IP Library Granted Patent US 8,364,867
Granted Patent B2
US 8,364,867 · App. 12/831,206 · Granted Jan 29, 2013

Systems and apparatus for main memory

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Quick Facts
Patent No.
US 8,364,867
App. No.
12/831,206
Granted
Jan 29, 2013
Kind
B2
Abstract

A computing system is disclosed that includes a memory controller in a processor socket normally reserved for a processor. A plurality of non-volatile memory modules may be plugged into memory sockets normally reserved for DRAM memory modules. The non-volatile memory modules may be accessed using a data communication protocol to access the non-volatile memory modules. The memory controller controls read and write accesses to the non-volatile memory modules. The memory sockets are coupled to the processor socket by printed circuit board traces. The data communication protocol to access the non-volatile memory modules is communicated over the printed circuit board traces and through the sockets normally used to access DRAM type memory modules.

Claims (27)

1. A system comprising:

a motherboard having processor sockets coupled to memory module sockets in one or more memory channels via printed circuit board traces, the processor sockets configured to receive a processor and the memory module sockets configured to receive a memory module;

one or more processors plugged into the processor sockets, at least one processor of the one or more processors including one or more processing cores and a first integrated memory controller,

wherein the first integrated memory controller is configured to control random read and write accesses of data to non-volatile memory in a first memory channel.

2. The system of claim 1 , wherein

the at least one processor further includes a second integrated memory controller configured to control read and write accesses of data to dynamic random access memory in a second memory channel differing from the first memory channel.

3. The system of claim 1 , further comprising:

at least one non-volatile memory module plugged into a memory module socket in a memory channel.

4. The system of claim 3 , wherein

the memory module sockets are dual in-line memory module (DIMM) sockets, and

the at least one non-volatile memory module is a non-volatile dual in-line memory module.

5. The system of claim 3 , wherein

at least one memory device of the non-volatile memory module is a NOR flash electrically erasable programmable read only memory (EEPROM) integrated circuit chip.

6. The system of claim 3 , wherein

the first integrated memory controller is a non-volatile memory controller.

7. A main memory for a computer system, the main memory comprising:

a motherboard having a plurality of memory channels, each of the plurality of memory channels having a plurality of memory module sockets to receive a plurality of memory modules, wherein

a first memory channel has a plurality of dynamic random access memory modules coupled into a first plurality of memory module sockets, and

a second memory channel has a plurality of non-volatile memory modules coupled into a second plurality of memory module sockets.

8. The main memory of claim 7 , wherein

the second memory channel further has a non-volatile memory controller that is coupled to the plurality of non-volatile memory modules, the non-volatile memory controller being configured to control random read and write accesses of data with the plurality of non-volatile memory modules in the second memory channel.

9. The main memory of claim 8 , wherein

the first memory channel further has a dynamic random access memory controller that is coupled to the plurality of dynamic random access memory modules, the dynamic random access memory controller being configured to control random read and write accesses of data with the plurality of dynamic random access memory modules in the first memory channel.

10. The main memory of claim 7 , wherein

each of the plurality of non-volatile memory modules has a randomly accessible electrically erasable programmable read only memory (EEPROM) integrated circuit chip.

11. The main memory of claim 7 , wherein

each of the plurality of non-volatile memory modules includes a plurality of buffers coupled between the memory module socket and a plurality of non-volatile memory integrated circuits.

Assignments (8)
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 053926 FRAME 0446 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058966/0321 →
SECURITY INTEREST Recorded Sep 29, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 053926/0446 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2020
From: VIRIDENT SYSTEMS, LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 053180/0472 →
CHANGE OF NAME Recorded Jan 30, 2019
From: VIRIDENT SYSTEMS, INC
To: VIRIDENT SYSTEMS, LLC
Reel/Frame 048196/0580 →