Method of sealing an air gap in a layer of a semiconductor structure and semiconductor structure
View Patent ↗A method of sealing an air gap in a layer of a semiconductor structure comprises providing a first layer of the semiconductor structure having at least one air gap for providing isolation between at least two conductive lines formed in the first layer. The at least one air gap extends into the first layer from a first surface of the first layer. The method further comprises forming a barrier layer of a barrier dielectric material over the first surface of the first layer and the at least one air gap. The barrier dielectric material is selected to have a dielectric constant less than 3.5 and to provide a barrier to prevent chemicals entering the at least one air gap. In another embodiment, the at least one air gap extends from a first surface of the first layer to at least a portion of side surfaces of the at least two conductive lines to expose at least a portion of the side surfaces, and a barrier layer of a barrier dielectric material is formed over the exposed portions of the side surfaces of each of the at least two conductive lines.
1. A method of sealing an air gap in a layer of a semiconductor structure, the method comprising:
providing a first layer of the semiconductor structure having at least one air gap for providing isolation between at least two conductive lines formed in the first layer, the at least one air gap extending into the first layer from a first surface of the first layer;
forming a first dielectric layer on the first surface of the first layer such that the first dielectric layer closes the at least one air gap;
forming a barrier layer of a first barrier dielectric material over the first dielectric layer by depositing conformally the barrier material over the first dielectric layer, the barrier layer having a thickness in the range of 1-10 nm and the first barrier dielectric material being selected to have a dielectric constant less than 3.5 and to provide a barrier to prevent chemicals entering the at least one air gap; and
forming, over the barrier layer, a second dielectric layer having at least one air gap for providing isolation between at least two conductive lines formed in the second dielectric layer.
2. A method of claim 1 , wherein the barrier material is a non-porous material.
3. A method of claim 1 , wherein the first barrier dielectric material is one of the following:
fluorine doped silicon dioxide;
carbon doped silicon dioxide;
organic polymeric dielectrics;
parylene;
amorphous carbon;
hydrogenated carbon (a-H:C);
fluorinated amorphous carbon (a-F:C)n.
4. A method of claim 1 , wherein the at least one air gap of the first layer extends to the at least two conductive lines to expose surfaces of the at least two conductive lines formed in the first layer, the method further comprising forming a second barrier layer of a second barrier dielectric material over the exposed surfaces of each of the at least two conductive lines.
5. A method of claim 4 , wherein the second barrier dielectric material is selected to have a dielectric constant less than 3.5 and to provide a barrier to prevent chemicals contacting the at least two conductive lines.
6. A method of claim 4 , wherein the second barrier dielectric material is a non-porous material.
7. A method of claim 4 , wherein the forming a second barrier layer comprises forming a barrier layer having a thickness in the range of 1-10 nm.
8. A method of sealing an air gap in a layer of a semiconductor structure, the method comprising:
providing a first layer of the semiconductor structure having at least one air gap for providing isolation between at least two conductive lines formed in the first layer, the at least one air gap extending into the first layer from a first surface of the first layer, and extending to the at least two conductive lines to expose surfaces of the at least two conductive lines;
forming a second barrier layer of a second barrier dielectric material over the exposed surfaces of each of the at least two conductive lines;
forming a dielectric layer on the first surface of the first layer such that the dielectric layer closes the at least one air gap, the second barrier layer between the at least two conductive lines and the dielectric layer;
forming a first barrier layer of a first barrier dielectric material over the dielectric layer by depositing conformally the first barrier material over the dielectric layer, the first barrier layer having a thickness in the range of 1-10 nm and the first barrier dielectric material being selected to have a dielectric constant less than 3.5 and to provide a barrier to prevent chemicals entering the at least one air gap; and
wherein the second barrier dielectric material is one of the following:
fluorine doped silicon dioxide;
carbon doped silicon dioxide;
organic polymeric dielectrics;
parylene;
amorphous carbon;
hydrogenated carbon (a-H:C);
fluorinated amorphous carbon (a-F:C)n.
9. A method of sealing an air gap in a layer of a semiconductor structure, the method comprising:
providing a first layer of the semiconductor structure having at least one air gap for providing isolation between at least two conductive lines formed in the first layer, the at least one air gap extending into the first layer from a first surface of the first layer, and extending to the at least two conductive lines to expose surfaces of the at least two conductive lines;
forming a second barrier layer of a second barrier dielectric material over the exposed surfaces of each of the at least two conductive lines;
forming a dielectric layer on the first surface of the first layer such that the dielectric layer closes the at least one air gap, the second barrier layer between the at least two conductive lines and the dielectric layer; and
forming a first barrier layer of a first barrier dielectric material over the dielectric layer by depositing conformally the first barrier dielectric material over the dielectric layer, the first barrier layer having a thickness in the range of 1-10 nm and the first barrier dielectric material being selected to have a dielectric constant less than 3.5 and to provide a barrier to prevent chemicals entering the at least one air gap,
wherein the first barrier dielectric material and the second barrier dielectric material are the same.
10. A method of claim 4 , wherein the providing a first layer comprises:
providing a second dielectric layer having at least two conductive lines in the first dielectric layer; and
forming the at least one air gap in the second dielectric layer extending from the first surface of the second dielectric layer into the second dielectric layer and extending to at least a portion of side surfaces of the at least two conductive lines to expose at least portions of the side surfaces, and
wherein the forming a second barrier layer comprises forming the second barrier layer on the exposed portions of the side surfaces of the at least two conductive lines through the at least one air gap.
11. A method of claim 10 , wherein the at least one air gap is defined by exposed surfaces of the second dielectric layer extending from the first surface and wherein the forming a second barrier layer further comprises forming the second barrier layer on the exposed surfaces of the first dielectric layer.
12. A method of claim 10 , wherein each of the at least two conductive lines have a top surface which is substantially in the same plane as the first surface of the second dielectric layer, wherein the forming a second barrier layer comprises forming the second barrier layer over at least a portion of the top surfaces of at least one of the at least two conductive lines.
13. A method of claim 1 , wherein the barrier dielectric material is one of the following:
fluorine doped silicon dioxide;
carbon doped silicon dioxide;
organic polymeric dielectrics;
parylene;
amorphous carbon;
hydrogenated carbon (a-H:C);
fluorinated amorphous carbon (a-F:C)n.
14. A method of claim 1 , wherein the at least one air gap extends to the at least two conductive lines to expose surfaces of the at least two conductive lines, the method further comprising forming a second barrier layer of a second barrier dielectric material over the exposed surfaces of each of the at least two conductive lines.
15. A method of claim 5 , wherein the forming a second barrier layer comprises forming a barrier layer having a thickness in the range of 1-10 nm.
16. A method of claim 1 , wherein the second barrier dielectric material is one of the following:
fluorine doped silicon dioxide;
carbon doped silicon dioxide;
organic polymeric dielectrics;
parylene;
amorphous carbon;
hydrogenated carbon (a-H:C);
fluorinated amorphous carbon (a-F:C)n.
17. A method of claim 9 , wherein the second barrier dielectric material is selected to have a dielectric constant less than 3.5 and to provide a barrier to prevent chemicals contacting the at least two conductive lines.
18. A method of claim 9 , wherein the second barrier dielectric material is a non-porous material.
19. A method of claim 9 , wherein the forming a second barrier layer comprises forming a barrier layer having a thickness in the range of 1-10 nm.
20. A method of claim 8 , wherein the second barrier dielectric material is selected to have a dielectric constant less than 3.5 and to provide a barrier to prevent chemicals contacting the at least two conductive lines.