Ultrahigh density monolithic, three dimensional vertical NAND memory device

1. A monolithic three dimensional NAND string, comprising:

a semiconductor channel, at least one end portion of the semiconductor channel extending substantially perpendicular to a major surface of a substrate;

a plurality of control gate electrodes extending substantially parallel to the major surface of the substrate, wherein the plurality of control gate electrodes comprise at least a first control gate electrode located in a first device level and a second control gate electrode located in a second device level located over the major surface of the substrate and below the first device level;

an interlevel insulating layer located between the first control gate electrode and the second control gate electrode;

a blocking dielectric, the blocking dielectric comprising a plurality of blocking dielectric segments, wherein each of the plurality of blocking dielectric segments is located in contact with a respective one of the plurality of control gate electrodes;

a plurality of discrete charge storage segments, wherein each of the plurality of discrete charge storage segments is located at least partially in contact with a respective blocking dielectric segment, and wherein the plurality of discrete charge storage segments comprise at least a first discrete charge storage segment located in the first device level and a second discrete charge storage segment located in the second device level;

a tunnel dielectric located between each one of the plurality of the discrete charge storage segments and the semiconductor channel; and

at least a first conductive or semiconductor shielding wing located between the first discrete charge storage segment and the second discrete charge storage segment.

2. The monolithic three dimensional NAND string of claim 1 , wherein at least a portion of each of the plurality of blocking dielectric segments has a clam shape and each of the plurality of discrete charge storage segments is located at least partially in an opening in a respective clam-shaped blocking dielectric segment.

3. The monolithic three dimensional NAND string of claim 2 , wherein:

the first shielding wing is located in electrical contact with the first control gate electrode; and

a second conductive or semiconductor shielding wing is located in electrical contact with the second control gate electrode and extends substantially parallel to the major surface of the substrate and at least partially between the first discrete charge storage segment and the second discrete charge storage segment.

4. The monolithic three dimensional NAND string of claim 3 , wherein:

the first shielding wing and the first control gate electrode are formed in a same step such that the first shielding wing comprises a lower part of the first control gate electrode and no observable interface exists between the first shielding wing and the first control gate electrode;

the second shielding wing and the second control gate electrode are formed in a same step such that the second shielding wing comprises an upper part of the second control gate electrode and no observable interface exists between the second shielding wing and the second control gate electrode;

the first control gate electrode further comprises an upper third shielding wing such that the first control gate has a clam shape;

at least a portion of each of the plurality of blocking dielectric segments is located at least partially in an opening in a respective clam-shaped control gate electrode;

the first discrete charge storage segment is disposed at least partially between the first shielding wing and the upper third shielding wing.

5. The monolithic three dimensional NAND string of claim 3 , wherein:

a conductive or semiconductor liner is located between each of the plurality of control gate electrodes and a respective one of the plurality of blocking dielectric segments; and

the conductive or semiconductor liner has a clam shape and comprises the first shielding wing and a third shielding wing such that the first discrete charge storage segment is disposed at least partially between the first shielding wing and the third shielding wing.

6. The monolithic three dimensional NAND string of claim 2 , wherein:

each of the plurality of blocking dielectric segments comprises a clam-shaped portion of a blocking dielectric layer which extends substantially perpendicular to the major surface of the substrate; and

the tunnel dielectric has a substantially straight sidewall and a uniform thickness.

7. The monolithic three dimensional NAND string of claim 1 , wherein the plurality of discrete charge storage segments comprise a plurality of floating gates.

8. The monolithic three dimensional NAND string of claim 1 , wherein the plurality of discrete charge storage segments comprise a plurality of discrete charge storage dielectric features.

9. The monolithic three dimensional NAND string of claim 8 , wherein:

the discrete charge storage dielectric features comprise silicon nitride; and

the blocking dielectric segments and tunnel dielectric comprise silicon oxide.

10. The monolithic three dimensional NAND string of claim 1 , wherein:

the semiconductor channel has a pillar shape; and

the entire pillar-shaped semiconductor channel extends substantially perpendicular to the major surface of the substrate.

11. The monolithic three dimensional NAND string of claim 10 , further comprising one of a source or drain electrode which contacts the pillar-shaped semiconductor channel from above, and another one of a source or drain electrode which contacts the pillar-shaped semiconductor channel from below.

12. The monolithic three dimensional NAND string of claim 1 , wherein:

the semiconductor channel has U-shaped pipe shape; and

two wing portions of the U-shaped pipe shape semiconductor channel extend substantially perpendicular to the major surface of the substrate and a connecting portion of the U-shaped pipe shape semiconductor channel which connects the two wing portions extends substantially perpendicular to the major surface of the substrate.

13. The monolithic three dimensional NAND string of claim 12 , further comprising:

one of a source or drain electrode contacts the first wing portion of the semiconductor channel from above;

another one of a source or drain electrode which contacts the second wing portion of the semiconductor channel from above; and

a body contact electrode which contacts the connecting portion of the semiconductor channel from below.