IP Library Granted Patent US 8,542,275
Granted Patent B2
US 8,542,275 · App. 12/880,626 · Granted Sep 24, 2013

Method and apparatus for cross-section processing and observation

Inventors: Masahiro Kiyohara (Chiba, JP); Makoto Sato (Chiba, JP); Haruo Takahashi (Chiba, JP); Junichi Tashiro (Chiba, JP)
Assignee: SII Nanotechnology Inc.
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Quick Facts
Patent No.
US 8,542,275
App. No.
12/880,626
Granted
Sep 24, 2013
Kind
B2
Abstract

A cross-section processing and observation method includes: forming a first cross section in a sample by etching processing using a focused ion beam; obtaining image information of the first cross section by irradiating the focused ion beam to the first cross section; forming a second cross section by performing etching processing on the first cross section; obtaining image information of the second cross section by irradiating the focused ion beam to an irradiation region including the second cross section; displaying image information of a part of a display region of the irradiation region from the image information of the second cross section; displaying the image information of the first cross section by superimposing it on the image information being displayed; and moving the display region within the irradiation region. Observation images in which display regions are aligned can be obtained while reducing damage to the sample.

Claims (23)

1. A cross-section processing and observation method in a focused ion beam apparatus, the method comprising:

positioning a sample in the focused ion beam apparatus and forming a first cross section in the sample by etching processing using a focused ion beam;

obtaining an observation image of the first cross section by irradiating the first cross section with the focused ion beam;

forming a second cross section by etching the first cross section using the focused ion beam;

obtaining an observation image of the second cross section by irradiating the focused ion beam on an irradiation region including the second cross section;

displaying portional image information of a part of a display region of the irradiation region from the observation image of the second cross section;

displaying image information of the first cross section by superimposing a translucent image of the observation image of the first cross section on the portional image information; and

moving the display region within the irradiation region, and obtaining observation images of the sample without positional displacement of display regions between the observation image of the first cross section and the observation image of the second cross section.

2. The cross-section processing and observation method according to claim 1 , wherein: formation of the second cross section and obtaining of the observation image are performed repetitively.

3. The cross-section processing and observation method according to claim 1 , wherein: when the first cross section is formed, the first cross section is formed to be substantially perpendicular to an alignment direction of structures as an observation subject in the sample and substantially perpendicular to a surface of the sample.

4. A cross-section processing and observation apparatus, comprising:

a focused ion beam irradiation unit;

a sample stage on which to place a sample;

a secondary particle detection unit that detects a secondary particle generated from the sample upon exposure to an ion beam from the focused ion beam irradiation unit;

an image forming unit that forms a first observation image according to a signal from the secondary particle detection unit;

a storage unit that stores the first observation image;

a display unit that displays a part of a region of the first observation image; and

an image editing unit that displays a second observation image of a second cross section of the sample read out from the storage unit by superimposing the second observation image on a translucent image of the part of the region of the first observation image of a first cross section being displayed on the display unit and moves the part of the region,

wherein the second cross section comprises a focused ion beam-etched section of the first cross section.

5. The cross-section processing and observation apparatus according to claim 4 , further comprising:

an image processing unit that extracts a characteristic unit from each of the first observation image and the second observation image and superimposes the first observation image and the second observation image so that display positions of respective characteristic units coincide with each other.

6. The cross-section processing and observation method according to claim 1 , wherein the irradiation region of the focused ion beam is larger than a display region of the first cross section.

7. The cross-section processing and observation method according to claim 4 , wherein an irradiation region of the focused ion beam is larger than a display region of the first cross section.

Assignments (4)
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072903/0543 →
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072907/0356 →
CHANGE OF NAME Recorded Sep 17, 2014
From: SII NANOTECHNOLOGY INC.
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 033764/0615 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2010
From: KIYOHARA, MASAHIRO; SATO, MAKOTO; TAKAHASHI, HARUO; TASHIRO, JUNICHI
To: SII NANOTECHNOLOGY INC.
Reel/Frame 024977/0894 →
Priority Claims (2)
JP 2009-213597 · Sep 15, 2009 · national
JP 2010-163036 · Jul 20, 2010 · national
Continuity (1)
Related Publication 20110063431A1 · Mar 17, 2011