IP Library Granted Patent US 8,164,372
Granted Patent B2
US 8,164,372 · App. 12/923,071 · Granted Apr 24, 2012

Semiconductor device having level shift circuit, control method thereof, and data processing system

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Quick Facts
Patent No.
US 8,164,372
App. No.
12/923,071
Granted
Apr 24, 2012
Kind
B2
Abstract

To include a first level shift circuit that converts a first internal clock signal having an amplitude value of a first voltage into a second internal clock signal having an amplitude value of a second voltage, a second level shift circuit that converts a first internal data signal having the amplitude value of the first voltage into a second internal data signal having the amplitude value of the second voltage, a clock dividing circuit that generates third and fourth internal clock signals, which are complementary signals, based on the second internal clock signal, and an output circuit that outputs external data signals continuously from a data output terminal in synchronization with the third and fourth internal clock signals based on the second internal data signal. According to the present invention, because a level shift of a signal is performed before it is input to the output circuit, there occurs no skew in output data.

Claims (73)

1. A semiconductor device comprising:

a data output terminal;

a Delay Locked Loop (DLL) circuit that generates a first internal clock signal having a first voltage amplitude based on an external clock signal;

a first level shift circuit that converts the first internal clock signal into a second internal clock signal having a second voltage amplitude;

a second level shift circuit that converts first internal data signals having the first voltage amplitude into second internal data signals having the second voltage amplitude;

a clock dividing circuit that generates a plurality of select clock signals including at least a third internal clock signal and a fourth internal clock signal having the second voltage amplitude with different phases from each other based on the second internal clock signal; and

an output circuit that sequentially outputs external data signals having the second voltage amplitude from the data output terminal in synchronization with the select clock signals based on the second internal data signals.

2. The semiconductor device as claimed in claim 1 , further comprising an internal voltage generating circuit that receives an external voltage that defines the second voltage amplitude and generates an internal voltage that defines the first voltage amplitude based on the external voltage.

3. The semiconductor device as claimed in claim 2 , wherein the internal voltage is lower than the external voltage.

4. The semiconductor device as claimed in claim 1 , further comprising a plurality of data lines including at least a first data line and a second data line, wherein

the output circuit includes:

a multiplexer that selects anyone of the second internal data signals each of which is supplied through an associated one of the data lines; and

an output buffer that receives the second internal data signal selected by the multiplexer and outputs the external data signal from the data output terminal based on the second internal data signal, and

the multiplexer selects any one of the second internal data signals supplied through an associated one of the data lines in synchronization with an associated one of the select clock signals.

5. The semiconductor device as claimed in claim 4 , wherein

the third and fourth internal clock signals are complementary signals, and

the multiplexer selects the second internal data signal supplied through the first data line in synchronization with an active edge of the third internal clock signal and selects the second internal data signal supplied through the second data line in synchronization with an active edge of the fourth internal clock signal.

6. The semiconductor device as claimed in claim 4 , wherein

the DLL circuit includes:

a delay line that generates the first internal clock signal by delaying the external clock signal;

a feedback circuit that generates a feedback clock signal based on the first internal clock signal; and

an adjusting circuit that compares phases of the feedback clock signal and the external clock signal and changes a delay amount of the delay line based on a result of comparing the phases, and

the feedback circuit includes:

a replica output circuit having a substantially same delay amount as a delay amount of the output circuit;

a third level shift circuit that converts the first internal clock signal having the first voltage amplitude into the feedback clock signal having the second voltage amplitude; and

a replica clock dividing circuit having a substantially same delay amount as a delay amount of the clock dividing circuit.

7. The semiconductor device as claimed in claim 6 , wherein the replica output circuit is arranged at a subsequent stage of the third level shift circuit to which the first internal clock signal is supplied, thereby the feedback clock signal having the second voltage amplitude is supplied to the replica output circuit, and an output signal of the replica output circuit is supplied to the replica clock dividing circuit.

8. The semiconductor device as claimed in claim 6 , wherein the third level shift circuit is arranged at a subsequent stage of the replica output circuit to which the first internal clock signal is supplied, thereby the feedback clock signal having the second voltage amplitude is supplied to the replica clock dividing circuit.

9. The semiconductor device as claimed in claim 1 , wherein

a plurality of the data output terminals are provided, and

the first level shift circuit, the second level shift circuit, the clock dividing circuit, and the output circuit are provided for each of the data output terminals.

