Substrate processing method
A substrate processing method effectively suppresses non-uniformity in deposition degree on a surface of a substrate. The substrate processing method includes depositing a deposit on a sidewall of each opening of a resist pattern, which is formed on an antireflection film on an etching target film of the substrate and is provided with a plurality of openings, before etching the etching target film of the substrate. Plasma is generated in the depositing process by introducing a CHF-based gas into the processing chamber at a flow rate equal to or higher than about 1000 sccm while a pressure in the processing chamber is set to equal to or higher than about 100 mTorr.
1. A substrate processing method for performing a preset process on a substrate mounted on a lower electrode by using plasma of a gas excited by applying a high frequency power between an upper electrode and the lower electrode installed to face each other in an evacuable processing chamber, the method comprising:
depositing a deposit on a sidewall of each opening of a resist pattern, which is formed on an antireflection film on an etching target film of the substrate and is provided with a plurality of openings, before etching the etching target film of the substrate,
wherein the depositing of the deposit comprises generating plasma by introducing a CHF-based gas into the processing chamber at a flow rate equal to or higher than about 1000 sccm while a pressure in the processing chamber is set to be equal to or higher than about 100 mTorr.
2. The substrate processing method of claim 1 , wherein the CHF-based gas is a CHF 3 gas.
3. The substrate processing method of claim 2 , wherein a flow rate of the CHF 3 gas ranges from about 1500 sccm to about 3000 sccm in the depositing process.
4. The substrate processing method of claim 3 , wherein the pressure in the processing chamber is equal to or higher than about 150 mTorr in the depositing process.
5. The substrate processing method of claim 1 , wherein a residence time of the gas is equal to or less than about 0.1 second in the depositing process.
6. The substrate processing method of claim 1 , wherein a lower resist film is formed between the etching target film and the antireflection film of the substrate.