IP Library Granted Patent US 8,330,526
Granted Patent B2
US 8,330,526 · App. 12/836,997 · Granted Dec 11, 2012

Low voltage detector

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Quick Facts
Patent No.
US 8,330,526
App. No.
12/836,997
Granted
Dec 11, 2012
Kind
B2
Abstract

A low voltage detector ( 100 ) includes a voltage and current reference circuit ( 102 ); a power supply voltage monitor circuit ( 104 ), coupled to the voltage and current reference circuit and to a power supply; and a voltage comparator ( 106 ), coupled to the voltage and current reference circuit and to the power supply voltage monitor circuit. The voltage and current reference circuit includes a self-cascode MOSFET structure (SCM) ( 110 ) that produces a reference voltage. The power supply voltage monitoring circuit includes another SCM ( 140 ) that produces a monitor voltage, related to the power supply voltage. The reference voltage and the monitor voltage have a same behavior with changes in temperature, thereby allowing the trip point of the low voltage detector to minimally vary with temperature. The low voltage detector is disposed on an integrated circuit ( 101 ), and the transistors of the low voltage detector consist of only CMOS transistors.

Claims (34)

1. A low voltage detector, of comprising:

a voltage and current reference circuit for producing a reference voltage V REF , wherein the voltage and current reference circuit includes a first self-cascode MOSFET structure (SCM), and wherein the first SCM produces V REF ;

a power supply voltage monitor circuit, coupled to the voltage and current reference circuit and to a terminal voltage, for monitoring voltage of the terminal voltage and for producing a voltage V MON related to the voltage of the terminal voltage; and

a voltage comparator, coupled to the voltage and current reference circuit and to the power supply voltage monitor circuit, for outputting a signal in response to a differential between V REF and V MON , wherein the low voltage detector has a trip point, and wherein V REF and V MON have a same behavior with respect to temperature, thereby reducing variation in the trip point with changes in temperature,

wherein the power supply voltage monitor circuit includes a second self-cascode MOSFET structure (SCM), wherein the second SCM produces V MON , and wherein V MON defines the trip point of the low voltage detector.

2. The low voltage detector of claim 1 , in which the first SCM operates in moderate to strong inversion mode.

3. The low voltage detector of claim 1 , in which V REF exhibits complementary to absolute temperature (CTAT) behavior.

4. The low voltage detector of claim 1 , in which the first SCM includes a first transistor having its drain connected to its gate, and a second transistor having its drain coupled to a source of the first transistor, its gate coupled to the gate of the first transistor and its source coupled to ground potential, wherein a value of V REF is a zero-bias threshold voltage of the second transistor.

5. The low voltage detector of claim 1 , in which the first transistor of the first SCM is biased to operate in saturation region and the second transistor of the first SCM is biased to operate in triode region.

6. The low voltage detector of claim 1 , in which the second SCM operates in moderate to strong inversion mode.

7. The low voltage detector of claim 1 , in which VMON exhibits complementary to absolute temperature (CTAT) behavior.

8. The low voltage detector of claim 1 , in which the second SCM includes a first transistor having its drain connected to its gate, and a second transistor having its drain coupled to a source of the first transistor, its gate coupled to the gate of the first transistor and its source coupled to the terminal voltage, and wherein a voltage drop across the second transistor defines a value of V MON .

9. The low voltage detector of claim 8 , in which the first transistor of the second SCM is biased to operate in saturation region and the second transistor of the second SCM is biased to operate in triode region.

10. A System-on-Chip (SoC), comprising:

a microcontroller unit (MCU), disposed on a substrate of an integrated circuit, and powered by a power supply; and

a low voltage detector, disposed on the substrate of the integrated circuit, coupled to the MCU and to the power supply, the low voltage detector including:

a voltage and current reference circuit for producing a reference voltage V REF .

a power supply voltage monitor circuit, coupled to the voltage and current reference circuit, for monitoring voltage of the power supply and for producing a voltage V MON related to the voltage of the power supply, wherein the power supply voltage monitor circuit includes a self-cascode MOSFET structure (SCM), and

wherein the SCM produces V MON , and

a voltage comparator, coupled to the voltage and current reference circuit and to the power supply voltage monitor circuit, for outputting an output signal in response to a differential between V REF and V MON , wherein V REF and V MON have a same behavior with respect to temperature, wherein the low voltage detector has a trip point, and wherein the output signal changes in response to the voltage of the power supply equaling the voltage of the trip point.

11. The SoC of claim 10 , in which the SCM includes a first PMOS transistor having its drain connected to its gate, and a second PMOS transistor having its drain coupled to a source of the first PMOS transistor, its gate coupled to the gate of the first PMOS transistor and its source coupled to the terminal voltage, and wherein VMON is defined as voltage at a voltage monitor node between the source of first PMOS transistor and the drain of second PMOS transistor.

12. The SoC of claim 10 , including an adjustable current mirror circuit, coupled between the SCM and a ground potential node, for trimming a value of V MON to change the trip point.

13. The SoC of claim 12 , in which the value of V MON is trimmed by the adjustable current mirror circuit adjusting current being sunk from the voltage monitor node to the ground potential node.

14. The SoC of claim 13 , in which the adjustable current mirror circuit includes:

a trim control, coupled to the voltage monitor node of the SCM; and

a plurality of NMOS trimming transistors coupled to the trim control and to the ground potential node, wherein the value of V MON is adjusted by the trim control coupling either none, one, or more than one NMOS trimming transistors between the voltage monitor node and the ground potential node.

15. An integrated circuit, comprising:

a voltage detector, disposed on a substrate of an integrated circuit, the voltage detector comprising:

a voltage and current reference circuit for producing a reference voltage V REF , wherein the voltage and current reference circuit includes a self-cascode MOSFET structure (SCM) that produces V REF , wherein V REF exhibits complementary to absolute temperature (CTAT) behavior;

a power supply voltage monitor circuit, coupled to the voltage and current reference circuit and to a power supply, for monitoring voltage of the power supply and for producing a voltage V MON related to the voltage of the power supply, wherein the power supply voltage monitoring circuit includes another SCM that produces V MON , wherein V MON exhibits CTAT behavior; and

a voltage comparator, coupled to the voltage and current reference circuit and to the power supply voltage monitor circuit, for outputting an output signal in response to a differential between V REF and V MON , wherein the voltage detector has a trip point, and

wherein the output signal changes in response to the voltage of the power supply equaling the voltage of the trip point.

16. The integrated circuit of claim 15 , in which the SCM of the voltage and current reference circuit includes a first transistor having its drain connected to its gate, and a second transistor having its drain coupled to a source of the first transistor, its gate coupled to the gate of the first transistor and its source coupled to ground potential, wherein a value of V REF is a zero-bias threshold voltage of the second transistor.

17. The integrated circuit of claim 16 , in which the other SCM of the power supply voltage monitor circuit includes a first transistor having its drain connected to its gate, and a second transistor having its drain coupled to a source of the first transistor, its gate coupled to the gate of the first transistor and its source coupled to the terminal voltage, and wherein a voltage drop across the second transistor defines a value of V MON .

Assignments (25)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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