10. The semiconductor device as claimed in claim 1 , wherein

the DLL circuit includes:

a delay line that generates the first internal clock signal by delaying the external clock signal;

a feedback circuit that generates a feedback clock signal based on the first internal clock signal; and

an adjusting circuit that compares phases of the feedback clock signal and the external clock signal and changes a delay amount of the delay line based on a result of comparing the phases, and

the feedback circuit includes:

a replica output circuit having a substantially same delay amount as a delay amount of the output circuit;

a third level shift circuit that converts the first internal clock signal having the first voltage amplitude into the feedback clock signal having the second voltage amplitude; and

a replica clock dividing circuit having a substantially same delay amount as a delay amount of the clock dividing circuit.

11. The semiconductor device as claimed in claim 10 , wherein the replica output circuit is arranged at a subsequent stage of the third level shift circuit to which the first internal clock signal is supplied, thereby the feedback clock signal having the second voltage amplitude is supplied to the replica output circuit, and an output signal of the replica output circuit is supplied to the replica clock dividing circuit.

12. The semiconductor device as claimed in claim 11 , wherein

the DLL circuit includes:

a duty detection circuit that receives the feedback clock signal and detects a duty ratio of the first internal clock signal; and

a duty correcting circuit that corrects the duty ratio of the first internal clock signal based on a result of detection by the duty detecting circuit.

13. The semiconductor device as claimed in claim 12 , wherein the DLL circuit further includes a buffer circuit that is arranged between the replica clock dividing circuit and the duty detecting circuit, and converts a voltage amplitude of the feedback clock signal from the second voltage amplitude into the first voltage amplitude.

14. The semiconductor device as claimed in claim 10 , wherein the third level shift circuit is arranged at a subsequent stage of the replica output circuit to which the first internal clock signal is supplied, thereby the feedback clock signal having the second voltage amplitude is supplied to the replica clock dividing circuit.

15. The semiconductor device as claimed in claim 14 , wherein

the DLL circuit includes:

a duty detection circuit that receives the feedback clock signal and detects a duty ratio of the first internal clock signal; and

a duty correcting circuit that corrects the duty ratio of the first internal clock signal based on a result of detection by the duty detecting circuit.

16. The semiconductor device as claimed in claim 15 , wherein the DLL circuit further includes a buffer circuit that is arranged between the replica clock dividing circuit and the duty detecting circuit, and converts a voltage amplitude of the feedback clock signal from the second voltage amplitude into the first voltage amplitude.

17. The semiconductor device as claimed in claim 10 , wherein

the DLL circuit includes:

a duty detecting circuit that receives the feedback clock signal and detects a duty ratio of the first internal clock signal; and

a duty correction circuit that corrects the duty ratio of the first internal clock signal based on a result of detection by the duty detecting circuit.

18. The semiconductor device as claimed in claim 17 , wherein the DLL circuit further includes a buffer circuit that is arranged between the replica clock dividing circuit and the duty detecting circuit, and converts a voltage amplitude of the feedback clock signal from the second voltage amplitude into the first voltage amplitude.

19. A method of controlling a semiconductor device, comprising:

generating a first internal clock signal having a first voltage amplitude based on an external clock signal;

converting the first internal clock signal into a second internal clock signal having a second voltage amplitude;

converting first internal data signals having the first voltage amplitude into second internal data signals having the second voltage amplitude;

generating a plurality of select clock signals having the second voltage amplitude with different phases from each other based on the second internal clock signal; and

outputting external data signals having the second voltage amplitude sequentially from a data output terminal in synchronization with the select clock signals based on the second internal data signal.

20. A data processing system comprising:

the semiconductor device; and

a controller that supplies an external clock signal to the semiconductor device and receives external data signals from the semiconductor device, wherein

the semiconductor device comprises:

a data output terminal;

a Delay Locked Loop (DLL) circuit that generates a first internal clock signal having a first voltage amplitude based on the external clock signal;

a first level shift circuit that converts the first internal clock signal into a second internal clock signal having a second voltage amplitude;

a second level shift circuit that converts first internal data signals having the first voltage amplitude into second internal data signals having the second voltage amplitude;

a clock dividing circuit that generates a plurality of select clock signals including at least a third internal clock signal and a fourth internal clock signal having the second voltage amplitude with different phases from each other based on the second internal clock signal; and

an output circuit that sequentially outputs the external data signals having the second voltage amplitude from the data output terminal in synchronization with the select clock signals based on the second internal data signals.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2014
From: ELPIDA MEMORY, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 032645/0422 →