IP Library Granted Patent US 8,289,118
Granted Patent B2
US 8,289,118 · App. 12/963,462 · Granted Oct 16, 2012

Stacked inductor

Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,289,118
App. No.
12/963,462
Granted
Oct 16, 2012
Kind
B2
Abstract

A stacked inductor with combined metal layers is represented in this invention. The stacked inductor includes: a top layer metal coil, and at least two lower layer metal coils, the metal coils being aligned with each other; adjacent metal coils being connected at the corresponding ends through a via; wherein, each of the lower layer metal coils is consisted of plural layers of metal lines which are interconnected. With the same chip area, the stacked inductor of the present invention can achieve higher inductance and Q factor because of the mutual inductance generated from the plural layers of metal lines and the reduced parasitic resistance.

Claims (24)

1. A stacked inductor, comprising:

a top layer metal coil; and

at least two lower layer metal coils, all of the metal coils being aligned with each other,

wherein adjacent ones of the metal coils are connected at corresponding ends thereof through a via,

further wherein, each of the lower layer metal coils includes plural layers of metal lines which are interconnected, each of the plural layers of metal lines being formed of a solid material so as to not include any cavity,

further wherein in each of the lower layer metal coils the respective plural layers of metal lines are interconnected by slots,

further wherein the plural layers of metal lines are isolated from each other by dielectric layers, each of the slots being formed in a corresponding one of the dielectric layers,

further wherein the top layer metal coil has a first thickness and each of the metal lines has a thickness smaller than that of the first thickness further wherein the plural layers of metal lines in one of the lower layer metal coils are connected in parallel to each other.

2. The stacked inductor according to claim 1 , wherein the plural layers of metal lines in one of the lower layer metal coils have the same pattern.

3. The stacked inductor according to claim 1 , wherein the top layer metal coil and the lower layer metal coils have the same critical dimension.

4. The stacked inductor according to claim 1 , wherein the top layer metal coil and the lower layer metal coils each have one or more turns, the intervals between adjacent turns being the same.

5. The stacked inductor according to claim 1 , wherein all of the metal coils are polygonal or circular.

6. The stacked inductor according to claim 5 , wherein all of the metal coils are octagonal.

7. The stacked inductor according to claim 1 , wherein all of the metal coils are winded in the clockwise or the anticlockwise direction.

8. The stacked inductor according to claim 1 , wherein the top layer metal coil has less turns than any of the lower layer metal coils.

9. A stacked inductor, comprising:

a top layer metal coil including a single layer having a first thickness; and

at least two lower layer metal coils, all of the metal coils being aligned with each other,

wherein adjacent ones of the metal coils are connected at corresponding ends thereof through a via,

further wherein each of the lower layer metal coils includes plural layers of metal lines which are interconnected,

further wherein each of the metal lines has a thickness smaller than the first thickness further wherein the plural layers of metal lines in one of the lower layer metal coils are connected in parallel to each other.

10. The stacked inductor according to claim 9 , wherein the plural layers of metal lines in each of the lower layer metal coils are interconnected by slots.

11. The stacked inductor according to claim 10 , wherein the plural layers of metal lines are isolated from each other by dielectric layers, each of the slots being formed in a corresponding one of the dielectric layers.

12. The stacked inductor according to claim 9 , wherein the top layer metal coil has less turns than any of the lower layer metal coils.

Assignments (2)
MERGER Recorded May 13, 2014
From: SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD.
To: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 032885/0047 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2010
From: CHIU, TZUYIN; XU, XIANGMING; CAI, MIAO
To: SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD.
Reel/Frame 025468/0386 →
Priority Claims (1)
CN 2009 1 0201909 · Dec 8, 2009 · national
Continuity (1)
Related Publication 20110133879A1 · Jun 9, 2011