Mechanical tape separation package and method
View Patent ↗A method of fabricating a plurality of electronic component packages includes coupling a tape to a panel. Electronic components are coupled to the tape and encapsulated to form a molded wafer. The molded wafer is mechanically separated from the panel without heating by breaking a mechanical separation adhesive of the tape. By mechanically separating the molded wafer from the panel without heating, warpage of the molded wafer associated with heating is avoided.
1. A method comprising:
coupling a tape to a panel, the tape comprises a mechanical separation adhesive;
coupling electronic components to the tape;
encapsulating the electronic components to form a molded wafer; and
mechanically separating the molded wafer from the panel at ambient temperature comprising breaking the mechanical separation adhesive.
2. The method of claim 1 wherein the breaking the mechanical separation adhesive comprises applying a mechanical force to the molded wafer relative to the panel.
3. The method of claim 2 wherein the mechanical force comprises a rotational force.
4. The method of claim 2 wherein the mechanical force comprises a shear force.
5. The method of claim 2 wherein the mechanical force comprises a normal force.
6. The method of claim 1 wherein the breaking the mechanical separation adhesive comprises driving a wedge into the mechanical separation adhesive.
7. The method of claim 1 wherein the breaking the mechanical separation adhesive comprises cutting the mechanical separation adhesive.
8. The method of claim 1 wherein the mechanically separating is performed at room temperature.
9. The method of claim 1 wherein the mechanically separating is performed without heating the molded wafer.
10. A method comprising:
coupling a panel permanent adhesive of a tape to a panel;
coupling electronic components to an electronic component permanent adhesive of the tape, wherein the tape further comprises a mechanical separation adhesive between the panel permanent adhesive and the electronic component permanent adhesive.
11. The method of claim 10 wherein the mechanical separation adhesive has less mechanical strength than the panel permanent adhesive and the electronic component permanent adhesive.
12. The method of claim 10 wherein the mechanical separation adhesive provides a means for mechanically separating the tape.
13. The method of claim 10 further comprising encapsulating the electronic components to form a molded wafer; and
breaking the mechanical separation adhesive at ambient temperature while leaving the electronic component permanent adhesive and the panel permanent adhesive intact.
14. The method of claim 13 wherein after the breaking, the tape comprises a first portion coupled to the molded wafer and a second portion coupled to the panel.
15. The method of claim 14 further comprising removing the first portion from the molded wafer at ambient temperature.
16. The method of claim 15 wherein the removing comprises peeling the first portion from the molded wafer.
17. A method comprising:
coupling a tape to a panel, the tape comprising:
an electronic component permanent adhesive;
a first support tape coupled to the electronic component permanent adhesive;
a mechanical separation adhesive coupled to the first support tape;
a second support tape coupled to the mechanical separation adhesive; and
a panel permanent adhesive coupled to the second support tape, wherein the mechanical separation adhesive has less mechanical strength than the panel permanent adhesive and the electronic component permanent adhesive;
coupling electronic components to the electronic component permanent adhesive;
encapsulating the electronic components to form a molded wafer; and
breaking the mechanical separation adhesive.
18. The method of claim 17 wherein the breaking the mechanical separation adhesive separates the molded wafer from the panel.
19. The method of claim 17 wherein the coupling a tape to a panel comprises coupling the panel to the panel permanent adhesive.