IP Library Granted Patent US 8,907,694
Granted Patent B2
US 8,907,694 · App. 12/959,765 · Granted Dec 9, 2014

Wiring board for testing loaded printed circuit board

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Quick Facts
Patent No.
US 8,907,694
App. No.
12/959,765
Granted
Dec 9, 2014
Kind
B2
Abstract

A wiring board for transmission of test signals between test point locations on a circuit board under test and an external analyzer having compliant contacts making electrical contact with a pad positioned on a conductive surface circuit layer having a trace extending to a second pad having a hole for receipt of an interface pin electrically connected to the external analyzer.

Claims (16)

1. A loaded printed circuit board test fixture comprising:

an array of spaced interface probes extending through a probe plate and adapted for electrical connection to an external electronic test analyzer;

a plurality of test probes for contacting test point locations on a loaded printed circuit board under test;

a wiring board positioned between the probe plate and the loaded printed circuit board under test for routing test signals from the test probes to the interface probes;

the wiring board having at least one circuit layer positioned on top surface communicating with a plurality of interface pins extending through the wiring board at a first location on the wiring board and communicating with the test probes at a second location on the wiring board spaced from the first location.

2. The fixture of claim 1 , wherein the wiring board further includes a transfer board and the circuit layer is positioned on the transfer board.

3. The fixture of claim 2 , wherein there are a plurality of transfer boards each having at least one circuit layer.

4. The fixture of claim 3 , further comprising a spacer board positioned between adjacent transfer boards.

5. The fixture of claim 2 , wherein the circuit layer includes a via and a trace.

6. The wiring board of claim 2 , wherein there are a plurality of transfer boards each having at least one circuit layer.

7. The wiring board of claim 6 , further comprising a spacer board positioned between adjacent transfer boards.

8. The fixture of claim 1 , wherein the circuit layer includes a pad and a trace.

9. The fixture of claim 8 , wherein the trace contacts a via positioned in a hole in the transfer board.

10. The fixture of claim 9 , wherein each interface pin extends through a via.

11. The fixture of claim 10 , wherein the interface pin has knurled surfaces for contacting the trace.

12. The fixture of claim 9 , wherein the via has a plurality of flaps around an opening.

Assignments (9)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED AT REEL 047185, FRAME 0624 Recorded Mar 7, 2024
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS AGENT
To: XCERRA CORPORATION
Reel/Frame 066762/0811 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT STATEMENT THAT THIS DOCUMENT SERVES AS AN OATH/DECLARATION PREVIOUSLY RECORDED ON REEL 047185 FRAME 0628. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT. Recorded Nov 28, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047675/0354 →
PATENT SECURITY AGREEMENT Recorded Oct 2, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047185/0624 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 7261561 AND REPLACE WITH PATENT NUMBER 7231561 PREVIOUSLY RECORDED ON REEL 034660 FRAME 0188. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT. Recorded Feb 11, 2016
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 037824/0372 →
SECURITY AGREEMENT Recorded Dec 18, 2014
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 034660/0188 →
RELEASE OF SECURITY INTEREST IN UNITED STATES PATENTS Recorded Dec 18, 2014
From: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
To: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
Reel/Frame 034660/0394 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2014
From: DELAWARE CAPITAL FORMATION, INC.
To: LTX-CREDENCE CORPORATION
Reel/Frame 033091/0639 →
CHANGE OF NAME Recorded May 27, 2014
From: LTX-CREDENCE CORPORATION
To: XCERRA CORPORATION
Reel/Frame 033032/0768 →
SECURITY AGREEMENT Recorded Jan 17, 2014
From: LTX-CREDENCE CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 032086/0476 →