Advanced transistors with punch through suppression
An advanced transistor with punch through suppression includes a gate with length Lg, a well doped to have a first concentration of a dopant, and a screening region positioned under the gate and having a second concentration of dopant. The second concentration of dopant may be greater than 5×10 18 dopant atoms per cm 3 . At least one punch through suppression region is disposed under the gate between the screening region and the well. The punch through suppression region has a third concentration of a dopant intermediate between the first concentration and the second concentration of dopant. A bias voltage may be applied to the well region to adjust a threshold voltage of the transistor.
1. A field effect transistor structure having a gate dielectric under a gate with length Lg, comprising:
a substrate,
a well in the substrate doped to have a first concentration of a dopant,
an undoped channel under the gate dielectric and extending to a source and a drain,
a screening region positioned in the well and under the gate dielectric, the screening region extending to the source and drain and having a second concentration of dopant greater than 5×10 18 dopant atoms per cm 3 ,
at least one punch through suppression region having a third concentration of a dopant intermediate between the first concentration and the second concentration of dopant, with the punch through suppression region positioned in the well under the gate dielectric and beneath the screening region,
a threshold voltage set region having a fourth dopant concentration intermediate between the second concentration and 5×10 17 dopant atoms per cm 3 , with the threshold voltage set region positioned under and spaced from the gate dielectric, the threshold voltage set region extending to the source and drain.
2. The field effect transistor structure of claim 1 , wherein the screening region is positioned at a depth below the gate dielectric of between about Lg/5 and about Lg/1.
3. The field effect transistor structure of claim 1 , wherein the screening region is positioned at a depth below the gate dielectric of greater than Lg/2.
4. The field effect transistor structure of claim 1 , wherein the channel comprises an epitaxially grown layer.
5. The field effect transistor structure of claim 1 , wherein the channel is formed as a blanket epitaxial layer.
6. The field effect transistor structure of claim 1 , wherein the screening region sets a depletion depth for the field effect transistor structure.
7. The field effect transistor structure of claim 1 , wherein the threshold voltage set region is formed as an epitaxial layer.
8. The field effect transistor structure of claim 7 , further comprising a shallow trench isolation region.