Exposure control apparatus, manufacturing method of semiconductor device, and exposure apparatus

1. An exposure control apparatus comprising:

an exposure setting unit that performs an exposure setting of setting an exposure shot as a shot that is exposed or a shot that is not exposed based on height information on a height of a substrate in the exposure shot arranged in a substrate peripheral portion; and

an exposure instructing unit that outputs an exposure instruction to the shot that is exposed and an instruction to skip an exposure to the shot that is not exposed.

2. The exposure control apparatus according to claim 1 , wherein the exposure setting unit performs the exposure setting based on a resist removing region width that is a dimension of a resist removing region, in which a resist is removed from an upper surface side of the substrate close to an edge portion of the substrate, from the edge portion, a chip size in the exposure shot, and a chip layout in the exposure shot.

3. The exposure control apparatus according to claim 2 , wherein the exposure setting unit performs the exposure setting based on an area occupying an inner side of the resist removing region in the exposure shot.

4. The exposure control apparatus according to claim 2 , wherein the exposure setting unit performs the exposure setting based on an area ratio of an area occupying an inner side of the resist removing region in the exposure shot to an area of the exposure shot or a product chip area in the exposure shot.

5. The exposure control apparatus according to claim 2 , wherein the exposure setting unit performs the exposure setting by using a difference between a first focus leveling value as the height information measured on an inner side of the resist removing region and a second focus leveling value as the height information measured inside a region in which a focus leveling control of the substrate is performed.

6. The exposure control apparatus according to claim 5 , wherein

the first focus leveling value is a focus leveling value that is measured at an outermost periphery of a region in which the resist is not removed, and

the second focus leveling value is a focus leveling value that is measured at an outermost periphery of the region in which the focus leveling control of the substrate is performed.

7. The exposure control apparatus according to claim 5 , wherein the exposure setting unit calculates a correlation between a failure rate of an effective product chip adjacent to a dummy shot that is the exposure shot in which no effective product chip is formed among the exposure shots and the difference, and performs the exposure setting based on a calculation result.

8. The exposure control apparatus according to claim 5 , wherein the first focus leveling value and the second focus leveling value are measured while moving a measurement position of the substrate alternately between a region on an inner side of the resist removing region and the region in which the focus leveling control of the substrate is performed, when measuring the height information on the substrate.

9. The exposure control apparatus according to claim 1 , wherein the exposure setting unit performs the exposure setting on a dummy shot that is the exposure shot in which no effective product chip is formed among the exposure shots.

10. The exposure control apparatus according to claim 9 , wherein the exposure setting unit performs the exposure setting based on a failure rate of the effective product chip adjacent to the dummy shot.

11. The exposure control apparatus according to claim 10 , wherein the exposure setting unit performs the exposure setting based on the failure rate induced for each process completion degree of the substrate.

12. The exposure control apparatus according to claim 1 , wherein the exposure setting unit performs the exposure setting based on a dimension of a resist removing region, in which a resist is removed from a back surface side of the substrate toward an upper surface side thereof close to an edge portion of the substrate, from the edge portion, a chip size in the exposure shot, and a chip layout in the exposure shot.

13. The exposure control apparatus according to claim 1 , wherein the exposure setting unit performs the exposure setting based on a dimension from a boundary position of a region in which a focus leveling correction is performed close to an edge portion of the substrate and a region in which the focus leveling correction is not performed to the edge portion, a chip size in the exposure shot, and a chip layout in the exposure shot.

14. A manufacturing method of a semiconductor device, comprising: with an exposure control apparatus according to claim 1 ,

performing exposure and development on a semiconductor substrate above which a resist is formed based on an instruction from the exposure control apparatus;

forming a resist pattern above the semiconductor substrate; and

processing a process target of the semiconductor substrate with the resist pattern as a mask to manufacture the semiconductor device.

15. An exposure apparatus comprising:

an exposure setting unit that performs an exposure setting of setting an exposure shot as a shot that is exposed or a shot that is not exposed based on height information on a height of a substrate in the exposure shot arranged in a substrate peripheral portion;

an exposure instructing unit that outputs an exposure instruction to the shot that is exposed and an instruction to skip an exposure to the shot that is not exposed; and

an exposing unit that performs an exposure process on the shot that is exposed based on the instruction output from the exposure instruction unit.

16. The exposure apparatus according to claim 15 , further comprising a height information calculating unit that calculates the height information for each substrate, wherein

the exposure setting unit performs the exposure setting based on the height information calculated by the height information calculating unit.

17. The exposure apparatus according to claim 16 , wherein

the height information calculating unit calculates a first focus leveling value as the height information on an inner side of a resist removing region in which a resist is removed from an upper surface side of the substrate close to an edge portion of the substrate and calculates a second focus leveling value as the height information inside a region in which a focus leveling control of the substrate is performed, and

the exposure setting unit performs the exposure setting by using a difference between the first focus leveling value and the second focus leveling value.

18. The exposure apparatus according to claim 17 , wherein the height information calculating unit calculates the first focus leveling value at an outermost periphery of a region in which the resist is not removed and calculates the second focus leveling value at an outermost periphery of the region in which the focus leveling control of the substrate is performed.

19. The exposure apparatus according to claim 17 , wherein the height information calculating unit calculates the first focus leveling value and the second focus leveling value by using a signal that is detected while moving a measurement position of the substrate alternately between a region on an inner side of the resist removing region and the region in which the focus leveling control of the substrate is performed.

20. The exposure apparatus according to claim 15 , wherein the exposure setting unit performs the exposure setting based on a resist removing region width that is a dimension of a resist removing region, in which a resist is removed from an upper surface side of the substrate close to an edge portion of the substrate, from the edge portion, a chip size in the exposure shot, and a chip layout in the exposure shot.