on the sample measured by the height measuring mechanism.

6. The X-ray analysis apparatus according to claim 5 , wherein the optical axis of the radiation irradiated from the radiation source, the optical axis of the sample observation system having the focus switching drive mechanism, and the optical axis of a laser displacement sensor are coaxial with respect to each other, and the sample is irradiated with the radiation and a laser emitted from the laser displacement sensor.

7. The X-ray analysis apparatus according to claim 6 comprising:

a mirror configured to align the optical axis of the laser displacement sensor in coaxial with the optical axis of the radiation, and

a beam splitter configured to align the optical axis of the radiation, the optical axis of the laser displacement sensor, and the optical axis of the sample observation system in coaxial with each other.

8. The X-ray analysis apparatus according to claim 1 , wherein the height measuring mechanism is capable of measuring the height of the irradiation point on the sample in a state in which the sample is placed on the sample stage.

9. An X-ray analysis method for irradiating an irradiation point on a sample with radiation from a radiation source, detecting a characteristic X-ray and a scattered X-ray emitted from the sample by an X-ray detector, outputting a signal including energy information about the characteristic X-ray and the scattered X-ray, and analyzing the signal by an analyzer comprising:

measuring the height of the irradiation point on the sample by a height measuring mechanism; and

positioning the irradiation point by relatively shifting the sample on a sample stage, the radiation source and the X-ray detector with respect to each other by a shifting mechanism, wherein

the positioning the irradiation point includes controlling the shifting mechanism on the basis of the measured height of the irradiation point on the sample and adjusting the distance of the sample with respect to the radiation source and the X-ray detector by a controller.

10. The X-ray analysis method according to claim 9 comprising:

focusing a sample observation system on the irradiation point by a focus switching drive mechanism, wherein

the focusing on the irradiation point includes controlling the focus switching drive mechanism on the basis of the measured height of the irradiation point on the sample and adjusting the focus of the sample observation system on the sample by the controller.

11. An X-ray analysis method for irradiating an irradiation point on a sample with radiation from a radiation source, detecting a characteristic X-ray and a scattered X-ray emitted from the sample by an X-ray detector, outputting a signal including energy information about the characteristic X-ray and the scattered X-ray, and analyzing the signal by an analyzer comprising:

measuring the height of the irradiation point on the sample by a height measuring mechanism; and

conducting measurement and analysis by delivering radiation at the height of the irradiation point on the sample, wherein

the conducting measurement and analysis includes correcting parameters used in calculation according to the difference between a standard position of irradiation of the radiation and the heightwise position of the irradiation point when performing the calculation for a quantitative analysis from data obtained by the analyzer.

Assignments (4)
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072903/0543 →
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072907/0356 →
CHANGE OF NAME Recorded Sep 17, 2014
From: SII NANOTECHNOLOGY INC.
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 033764/0615 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2010
From: TAKAHARA, TOSHIYUKI
To: SII NANOTECHNOLOGY INC.
Reel/Frame 024519/0152 →