Granted Patent B2

US 8,283,780 · App. 12/954,630 · Granted Oct 9, 2012

Abstract

Claims (14)

1. A surface mount semiconductor device, comprising:

a semiconductor die having an active face presenting a die set of electrical contact elements and a further die face opposite said active face;

a molding compound encapsulating said semiconductor die, wherein said further die face is embedded in said molding compound;

an intermediate set of intermediate electrical contact elements disposed on said molding compound;

electrical connections between respective electrical contact elements of said die set and respective electrical contact elements of said intermediate set through a set of coated wires;

a layer of insulating material encapsulating said coated wires and said electrical contact elements of said die set and of said intermediate set; and

electrically conductive elements of an exposed set, which are exposed at an external surface of said layer of insulating material and which contact respective electrical contact elements of said intermediate set through said layer of insulating material, and

wherein electrically conductive elements of said exposed set contacting respective electrical contact elements of said intermediate set also contact said set of coated wires making electrical connections with said respective electrical contact elements of said intermediate set.

2. The semiconductor device of claim 1 , wherein said layer of insulating material comprises at least one layer of photoresist.

3. The semiconductor device of claim 1 , wherein said intermediate set also includes further intermediate electrical contact elements disposed on respective electrical contact elements of said die set, and wherein electrically conductive elements of said exposed set also contact said further intermediate electrical contact elements through said layer of insulating material in order to connect with said respective electrical contact elements of said die set.

4. The semiconductor device of claim 1 , wherein said intermediate set also includes further electrical contact elements disposed on respective electrical contact elements of said die set, and wherein said set of wires coated with electrical insulation make electrical connections with said respective electrical contact elements of said die set through said further intermediate electrical contact elements.

5. The semiconductor device of claim 1 , wherein said set of wires coated with electrical insulation make electrical connections directly with said respective electrical contact elements of said die set.

6. The semiconductor device of claim 1 , wherein said electrically conductive elements of said exposed set comprise electrical contact elements of solder.

7. The semiconductor device of claim 1 , wherein electrically conductive elements of said exposed set and electrical contact elements of said die set to which they are connected are disposed in arrays having different geometries.

Assignments (31)