IP Library Granted Patent US 7,928,763
Granted Patent B2
US 7,928,763 · App. 12/836,364 · Granted Apr 19, 2011

Multi-core processing system

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Quick Facts
Patent No.
US 7,928,763
App. No.
12/836,364
Granted
Apr 19, 2011
Kind
B2
Abstract

A cell element field for data processing, having function cell means for execution of algebraic and/or logic functions and memory cell means for receiving, storing and/or outputting information is described. Function cell-memory cell combinations are formed in which a control connection leads from the function cell means to the memory cell means.

Claims (80)

1. A multi-processor chip, comprising:

a plurality of data processing cells, each adapted for sequentially executing at least one of algebraic and logic functions and having:

at least one arithmetic logic unit;

at least one data register file;

a program pointer; and

at least one instruction decoder;

a plurality of memory cells;

at least one interface unit;

at least one Memory Management Unit (MMU); and

a bus system for interconnecting the plurality of data processing cells, the plurality of memory cells, and the at least one interface unit;

wherein the bus system is adapted for programmably interconnecting at runtime at least one of data processing cells and memory cells with at least one of memory cells and one or more of the at least one interface unit.

2. The multi-processor chip according to claim 1 , wherein at least some of the memory cells are cache memories.

3. The multi-processor chip according to claim 2 , wherein at least some of the cache memories are preloadable.

4. The multi-processor chip according to claim 1 , wherein at least some of the memory cells are adapted to operate as a data stack.

5. The multi-processor chip according to claim 1 , wherein at least some of the memory cells are adapted to operate as a data heap.

6. The multi-processor chip according to claim 1 , wherein at least some of the memory cells are adapted to operate as a code memory.

7. The multi-processor chip according to claim 1 , wherein at least some of the memory cells are adapted to operate as at least two of a data stack, a data heap, and a code memory.

8. The multi-processor chip according to claim 1 , wherein at least some of the memory cells are adapted to operate as at least two of a data stack, a data heap, a code memory, and a cache.

9. The multi-processor chip according to claim 1 , wherein at least some of the memory cells are adapted to operate as a data stack, a data heap, and a code memory.

10. The multi-processor chip according to claim 1 , wherein the data processing cells are adapted to connect simultaneously to a plurality of at least one of cells and units of at least one of the memory cells, the data processing cells, and the at least one interface units.

11. The multi-processor chip according to claim 1 , wherein cells of the data processing cells are adapted to connect simultaneously to other cells of the data processing cells and to a plurality of at least one of cells and units of at least one of the memory cells, the data processing cells, and the at least one interface units.

12. The multi-processor chip according to claim 1 , wherein the bus system is adapted to interconnect a data processing cell simultaneously to a plurality of at least one of cells and units of at least one of the memory cells, others of the data processing cells, and the at least one interface units.

13. The multi-processor chip according to claim 1 , wherein the bus system is adapted to interconnect a plurality of data processing cells simultaneously to a plurality of at least one of cells and units of at least one of the memory cells and the interface units.

14. The multi-processor chip according to claim 1 , wherein the data processing cells are adapted to access a plurality of the memory cells.

15. The multi-processor chip according to claim 1 , wherein the data processing cells are adapted to address a plurality of the memory cells.

16. The multi-processor chip according to claim 1 , wherein the data processing cells are adapted to transfer commands to the memory cells.

17. The multi-processor chip according to claim 1 , wherein the data processing cells are adapted to transfer commands to the at least one interface unit.

18. The multi-processor chip according to claim 1 , wherein the data processing cells are adapted to transfer commands to memory cells and interface units.

19. The multi-processor chip according to claim 1 , wherein at least one of the memory cells is adapted to store data in a non-volatile manner.

20. The multi-processor chip according to claim 1 , wherein the multi-processor chip is adapted for video-processing.

21. The multi-processor chip according to claim 1 , wherein at least some of at least one of the data processing cells, the memory cells, and the at least one interface unit operate at different clock rates for lowering power consumption.

22. The multi-processor chip according to claim 1 , wherein the at least one MMU is implemented in the at least one interface unit.

23. The multi-processor chip according to claim 1 , wherein at least one of the at least one interface unit has an implemented one of the at least one MMU.

24. The multi-processor chip according to claim 1 , wherein the processing cells are connected to those of the memory cells that are in close proximity to the processing cells.

25. The multi-processor chip according to claim 1 , wherein the processing cells are connected to the memory cells such that there is minimal latency times for data access.

26. The multi-processor chip according to claim 1 , wherein data transmission between processing cells and memory cells is optimized for low latency times.

27. The multi-processor chip according to claim 1 , wherein the processing cells access the memory cells in a manner that minimizes latency times for data access.

28. The multi-processor chip according to claim 1 , wherein the processing cells are arranged with the memory cells in a manner that minimizes latency times for data access.

29. The multi-processor chip according to claim 1 , wherein the processing cells connect to memory cells such that latency times for data access are minimized.

30. The multi-processor chip according to claim 1 , wherein data is transmitted in a pipelined manner between the processing cells and the memory cells.

