IP Library › Granted Patent US 8,279,606
Granted Patent B2
US 8,279,606 · App. 12/876,530 · Granted Oct 2, 2012

Processor loading system including a heat dissipater

Assignee: Dell Products L.P.
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Quick Facts
Patent No.
US 8,279,606
App. No.
12/876,530
Filed
Sep 7, 2010
Granted
Oct 2, 2012
Kind
B2
Art Unit
2835
USPC
361/709
Abstract

A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member and includes a pair of opposing side edges that define a width of the loading member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts. The loading member is operable to be secured to the board by moving the loading member adjacent the second base member, moving the first securing member into engagement with the second base member and a top surface of the loading member that extends between the side edges, and moving the second securing member into engagement with the first base member and the top surface of the loading member that extends between the side surfaces.

Claims (44)

1. A component loading system, comprising:

a board comprising a socket;

a first base member secured to the board through a plurality of first heat dissipater coupling posts, wherein a first securing member is moveably coupled to the first base member;

a second base member secured to the board through a plurality of second heat dissipater coupling posts, wherein a second securing member is moveably coupled to the second base member;

a loading member that is moveably coupled to the first base member and includes a pair of opposing side edges that define a width of the loading member; and

a heat dissipater that is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts;

wherein the loading member is operable to be secured to the board by moving the loading member adjacent the second base member, moving the first securing member into engagement with the second base member and a top surface of the loading member that extends between the side edges, and moving the second securing member into engagement with the first base member and the top surface of the loading member that extends between the side surfaces.

2. The system of claim 1 , further comprising:

a secondary securing member extending from each of a pair of opposing edges of the loading member.

3. The system of claim 2 , wherein the first securing member includes a primary securing portion that is operable to engage the top surface of the loading member and a secondary securing portion that is operable to engage a first of the secondary securing members, and wherein the second securing member includes a primary securing portion that is operable to engage the top surface of the loading member and a secondary securing portion that is operable to engage a second of the secondary securing members.

4. The system of claim 1 , further comprising:

a heat producing component coupled to the socket, wherein the loading member is operable to apply a force to the heat producing component sufficient to mate the heat producing component with the socket when the heat producing component is positioned on the socket and the loading member is secured to the board.

5. The system of claim 1 , wherein engagement of the first securing member with the top surface of the loading member results in a first load on the loading member, and wherein engagement of the second securing member with the top surface of the loading member results in a second load on the loading member that is approximately equal to the first load.

6. The system of claim 1 , wherein the first base member and the second base member are substantially similar in structure and dimensions.

7. The system of claim 1 , wherein the loading member is rotatably coupled to the first base member, and wherein the rotatable coupling allows the loading member to move relative to the first base member along at least one axis.

8. The system of claim 1 , wherein the entire portion of first securing member and the entire portion of second securing member that engage the top surface of the loading member are located between the pair of opposing side edges.

9. An information handling system, comprising:

a chassis housing a board that comprises a socket;

a memory coupled to the socket; and

a processor coupled to the memory through the socket, wherein the processor is mated to the socket with a processor loading system comprising:

a first base member secured to the board through a plurality of first heat dissipater coupling posts, wherein a first securing member is moveably coupled to the first base member;

a second base member secured to the board through a plurality of second heat dissipater coupling posts, wherein a second securing member is moveably coupled to the second base member;

a loading member that is moveably coupled to the first base member and includes a pair of opposing side edges that define a width of the loading member; and

a heat dissipater that is coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts such that the heat dissipater is thermally coupled to the processor;

wherein the loading member is secured to the board to mate the processor to the socket through the positioning of the loading member adjacent the second base member, engaging the first securing member with the second base member and a top surface of the loading member that extends between the side edges, and engaging the second securing member with the first base member and the top surface of the loading member that extends between the side surfaces.

10. The system of claim 9 , further comprising:

a secondary securing member extending from each of a pair of opposing edges of the loading member.

11. The system of claim 10 , wherein the first securing member includes a primary securing portion that engages the top surface of the loading member and a secondary securing portion that engages a first of the secondary securing members, and wherein the second securing member includes a primary securing portion that engages the top surface of the loading member and a secondary securing portion that engages a second of the secondary securing members.

12. The system of claim 9 , wherein engagement of the first securing member with the top surface of the loading member results in a first load on the loading member, and wherein engagement of the second securing member with the top surface of the loading member results in a second load on the loading member that is approximately equal to the first load.

13. The system of claim 9 , wherein the first base member and the second base member are substantially similar in structure and dimensions.

14. The system of claim 9 , wherein the loading member is rotatably coupled to the first base member, and wherein the rotatable coupling allows the loading member to move relative to the first base member along at least one axis.

15. The system of claim 9 , wherein the entire portion of first securing member and the entire portion of second securing member that engage the top surface of the loading member are located between the pair of opposing side edges.

16. A method for coupling a processor to a socket, comprising:

providing a board that comprises a socket and includes a first base member secured to the board through a plurality of first heat dissipater coupling posts and a second base member secured to the board through a plurality of second heat dissipater coupling posts, wherein a first securing member is moveably coupled to the first base member and a second securing member is moveably coupled to the second base member;

positioning a processor adjacent the socket;

coupling a loading member to the first base member and positioning the loading member adjacent the second base member;

mating the processor with the socket by engaging the first securing member with the second base member and a top surface of the loading member that extends between a pair of loading member side edges that define a width of the loading member, and engaging the second securing member with the first base member and the top surface of the loading member that extends between the pair of side edges; and

coupling a heat dissipater to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts such that the heat dissipater is thermally coupled to the processor.

17. The method of claim 16 , wherein coupling the loading member to the first base member comprises moveably coupling the loading member to the first base member.

18. The method of claim 16 , wherein the mating the processor with the socket further comprises:

engaging a primary securing portion of the first securing member with the top surface of the loading member and a secondary securing portion of the first securing member with a first secondary securing member that extends from the loading member; and

engaging a primary securing portion of the second securing member with the top surface of the loading member and a secondary securing portion of the second securing member with a second secondary securing member that extends from the loading member.

19. The method of claim 16 , wherein engagement of the first securing member with the top surface of the loading member results in a first load on the loading member, and wherein engagement of the second securing member with the top surface of the loading member results in a second load on the loading member that is approximately equal to the first load.

20. The method of claim 16 , wherein the entire portion of first securing member and the entire portion of second securing member that engage the top surface of the loading member are located between the pair of side edges.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040040/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0618 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLANT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0216 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031898/0001 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031899/0261 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jan 2, 2014
From: APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 031897/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2010
From: KYLE, LAWRENCE ALAN
To: DELL PRODUCTS L.P.
Reel/Frame 025240/0979 →
Continuity (2)
Continuation In Part 12775654 · May 7, 2010
Related Publication 20110273831A1 · Nov 10, 2011