Electronic assembly having increased standoff height
View Patent ↗Various embodiments of an electronic assembly with increased standoff height are provided. In one exemplary embodiment, a substrate is provided. A metallic interconnection land is disposed over the substrate. A solder resist material is applied on a predefined portion of the metallic interconnection land. A metallic solder material is disposed over at least a portion of the solder resist material and contacts a surface of the metallic interconnection land. An air pocket is formed within the metallic solder material over at least a portion of solder resist material. The air pocket acts as a lifting mechanism to increase a standoff height between the substrate and a surface mount component.
1. An electronic assembly, comprising:
a substrate;
a metallic interconnection land disposed over the substrate;
a solder resist material applied on the metallic interconnection land;
a metallic solder material disposed over at least a portion of the solder resist material; and
a surface mount component disposed over the substrate, wherein an air pocket is formed within the metallic solder material over at least a portion of the solder resist material, the air pocket increasing a standoff height between the surface mount component and the substrate, and wherein the air pocket is formed such that a portion of the air pocket contacts the surface mount component.
2. The electronic assembly of claim 1 , wherein the metallic solder material is disposed over the at least the portion of the solder resist material such that surfaces of the metallic interconnection land and the surface mount component are contacted by the metallic solder material.
3. The electronic assembly of claim 1 , wherein the solder resist material is applied over a predefined portion of the metallic interconnection land.
4. The electronic assembly of claim 1 , wherein the metallic solder material is disposed over the at least the portion of the solder resist material such that the solder resist material is encapsulated by the metallic solder material.
5. The electronic assembly of claim 1 , wherein the predefined portion is approximately centered on the metallic interconnection land.
6. The electronic assembly of claim 1 , wherein the substrate is a printed circuit board (PCB).
7. The electronic assembly of claim 1 , wherein the metallic solder material comprises a lead-free solder material.
8. The electronic assembly of claim 7 , wherein the lead-free solder material comprises one or more of: tin-silver, tin-copper, and tin-silver-copper.
9. The electronic assembly of claim 1 , wherein the metallic solder material comprises a leaded solder material.
10. The electronic assembly of claim 1 , wherein an underfill material is located between the substrate and the surface mount component.
11. The electronic assembly of claim 1 , wherein the solder resist material is fully encapsulated within the metallic solder material.
12. The electronic assembly of claim 1 , wherein the air pocket acts as a lifting mechanism for the increasing.
13. An electronic assembly, comprising:
a substrate;
a metallic interconnection land disposed over the substrate, the metallic interconnection land having a surface;
a solder resist material applied on a predefined portion of the metallic interconnection land; and
a metallic solder material disposed over at least a portion of the solder resist material and contacting the surface of the metallic interconnection land, wherein an air pocket is formed within the metallic solder material over at least a portion of solder resist material, the air pocket increasing a standoff height of a surface mount component from the substrate, and wherein the air pocket contacts the surface mount component.
14. The electronic assembly of claim 13 , further including the surface mount component, wherein the metallic solder material is disposed over the at least the portion of the solder resist material to come into contact with the surface mount component.
15. The electronic assembly of claim 13 , wherein the air pocket is completely encapsulated by the metallic solder material and the surface mount component.
16. The electronic assembly of claim 13 , wherein the predefined portion is approximately centered on the metallic interconnection land.
17. The electronic assembly of claim 13 , wherein the substrate is a printed circuit board (PCB).
18. The electronic assembly of claim 17 , wherein the lead-free solder material comprises one or more of: tin-silver, tin-copper, and tin-silver-copper.
19. The electronic assembly of claim 13 , wherein the metallic solder material comprises a lead-free solder material.
20. The electronic assembly of claim 13 , wherein the metallic solder material comprises a leaded solder material.
21. The electronic assembly of claim 13 , wherein an underfill material is located between the substrate and the surface mount component.
22. The electronic assembly of claim 13 , wherein the solder resist material is fully encapsulated within the metallic solder material.
23. The electronic assembly of claim 13 , wherein the air pocket acts as a lifting mechanism for the increasing.