31. A multi-processor chip, comprising:

a plurality of data processing cells, each adapted for sequentially executing at least one of algebraic and logic functions and having:

at least one arithmetic logic unit;

at least one data register file;

a program pointer; and

at least one instruction decoder;

a plurality of memory cells;

at least one interface unit;

at least one Memory Management Unit (MMU); and

a bus system for interconnecting the plurality of data processing cells, the plurality of memory cells, and the at least one interface unit;

wherein the bus system is adapted for dynamically interconnecting at runtime at least one of data processing cells and memory cells with at least one of memory cells and one or more of the at least one interface unit.

32. The multi-processor chip according to claim 31 , wherein at least some of the memory cells are cache memories.

33. The multi-processor chip according to claim 32 , wherein at least some of the cache memories are preloadable.

34. The multi-processor chip according to claim 31 , wherein at least some of the memory cells are adapted to operate as a data stack.

35. The multi-processor chip according to claim 31 , wherein at least some of the memory cells are adapted to operate as a data heap.

36. The multi-processor chip according to claim 31 , wherein at least some of the memory cells are adapted to operate as a code memory.

37. The multi-processor chip according to claim 31 , wherein at least some of the memory cells are adapted to operate as at least two of a data stack, a data heap, and a code memory.

38. The multi-processor chip according to claim 31 , wherein at least some of the memory cells are adapted to operate as at least two of a data stack, a data heap, and a code memory.

39. The multi-processor chip according to claim 31 , wherein at least some of the memory cells are adapted to operate as a data stack, a data heap, and a code memory.

40. The multi-processor chip according to claim 31 , wherein the data processing cells are adapted to connect simultaneously to a plurality of at least one of cells and units of at least one of the memory cells, the data processing cells, and the at least one interface units.

41. The multi-processor chip according to claim 31 , wherein cells of the data processing cells are adapted to connect simultaneously to other cells of the data processing cells and to a plurality of at least one of cells and units of at least one of the memory cells, the data processing cells, and the at least one interface units.

42. The multi-processor chip according to claim 31 , wherein the bus system is adapted to interconnect a data processing cell simultaneously to a plurality of at least one of cells and units of at least one of the memory cells, others of the data processing cells, and the at least one interface units.

43. The multi-processor chip according to claim 31 , wherein the bus system is adapted to interconnect a plurality of data processing cells simultaneously to a plurality of at least one of cells and units of at least one of the memory cells and the interface units.

44. The multi-processor chip according to claim 31 , wherein the data processing cells are adapted to access a plurality of the memory cells.

45. The multi-processor chip according to claim 31 , wherein the data processing cells are adapted to address a plurality of the memory cells.

46. The multi-processor chip according to claim 31 , wherein the data processing cells are adapted to transfer commands to the memory cells.

47. The multi-processor chip according to claim 31 , wherein the data processing cells are adapted to transfer commands to the at least one interface unit.

48. The multi-processor chip according to claim 31 , wherein the data processing cells are adapted to transfer commands to memory cells and interface units.

49. The multi-processor chip according to claim 31 , wherein at least one of the memory cells is adapted to store data in a non-volatile manner.

50. The multi-processor chip according to claim 31 , wherein the multi- processor chip is adapted for video-processing.

51. The multi-processor chip according to claim 31 , wherein at least some of at least one of the data processing cells, the memory cells, and the at least one interface unit operate at different clock rates for lowering power consumption.

52. The multi-processor chip according to claim 31 , wherein the at least one MMU is implemented in the at least one interface unit.

53. The multi-processor chip according to claim 31 , wherein at least one of the at least one interface unit has an implemented one of the at least one MMU.

54. The multi-processor chip according to claim 31 , wherein the processing cells are connected to those of the memory cells that are in close proximity to the processing cells.

55. The multi-processor chip according to claim 31 , wherein the processing cells are connected to the memory cells such that there is minimal latency times for data access.

56. The multi-processor chip according to claim 31 , wherein data transmission between processing cells and memory cells is optimized for low latency times.

57. The multi-processor chip according to claim 31 , wherein the processing cells access the memory cells in a manner that minimizes latency times for data access.

58. The multi-processor chip according to claim 31 , wherein the processing cells are arranged with the memory cells in a manner that minimizes latency times for data access.

59. The multi-processor chip according to claim 31 , wherein the processing cells connect to memory cells such that latency times for data access are minimized.

60. The multi-processor chip according to claim 31 , wherein data is transmitted in a pipelined manner between the processing cells and the memory cells.

Assignments (3)
CHANGE OF NAME Recorded Apr 22, 2020
From: SCIENTIA SOL MENTIS AG
To: PACT XPP SCHWEIZ AG
Reel/Frame 052468/0728 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2018
From: PACT XPP TECHNOLOGIES AG
To: SCIENTIA SOL MENTIS AG
Reel/Frame 045532/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2014
From: RICHTER, THOMAS; KRASS, MAREN
To: PACT XPP TECHNOLOGIES AG
Reel/Frame 032225/0089 →