Spectrum based endpointing for chemical mechanical polishing

1. A computer implemented method comprising:

selecting a reference spectrum, the reference spectrum representing a spectrum of white light reflected from a film of interest that has a thickness greater than a target thickness;

obtaining a current spectrum, the current spectrum being a spectrum of white light reflected from a film of interest that is on a substrate and that has a current thickness that is greater than the target thickness, the film of interest on the substrate being subject to a polishing step; and

determining, for the substrate, whether an endpoint of the polishing step has been achieved based on particular spectrum based endpoint determination logic, determining that the endpoint of the polishing step has been achieved being based on the current spectrum matching the reference spectrum, the reference spectrum being empirically selected for the particular spectrum based endpoint determination logic so that the target thickness is achieved when endpoint is called by determining that the current spectrum matches the reference spectrum.

2. The method of claim 1 , wherein determining whether the endpoint of the polishing step has been achieved includes:

calculating a difference between the reference spectrum and the current spectrum; and

calling the endpoint when the difference reaches a threshold value.

3. The method of claim 2 , wherein:

a current spectrum is obtained for each revolution of a platen used in the polishing step; and

determining whether the endpoint of the polishing step has been achieved includes generating a difference trace that includes multiple points, each of which represents the calculated difference between the reference spectrum and the current spectrum obtained for a revolution of the platen.

4. The method of claim 3 , further comprising:

applying a filter to smooth the difference trace.

5. The method of claim 1 , wherein:

the current spectrum and the reference spectrum each exhibits a peak-to-trough amplitude; and

the current spectrum is normalized so that the peak-to-trough amplitude of the current spectrum is the same as or similar to the peak-to-trough amplitude of the reference spectrum.

6. The method of claim 1 , further comprising applying a high-pass filter to the current spectrum to remove low frequency distortion.

7. The method of claim 1 , further comprising removing the reflections contributed by at least one medium other than the film of interest, the removing including subtracting a spectrum of light received by a monitoring system when no substrate is placed over the monitoring system from a current spectrum of the current spectra to obtain a first value, subtracting the spectrum of light received by the monitoring system when no substrate is placed over the monitoring system from a spectrum of light received by the monitoring system when a bare silicon substrate is over the monitoring system to obtain a second value and dividing the first value by the second value.

8. A computer implemented method comprising:

storing at least one normalized predetermined spectrum;

obtaining a sequence of current spectra from a substrate undergoing polishing;

normalizing each current spectrum in the sequence to generate a sequence of normalized current spectra, wherein normalizing includes causing the spectra to have a peak-to-trough value equal to a peak-to-trough amplitude of the normalized predetermined spectrum; and

determining a polishing endpoint using the at least one normalized predetermined spectrum and the normalized current spectra.