Method for testing a contact structure
View Patent ↗A method of testing a contact structure including exposing a gold layer of at least one contact structure of a support structure to a solution including glacial acetic acid and nitric acid; and determining a porosity of the gold layer of at least one contact structure after the exposing.
1. A method of testing a contact structure, the method comprising:
exposing a gold layer of at least one contact structure of a package substrate to a solution including glacial acetic acid and nitric acid; and
determining a porosity of the gold layer of at least one contact structure after the exposing.
2. The method of claim 1 further comprising:
rinsing the gold layer of the at least one contact structure after the exposing;
wherein the determining a porosity is performed after the rinsing.
3. The method of claim 2 wherein the rinsing includes rinsing with deionized water.
4. The method of claim 2 wherein the rinsing includes rinsing with a cleaning agent.
5. The method of claim 4 wherein the cleaning agent includes acetone.
6. The method of claim 1 further comprising:
after the exposing, drying the gold layer of the at least one contact structure with an inert gas, wherein the determining occurs after the drying.
7. The method of claim 1 wherein the exposing is performed for less than 30 minutes.
8. The method of claim 1 wherein each of the at least one contact structure includes a layer including nickel underneath the gold layer of the contact structure.
9. The method of claim 1 , wherein the solution includes glacial acetic acid and nitric acid in a 1:1 ratio.
10. A method of making an electronic assembly comprising:
selecting a package substrate from a plurality of package substrates for testing;
exposing a gold layer of at least one contact structure of the package substrate to a solution including glacial acetic acid and nitric acid, wherein the solution;
determining a porosity of the gold layer of at least one contact structure after the exposing;
determining to use a second support substrate of the plurality of package substrates to make an electronic assembly, wherein the determining to use is based at least on the determined porosity of the gold layer of the at least one contact structure; and
making an electronic assembly with the second package substrate.
11. The method of claim 10 wherein the making the electronic assembly includes attaching a semiconductor die to the second package substrate, wherein the attaching includes electrically coupling a conductive structure of the semiconductor die to a contact structure of the second package substrate.
12. The method of claim 10 wherein each of the at least one contact structure includes a layer including nickel underneath the gold layer of the contact structure.
13. The method of claim 10 further comprising:
rinsing the gold layer of the at least one contact structure after the exposing;
wherein the determining a porosity is performed after the rinsing.
14. The method of claim 13 wherein the rinsing includes rinsing with deionized water.
15. The method of claim 13 wherein the rinsing includes rinsing with a cleaning agent.
16. The method of claim 15 wherein the cleaning agent includes acetone.
17. The method of claim 10 further comprising:
after the exposing, drying the gold layer of the at least one contact structure with an inert gas, wherein the determining a porosity occurs after the drying.
18. The method of claim 10 wherein the exposing is performed for less than 30 minutes.
19. The method of claim 10 wherein the plurality of support structures are manufactured using the same processes.
20. The method of claim 10 , wherein the solution includes glacial acetic acid and nitric acid in a 1:1 ratio.
21. A method of testing a contact structure, the method comprising:
exposing a gold layer of at least one contact structure of a package substrate to a solution including glacial acetic acid and nitric acid, wherein the solution includes glacial acetic acid and nitric acid in a 1:1 ratio;
rinsing the gold layer of the at least one contact structure with a cleaning agent after the exposing;
drying the gold layer of the at least one contact structure with an inert gas after the rinsing; and
determining a porosity of the gold layer of at least one contact structure after the drying.
22. The method of claim 21 wherein each of the at least one contact structure includes a layer including nickel underneath the gold layer of the contact structure.