Method of manufacturing semiconductor device, substrate processing apparatus, and semiconductor device
View Patent ↗There are provided a method of manufacturing a semiconductor device, a substrate processing apparatus, and a semiconductor device. The method allows rapid formation of a conductive film, which has a low concentration of impurities permeated from a source owing to its dense structure, and a low resistivity. The method is performed by simultaneously supplying two or more kinds of sources into a processing chamber to form a film on a substrate placed in the processing chamber. The method comprises: performing a first source supply process by supplying at least one kind of source into the processing chamber at a first supply flow rate; and performing a second source supply process by supplying the at least one kind of source into the processing chamber at a second supply flow rate different from the first supply flow rate.
1. A method of manufacturing a semiconductor device by simultaneously supplying a first source gas and a second source gas into a processing chamber to form a film on a substrate, the method comprising:
(a) loading the substrate into the processing chamber; and
(b) forming the film on the substrate by simultaneously supplying the first source gas and the second source gas into the processing chamber in continuous pulses, wherein (b) comprises:
(b-1) simultaneously supplying the first source gas at a first flow rate and the second source gas into the processing chamber to cause a first gaseous reaction between the first source gas and the second source gas,
(b-2) stopping the supplying the first source gas and the second source gas, and removing remaining gases including the first source gas and the second source gas from the processing chamber after performing (b-1),
(b-3) simultaneously supplying the first source gas at a second flow rate different from the first flow rate and the second source gas into the processing chamber to cause a second gaseous reaction between the first source gas and the second source gas, and
(b-4) stopping the supplying the first source gas and the second source gas, and removing remaining gases including the first source gas and the second source gas from the processing chamber after performing (b-3),
wherein (b-1) through (b-4) are sequentially performed a plurality of times.
2. The method of claim 1 , wherein the second flow rate is lower than the first flow rate, and the second gaseous reaction is slower than the first gaseous reaction.
3. The method of claim 2 , wherein the second flow rate is lower than the first flow rate, and a flow rate of the second source gas in (b-3) is higher than that of the second source gas in (b-1).
4. The method of claim 1 , wherein a flow rate of the second source gas in (b-3) is higher than that of the second source gas in (b-1).
5. The method of claim 1 , wherein the film is one selected from a group consisting of HfO, HfON, HfSiO, HfSiON, HfAlO, HfAlON, ZrO, AlO and AlN film.
6. The method of claim 1 , wherein the first source gas includes at least one selected from a group consisting of Ti, Al, Si, Ta, Cu, Mn, Ru, W, Ge, Sb, Te, Hf and Zr.
7. The method of claim 1 , wherein the second source gas is an oxygen-containing gas or a nitrogen-containing gas.
8. The method of claim 1 , wherein the second source gas is one selected from a group consisting of N 2 , N 2 O, CH 6 N 2 , O 2 , O 3 , H 2 O, H 2 O 2 , NH 3 , and H 2 .